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Liquefied aromatic amine curing agent composition and preparation method thereof, epoxy resin composition and application

A technology of aromatic amine curing agent and epoxy resin, which is applied in the field of liquefied aromatic amine curing agent composition and its preparation, and epoxy resin composition, and can solve the mechanical properties of POSS such as high synthesis cost, complicated process, and epoxy resin toughness No significant improvement

Active Publication Date: 2021-07-06
WANHUA CHEM GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Patent CN 103554440A discloses a modified aromatic amine curing agent and its preparation method. Hexahydrophthalic anhydride and dicyandiamide are added to the reactor for reaction, and then the dissolved m-phenylenediamine aromatic amine and 4,4'- Diaminodiphenyl aromatic amines are dripped into the reactor for high-temperature reaction, and then add an accelerator to obtain an aromatic amine curing agent that has better compatibility with epoxy resins at a lower temperature. This method has complex processes and The liquefaction of aromatic amines is achieved without modifying the aromatic amines from the chemical structure
[0004] Patent CN104845049A discloses a phosphorus-containing flame-retardant POSS / epoxy resin hybrid material, which significantly improves the flame-retardant performance of epoxy resin products by utilizing the synergistic flame-retardant effect of phosphorus and silicon. However, the synthesis cost of POSS is relatively high, and the The mechanical properties such as epoxy resin toughness have not been significantly improved

Method used

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  • Liquefied aromatic amine curing agent composition and preparation method thereof, epoxy resin composition and application
  • Liquefied aromatic amine curing agent composition and preparation method thereof, epoxy resin composition and application
  • Liquefied aromatic amine curing agent composition and preparation method thereof, epoxy resin composition and application

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Effect test

Embodiment 1

[0041] (1) Diaminodiphenylmethane and 1,3-bis(chloromethyl)-1,1,3,3-tetramethyldisiloxane were dissolved in xylene at a molar ratio of 2:1, The amount of xylene is: 7.5 mL of xylene solvent is needed for every 1 mmol of reactant, the reaction time is 0.5 hour, and the reaction temperature is 80°C; triethylamine catalyst is used, the amount is 3mol% of diaminodiphenylmethane, and the temperature is 150°C after the reaction Atmospheric pressure distillation removes impurities such as solvents to obtain product A, which is characterized by infrared, and the results are as follows figure 1 shown; figure 1 Medium 800cm -1 and 1080cm -1 The absorption peak indicates that the silicon-oxygen bond is introduced into the A structure molecule, 1630cm -1 The absorption peak indicates the existence of Si-N-H bond, thus proving that 1,3-bis(chloromethyl)-1,1,3,3-tetramethyldisiloxane modified aromatic amine A structure curing agent was successfully prepared;

[0042] (2) Dissolve diamin...

Embodiment 2

[0045] (1) Diaminodiphenylsulfone and 1,3-bis(chloromethyl)-1,1,3,3-tetramethyldisiloxane were dissolved in tetrahydrofuran at a molar ratio of 3:1, and the amount of tetrahydrofuran For: every 1mmol reactant needs 10mL of THF solvent, the reaction time is 1 hour, using sodium carbonate catalyst, the dosage is 5mol% of diaminodiphenyl sulfone, and the reaction temperature is 60°C; after the reaction is completed, the solvent is removed by 80°C normal pressure distillation and other impurities to obtain the A product; (2) dissolving diaminodiphenyl sulfone and trichloroethyl phosphate in tetrahydrofuran according to a molar ratio of 3:1, and the amount of tetrahydrofuran is: 10 mL of tetrahydrofuran solvent is required for every 1 mmol of the reactant. The reaction time is 2 Hour, adopt sodium carbonate catalyzer, consumption is the 5mol% of diaminodiphenyl sulfone, and temperature of reaction is 40 ℃; 80 ℃ of normal pressure distillations after reaction finishes and remove impu...

Embodiment 3

[0047] (1) Dissolve m-phenylenediamine and 1,3-bis(chloromethyl)-1,1,3,3-tetramethyldisiloxane in DMF at a molar ratio of 2:1, and the amount of DMF is : 5mL of DMF solvent is required for every 1mmol of reactant, the reaction time is 1.5 hours, triethylamine catalyst is used, the dosage is 1mol% of m-phenylenediamine, and the reaction temperature is 100°C; after the reaction is completed, the solvent is distilled off at 200°C under normal pressure, etc. (2) dissolving m-phenylenediamine and trichloroethyl phosphate in DMF according to the molar ratio of 3:1, the amount of DMF is: 5mL of DMF solvent is needed for every 1mmol reactant, and the reaction time is 3 hours , adopt triethylamine catalyst, consumption is the 1mol% of m-phenylenediamine, and temperature of reaction is 80 ℃; 200 ℃ of normal pressure distillations after reaction finishes and removes impurities such as solvent, obtains B product; (3) (1) and ( 2) The medium product is mixed according to the mass ratio of ...

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Abstract

The invention discloses a liquefied aromatic amine curing agent composition and a preparation method thereof. The curing agent composition comprises a structure A which is chloromethylsiloxane modified aromatic amine and a structure B which is chlorophosphate modified aromatic amine, wherein a mass ratio of the structure A to the structure B is (0.5-1.5): 1. The epoxy resin curing agent composition prepared by the invention can be mixed with epoxy resin to prepare an epoxy resin composition, wherein the epoxy resin composition has lower viscosity and longer operation time while a cured product has higher toughness, heat resistance and flame retardance, and particularly, the low-temperature impact strength is remarkably improved.

Description

technical field [0001] The invention belongs to the field of epoxy resin curing agents, and in particular relates to a liquefied aromatic amine curing agent composition and a preparation method thereof, and also relates to an epoxy resin composition prepared by using the curing agent composition and its application. Background technique [0002] Among the many epoxy resin curing agents, aromatic amine epoxy curing agents have received extensive attention because of their high thermal denaturation temperature and excellent mechanical properties. Solid crystal with high melting point, so it is necessary to modify the existing high melting point aromatic amine curing agent to obtain a low melting point aromatic amine curing agent with good processability, so as to develop a product with good process performance and high heat resistance performance epoxy resin formulations. [0003] Patent CN 103554440A discloses a modified aromatic amine curing agent and its preparation method...

Claims

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Application Information

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IPC IPC(8): C08G59/50
CPCC08G59/504
Inventor 刘大伟张春刘赵兴孙立冬王勤隆李晶
Owner WANHUA CHEM GRP CO LTD
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