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Foamy copper/epoxy resin electronic packaging material and preparation method thereof

A technology of electronic packaging materials and epoxy resin, which is applied in the field of foamed copper/epoxy resin electronic packaging materials and its preparation, can solve the problem that the high thermal conductivity of electronic packaging materials, the small increase in thermal conductivity, and the lack of electromagnetic Shielding performance and other issues, to achieve excellent electromagnetic shielding performance, improve compression strength, high strength effect

Pending Publication Date: 2021-06-25
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN 103525012 A discloses a heat-conducting and insulating packaging material, which fails to form an effective heat-conducting network, increases the thermal conductivity slightly, and does not have the performance of electromagnetic shielding
[0004] Chinese patent CN 104497491 A discloses a method for improving the thermal conductivity of epoxy resin based on nano-silicon carbide, but its thermal conductivity is only 4.1W / (m K), which not only cannot meet the high thermal conductivity requirements of current electronic packaging materials, Also does not have electromagnetic shielding performance
[0005] Chinese patent CN 109898107 B discloses a foam metal copper-doped carbon nanotube electromagnetic shielding material and its preparation method, which only has electromagnetic shielding performance and does not have thermal conductivity
[0006] Chinese patent CN 109943023 A discloses a thermally conductive electromagnetic shielding composite material and its preparation method and application. Although the prepared composite material has both thermal conductivity and electromagnetic shielding performance, its thermal conductivity is only 5.8W / (m·K ), unable to meet the current demand for high thermal conductivity of electronic packaging materials

Method used

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  • Foamy copper/epoxy resin electronic packaging material and preparation method thereof
  • Foamy copper/epoxy resin electronic packaging material and preparation method thereof
  • Foamy copper/epoxy resin electronic packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Step 1: Prepare the electroplating solution of foamed copper doped with carbon nanotubes, the electroplating solution is made of CuSO 4 ·5H 2 O, concentrated H 2 SO 4 , brightener 1-4 butynediol, surfactant polyethylene glycol and carbon nanotubes CNTs, in which CuSO 4 ·5H 2 The concentration of O is 100g / L, concentrated H 2 SO 4 The concentration of the brightener is 60g / L, the concentration of the brightener is 0.23g / L, the concentration of the surfactant is 0.7g / L, the concentration of the CNTs is 1g / L, the diameter of the carbon nanotubes is 30-80nm, and the length is less than 10μm, set the current density to 4A·dm -2 , the electroplating time is 9h, and the copper foam doped with carbon nanotubes is prepared by electrodeposition; the porosity of the copper foam doped with carbon nanotubes is 98%, and the volume fraction of carbon nanotubes in the copper foam doped with carbon nanotubes is 0.579%.

[0041]Step 2: prepare curing agent polyacrylamide and bisp...

Embodiment 2

[0045] The difference from Example 1 is that the mass ratio of SiC and epoxy resin in step 2 is 3.2:1, and the particle size of SiC is 50 μm.

[0046] Results: The thermal conductivity of the SiC-containing epoxy resin prepared in step 2 was 4.3W / (m·K), and the electromagnetic shielding performance reached 7.5dB at the electromagnetic wave frequency of 8-12GHz. The massfraction of SiC in the prepared copper foam / epoxy resin electronic packaging material is 40wt%; the thermal conductivity of the prepared foam copper / epoxy resin electronic packaging material is 47.2W / (m K), electromagnetic shielding The performance reaches 44.3dB when the electromagnetic wave frequency is 8-12GHz.

Embodiment 3

[0048] The difference from Example 1 is that the mass ratio of SiC and epoxy resin in step 2 is 3.4:1, and the particle size of SiC is 60 μm.

[0049] Results: The thermal conductivity of the SiC-containing epoxy resin prepared in step 2 is 5.6W / (m·K). The electromagnetic shielding performance reaches 8.7dB at the frequency of electromagnetic waves of 8-12GHz. The mass fraction of SiC in the prepared foamed copper / epoxy resin electronic packaging material is 50wt%; the thermal conductivity of the prepared foamed copper / epoxy resin electronic packaging material is 47.2W / (m K), electromagnetic shielding The performance reaches 49.5dB when the electromagnetic wave frequency is 8-12GHz.

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Abstract

The invention discloses a foamy copper / epoxy resin electronic packaging material and a preparation method thereof. The foamy copper / epoxy resin electronic packaging material comprises epoxy resin containing filler and foamy copper doped with carbon nanotubes, and the filler is one of SiC, AlN, BN or BeO. The preparation method comprises the following steps: diluting epoxy resin containing filler with acetone, filling the epoxy resin into carbon nanotube-doped foamy copper, concentrating and curing to obtain the foamy copper / epoxy resin electronic packaging material. The heat conductivity coefficient of the prepared foamy copper / epoxy resin electronic packaging material reaches up to 55.2 W / (m.K), the electromagnetic shielding performance reaches 57.9 dB, and the foamy copper / epoxy resin electronic packaging material is suitable for various complex and dense electronic components.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a copper foam / epoxy resin electronic packaging material and a preparation method thereof. Background technique [0002] With the miniaturization of electronic products, the emergence of new applications such as integration and functionalization, the heat generated by electronic chips in a unit area is getting higher and higher, and the requirements for electronic packaging materials are also increasing, and heat dissipation is becoming a challenge. sex issue. In addition, due to the emergence of integration, electronic components will be subject to electromagnetic interference, which reduces the reliability of their work. In order to ensure the normal operation of electronic components, electronic packaging materials are required to have high thermal conductivity and certain electromagnetic shielding performance, so as to ensure the normal operation of ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K7/24C08K3/04C08K3/34C08K3/28C08K3/22
CPCC08K7/24C08K3/041C08K3/34C08K3/28C08K3/22C08K2201/011C08K2201/005C08K2201/004C08K2003/282C08L63/00
Inventor 刘意春张旭李凤仙陶静梅李才巨易健宏
Owner KUNMING UNIV OF SCI & TECH
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