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Micro-foaming hole plugging resin for PCB as well as preparation method and application of micro-foaming hole plugging resin

A technology of micro-foaming and plugging, which is applied in the PCB field, can solve the problems of resin plugging process and resin cracks, etc., and achieve the effects of ensuring glass transition temperature, reducing curing stress, and reducing volume shrinkage

Pending Publication Date: 2021-07-23
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a PCB micro-foam plugging resin and its preparation method and application, aiming to solve the problem that resin cracks are prone to occur in the resin plugging process in the PCB manufacturing process in the prior art

Method used

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  • Micro-foaming hole plugging resin for PCB as well as preparation method and application of micro-foaming hole plugging resin
  • Micro-foaming hole plugging resin for PCB as well as preparation method and application of micro-foaming hole plugging resin
  • Micro-foaming hole plugging resin for PCB as well as preparation method and application of micro-foaming hole plugging resin

Examples

Experimental program
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Effect test

preparation example Construction

[0048] The second aspect of the embodiment of the present application provides a method for preparing PCB microfoam plugging resin, comprising the following steps:

[0049] S01. Provide various components according to PCB micro-foaming plugging resin;

[0050] S02. The epoxy resin, curing agent, inorganic filler, and auxiliary agent are subjected to a first mixing treatment to obtain a first mixture;

[0051] S03. The foaming agent and the first mixture are subjected to a second mixing treatment, and are subjected to grinding and defoaming treatment to obtain a PCB microfoam plugging resin.

[0052] The preparation method of PCB micro-foaming plugging resin provided in the second aspect of the application is simple and convenient. It only needs to simply mix the components, and perform conventional grinding and defoaming treatment to obtain PCB micro-foaming resin. The foam plug hole resin, the preparation method is simple to operate, does not require large instruments and eq...

Embodiment 1

[0077] PCB microfoam plugging resin and its preparation method and application

[0078] PCB Microfoaming Plugging Resin

[0079] Based on the total weight of PCB micro-foaming plugging resin as 100%, it includes the following components in weight percentage:

[0080]

[0081] Wherein, epoxy resin is selected from dicyclopentadiene phenol type epoxy resin;

[0082] The curing agent is selected from 1-cyanoethyl-2-ethyl-4-methylimidazole;

[0083] The inorganic filler is selected from barium sulfate;

[0084] The foaming agent is selected from N,N-dinitrosopentamethylenetetramine;

[0085] The auxiliary agent is selected from the mixture of wetting and dispersing agent and defoaming agent, the wetting and dispersing agent is selected from BYK-110 of Germany BYK, and the defoaming agent is selected from BYK-A550.

[0086] Preparation method of PCB microfoaming plugging resin

[0087] According to the PCB micro-foam plugging resin provided in Example 1, each component ...

Embodiment 2

[0095] PCB microfoam plugging resin and its preparation method and application

[0096] PCB Microfoaming Plugging Resin

[0097] Based on the total weight of PCB micro-foaming plugging resin as 100%, it includes the following components in weight percentage:

[0098]

[0099] Wherein, epoxy resin is selected from biphenyl phenol type epoxy resin;

[0100] The curing agent is selected from phthalic anhydride;

[0101] Inorganic filler is selected from talcum powder;

[0102] Foaming agent is selected from azodicarbonamide;

[0103] The auxiliary agent is selected from the mixture of wetting and dispersing agent and defoaming agent, the wetting and dispersing agent is selected from BYK-110 of Germany BYK, and the defoaming agent is selected from BYK-A515.

[0104] Preparation method of PCB microfoaming plugging resin

[0105] According to the PCB micro-foam plugging resin provided in Example 2, each component is provided;

[0106] performing the first mixing treatme...

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Abstract

The invention relates to the technical field of PCBs, and provides micro-foaming hole plugging resin for a PCB as well as a preparation method and application of the micro-foaming hole plugging resin. The micro-foaming hole plugging resin for PCB comprises the following components by weight: on the basis that the total weight of the micro-foaming hole plugging resin is 100%, 20%-40% of epoxy resin, 2%-10% of a curing agent, 40%-60% of an inorganic filler, 0.1-10% of a foaming agent and 0.1-5% of an auxiliary agent. The micro-foaming hole plugging resin for the PCB can form a micro-bubble structure, so a volume shrinkage rate and shrinkage stress generated during curing of the resin are effectively reduced; meanwhile, the original physical characteristic CTE and glass-transition temperature of a material are guaranteed, resin shrinkage is resisted in the using process, curing stress is reduced, and a crack generation proportion is reduced; and meanwhile, the dielectric constant, dielectric loss and other properties are reduced, and wide application in the field of high-frequency high-speed PCBs is facilitated.

Description

technical field [0001] The application belongs to the technical field of PCB, and in particular relates to a PCB microfoam plugging resin and its preparation method and application. Background technique [0002] At present, the base station construction and commercialization layout of the 5G communication industry are accelerating. Millimeter wave hardware (lidar, etc.) brings huge room for development. At the same time, PCB, as the mother of electronic products, develops rapidly and upgrades products simultaneously, among which communication PCB bears the brunt and becomes the most popular development direction of PCB. [0003] With the large amount of data transmission, the communication frequency of communication equipment and electronic products is getting higher and higher, and PCB is developing towards high-speed and high-density trends. These trends bring challenges and opportunities to PCB materials and PCB manufacturing processes. In terms of high-speed materials,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/30C08K3/34C08K3/36C08J9/10
CPCC08J9/107C08J9/0066C08J9/103C08J9/102C08J2203/04C08J2363/00
Inventor 崔正丹胡军辉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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