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Preparation method of low-fat pumpkin crisp chips

A pumpkin chip, low-fat technology, applied in the functions of food ingredients, food ingredients as antioxidants, food heat treatment, etc., can solve the problem of less patent reports on pumpkin chips, air humidity sensitivity of chips, and greater influence of nutrients. To achieve the effect of enriching the flavor of the product, improving the crispness and gloss of the taste, and improving the nutritional functionality

Active Publication Date: 2021-06-15
SHANGHAI JIAO TONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It mainly includes microwave drying process, microwave puffing method, air puffing technology, etc., but the crispy chips processed by this kind of treatment are sensitive to air humidity, and at the same time, the taste is bland, not crispy and dry, which reduces the taste. Vacuum frying technology can better improve the taste , which is beneficial to preservation, but there are relatively few patent reports on vacuum-fried pumpkin chips. At present, there is a patent report on "A Method for Making Salted Egg Yolk Flavored Pumpkin Chips"
However, the frying time of this patented technology is too long, which has a great impact on the nutritional components, and at the same time, the oil content of the chips is still high

Method used

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  • Preparation method of low-fat pumpkin crisp chips
  • Preparation method of low-fat pumpkin crisp chips
  • Preparation method of low-fat pumpkin crisp chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] This embodiment provides a production method of vacuum-fried pumpkin chips, the specific steps are:

[0042] S1. Prefabricated slices: After the pumpkin is cleaned, remove the upper and lower stalks and the bad skin, then cross-cut to remove the whiskers and seeds, and cut into U-shaped pumpkin slices with a thickness of 4mm;

[0043] S2, color-protecting blanching: put the pumpkin slices obtained in step S1 into citric acid containing 0.1% mass concentration, 0.15% vitamin C, 1.0% NaCl and 0.1% CaCl 2 Soak in the solution for 20 minutes, blanched at 85°C for 90 seconds, and cooled to room temperature;

[0044]S3, coating treatment: put the pumpkin slices obtained in step S2 in a place containing 3% white granulated sugar, 10% trehalose, 3% maltitol, 1% chitosan, 0.5% whey protein , 3% soy protein isolate and 0.5% collagen peptide coating solution for 2 hours, soaked in the coating solution and then drained for 1 hour;

[0045] S4, freeze hardening: freeze the pumpkin...

Embodiment 2

[0050] In this embodiment, on the basis of embodiment 1, the thickness of the pumpkin slices in step S1 is changed to 4.5 mm. Other conditions and steps are all the same as in Example 1.

Embodiment 3

[0061] This embodiment provides a production method of vacuum-fried pumpkin chips, the specific steps are:

[0062] S1. Prefabricated slices: After the pumpkin is cleaned, remove the upper and lower stalks and the bad skin, then cross-cut to remove the whiskers and seeds, and cut into U-shaped pumpkin slices with a thickness of 4mm;

[0063] S2, color-protecting blanching: put the pumpkin slices obtained in step S1 into citric acid containing 0.1% mass concentration, 0.15% vitamin C, 1.0% NaCl and 0.1% CaCl 2 Soak in the solution for 20 minutes, blanched at 85°C for 60 seconds, and cooled to room temperature;

[0064] S3, coating treatment: put the pumpkin slices obtained in step S2 in a place containing 3% white granulated sugar, 10% trehalose, 3% maltitol, 1% chitosan, 0.5% whey protein , 3% soy protein isolate and 0.5% collagen peptide coating solution for 2 hours, soaked in the coating solution and then drained for 1 hour;

[0065] S4, freeze hardening: freeze the pumpki...

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Abstract

The invention relates to a preparation method of low-fat pumpkin crisp chips. The preparation method comprises the following steps: slice preparation, color protecting and blanching, coating treatment, freezing and hardening, vacuum frying, deoiling treatment and the like. According to the preparation method disclosed by the invention, a formula of a color protection solution for pumpkin slices is screened and optimized, and a coating solution with good film-forming property is selected for coating treatment before vacuum frying. According to the preparation method disclosed by the invention, the vacuum frying time of the pumpkin crisp chips can be remarkably shortened, and the technical problem that the existing vacuum fried pumpkin crisp chips are relatively high in grease content is solved. The pumpkin crisp chips prepared with the method are complete in form, golden yellow in color and crisp in taste, have deep-fried flavor and pumpkin fragrance and greatly retain the original nutritional ingredients of pumpkins, production equipment is simple, cost is low, and industrial production is easy to realize.

Description

technical field [0001] The invention relates to the technical field of food processing, in particular to a preparation method of low-fat pumpkin chips. Background technique [0002] Pumpkin belongs to Cucurbita moschata Duch, and its fruit and seeds are edible. With the development of our country's social economy and the improvement of people's living standards, people pay more and more attention to health and life while pursuing a rich material life. Therefore, food nutrition and health care have become new social needs. Pumpkin pulp is rich in nutrients, containing 19 kinds of amino acids (including 8 kinds of amino acids necessary for the human body and histidine necessary for children), trigonelline, pentosan, pectin, mannitol, citrulline, soluble fiber, lutein and Phosphorus, calcium, magnesium, zinc, silicon, etc. have the functions of detoxifying, protecting the mucous membrane of the digestive tract, helping digestion, preventing arteriosclerosis and preventing diab...

Claims

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Application Information

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IPC IPC(8): A23L19/00A23L5/10A23L5/41A23L29/00A23L29/30
CPCA23L19/05A23L29/30A23L29/045A23L5/41A23L5/11A23V2002/00A23V2200/048A23V2250/032A23V2250/511A23V2250/54252A23V2250/5488A23V2250/55A23V2250/636A23V2250/6416A23V2250/708A23V2300/24A23V2200/02
Inventor 吴金鸿施依涂兰兰葛宇荣玉芝秦宇
Owner SHANGHAI JIAO TONG UNIV
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