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High-heat-conductivity high-molecular polymer composite heat-conducting material and preparation method thereof

A technology of high molecular polymer and composite thermal conductive material, applied in sustainable manufacturing/processing, climate sustainability, chemical industry, etc., can solve the problem of unsatisfactory thermal conductivity of MXene, achieve simple operation, excellent thermal conductivity, easy Evenly dispersed effect

Active Publication Date: 2021-07-13
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, the application of MXene in the field of thermal conductivity is still less, because of its excellent thermal conductivity, and there are more functional groups on its surface, such as -F, -OH, -O, etc., which can have a better compatibility with the polymer matrix. Capacitive, can be used as an ideal filler for high thermal conductivity polymer composites, but the thermal conductivity of pure MXene is not ideal

Method used

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  • High-heat-conductivity high-molecular polymer composite heat-conducting material and preparation method thereof
  • High-heat-conductivity high-molecular polymer composite heat-conducting material and preparation method thereof
  • High-heat-conductivity high-molecular polymer composite heat-conducting material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Preparation of a Ag / MXene Flake Composite

[0031] S1. Weigh a certain amount of Ti 3 AlC 2 (MAX) powder, slowly added to a polytetrafluoroethylene beaker filled with 50ml HF solution with a mass fraction of 40%, heated and stirred in a water bath at 60°C for 24 hours, and centrifuged with deionized water after the etching was completed. Wash until the pH of the solution is 6, and dry the centrifuged powder at 60°C for 24 hours in vacuum to obtain multilayer Ti 3 C 2 T x (MXene) powder;

[0032] S2, take 2g multi-layer Ti 3 C 2 T xThe powder was added to 30ml dimethyl sulfoxide (DMSO) solution, stirred at room temperature for 24 hours, then repeatedly centrifuged and washed with deionized water and ethanol to remove the DMSO solvent, and a sticky precipitate was obtained, which was dispersed in deoxidized deionized water. Protected with flowing argon, ultrasonically dispersed in an ultrasonic cleaner, and the suspension after ultrasonic filtration was suction-fi...

Embodiment 2

[0035] Preparation of a Ag / MXene Flake Composite

[0036] Compared with Example 1, the difference is only that S3 is different, and the rest are the same, specifically: S3, taking a certain amount of AgNO 3 Dissolved in 50ml deionized water to prepare AgNO 3 solution, 1g Ti 3 C 2 T x The flakes were slowly added to the above AgNO 3 solution, stirred at room temperature for 3 h, then centrifuged to remove excess Ag + , and finally the washed product was dried in a vacuum oven at 60°C for 24 hours to obtain Ag / Ti with an Ag content of 0.2wt%. 3 C 2 T x Sheet composites.

Embodiment 3

[0038] Preparation of a Ag / MXene Flake Composite

[0039] Compared with Example 1, the difference is only that S3 is different, and the rest are the same, specifically: S3, taking a certain amount of AgNO 3 Dissolved in 50ml deionized water to prepare AgNO 3 solution, 1g Ti 3 C 2 T x The flakes were slowly added to the above AgNO 3 solution, stirred at room temperature for 9 h, and then centrifuged to remove excess Ag + , and finally the washed product was dried in a vacuum oven at 60°C for 24 hours to obtain Ag / Ti with an Ag content of 2.0wt%. 3 C 2 T x Sheet composites.

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Abstract

The invention discloses a high-heat-conductivity high-molecular polymer composite heat-conducting material and a preparation method thereof, and relates to the technical field of heat-conducting materials, and the high-heat-conductivity high-molecular polymer composite heat-conducting material is obtained by adding an Ag / MXene sheet composite material into a high-molecular polymer heat-conducting material matrix; the invention also discloses a preparation method of the high-heat-conductivity high-molecular polymer composite heat-conducting material, which comprises the following steps: dispersing the Ag / MXene sheet composite material into an organic solvent, then adding into a polyurethane prepolymer, and heating, stirring and dispersing in a protective atmosphere; and adding polyisocyanate and a catalyst into the reaction system, heating, stirring for reaction, removing bubbles from the mixed material, pouring into a mold, and curing, thereby obtaining the product. The Ag nano particles and the two-dimensional MXene sheet material have a synergistic effect in heat conduction performance, the Ag / MXene sheet composite material is added into a high-molecular polymer heat conduction material matrix such as polyurethane, the heat conduction performance of the material can be remarkably improved, and the material can be applied to an electronic packaging material; and the preparation method is effective, controllable, economical and environment-friendly.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a high-heat-conducting polymer composite heat-conducting material and a preparation method thereof. Background technique [0002] With the rapid development of electronic integration technology, electronic components and electronic equipment are becoming more and more small, light and thin. However, with the continuous increase of operating frequency, electronic devices will inevitably generate a large number of electrical power loss The heat makes the operating temperature of the electronic device circuit continue to rise, which leads to the failure of some temperature-sensitive components. Therefore, the development of heat dissipation materials with high thermal conductivity is an urgent problem to be solved. [0003] Traditional polymer materials have light weight, good processability, good electrical insulation performance, low cost, and can be mass-produc...

Claims

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Application Information

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IPC IPC(8): C08L75/04C08L27/16C08L63/00C08K9/02C08K3/28C08K3/14C08K3/08
CPCC08K9/02C08K3/28C08K3/14C08K3/08C08K2201/011C08K2003/0806C08L2203/206C08L75/04C08L27/16C08L63/00Y02P20/10
Inventor 蔡梦蝶陈京帅魏宇学孙松
Owner ANHUI UNIVERSITY
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