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A kind of circuit board filming method

A technology of high temperature resistant protective film and methacrylate, applied in the field of circuit boards, can solve the problems of complex coating process, and achieve the effects of easy peeling, improved high temperature resistance and chemical resistance, and excellent adhesion

Active Publication Date: 2022-05-10
HANGZHOU ANYU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Rubber-type pressure-sensitive adhesive has better pressure-sensitive performance, but its coating process is more complicated, and it is rarely used in China.

Method used

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  • A kind of circuit board filming method
  • A kind of circuit board filming method
  • A kind of circuit board filming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of modified methacrylate polymer:

[0033] (1) Add 1 / 2 of butanone and 1 / 2 of methacrylic acid, methyl methacrylate and butyl acrylate (methacrylic acid, methacrylic acid The mass ratio of methyl ester to butyl acrylate is 2.2:3.1:4.8) mixed monomers (the mass ratio of mixed monomers to butanone is 1:1.9), stirred and heated to 85°C, adding 1 / 3 initiator (AIBN ), react and reflux for 1h; within 2.5h, add the mixed solution of the remaining 1 / 2 of the mixed monomers, 1 / 4 of butanone and 1 / 3 of the initiator into the reactor, keep the temperature constant while maintaining reflux;

[0034](2) Then add the mixed solution of 1 / 3 initiator, 1 / 4 butanone and N-(3-butenyloxy)benzamide (mass ratio to mixed monomer is 0.12:1) into the reactor In the middle, keep reflux, keep warm for 4 hours, and stop the reaction to obtain viscous modified methacrylate polymer.

[0035] A high temperature resistant protective film composition, comprising: by weight, 96 parts of mo...

Embodiment 2

[0040] The difference between the preparation of the modified methacrylate polymer and Example 1 is that the mass ratio of the mixed monomer to butanone is 1:2.23; N-(3-butenyloxy)benzamide and the mixed monomer The mass ratio of the monomer is 0.10:1; wherein, the mass ratio of methacrylic acid, methyl methacrylate and butyl acrylate in the mixed monomer is 1.9:2.1:3.8.

[0041] A high temperature resistant protective film composition, comprising: by weight, 90 parts of modified methacrylate polymer, 4 parts of curing agent N75, and 3 parts of auxiliary agent. Among them, the auxiliary agent is hydroquinone.

[0042] A method for attaching film to a circuit board is the same as that in Embodiment 1.

Embodiment 3

[0044] The difference between the preparation of the modified methacrylate polymer and Example 1 is that the mass ratio of the mixed monomer to butanone is 1:1.76; N-(3-butenyloxy)benzamide and the mixed monomer The mass ratio of monomer is 0.14:1; among them, the mass ratio of methacrylic acid, methyl methacrylate and butyl acrylate in the mixed monomer is 2.9:3.4:5.1.

[0045] A high temperature resistant protective film composition, comprising: by weight, 76 parts of modified methacrylate polymer, 3 parts of curing agent N75, and 2 parts of auxiliary agent. Wherein the auxiliary agent is hydroquinone.

[0046] A method for attaching film to a circuit board is the same as that in Embodiment 1.

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Abstract

The invention discloses a circuit board film sticking method, which relates to the technical field of circuit boards, comprising: S1: mixing a modified methacrylate polymer, a curing agent and an auxiliary agent thereof, stirring evenly, and coating the film on a thickness of 40- The surface of the 50μm PET film, after drying, is combined with the release film, and placed in an oven at 50-55°C for 2-3 days to obtain the composite film; S2: tear off the release film, and then roll-to-roll The surface of the material is bonded, the bonding temperature is 45-50 °C, and the bonding pressure is 0.1-0.2 MPa. Using the method provided by the present invention to stick a film on the circuit board, the formed protective film can protect and reinforce the circuit board, effectively prevent the phenomenon of FPC from wrinkling during processing, improve the pass rate of the product, and greatly improve the quality of the enterprise. production efficiency.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a film sticking method for circuit boards. Background technique [0002] As an electronic circuit board substrate, flexible printed circuit board (FPC) has the characteristics of lightness, thinness, shortness, small size and flexible structure. In addition to static bending, it can also be dynamically bent, curled and folded, which has significant advantages. sex. The rapid development of electronic products has led to a significant increase in the demand for FPC, and FPC has been widely used in aerospace, military, mobile communications, medical equipment and other fields. However, FPC is very soft because it is too thin (<100μm), and it is prone to wrinkles during the preparation of FPC from flexible copper clad laminate (FCCL) (even during storage and handling of FPC products), so the scrap rate of products is relatively low. High (nearly 20%). At pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25C09J7/30C09J133/08C09J11/06C08F220/18C08F220/06C08F220/14C08F216/14
CPCC09J7/255C09J7/30C09J133/064C09J11/06C08F220/1804C09J2203/326C09J2467/006C09J2433/00C08F220/06C08F220/14C08F216/1458C08K5/13C08K5/315
Inventor 凌建鸿章贤骏朱杰王伟阳
Owner HANGZHOU ANYU TECH CO LTD