Preparation method of antenna containing LCP base material
An antenna and substrate technology, applied in the field of electronic products, can solve the problems of poor bonding force between the metal layer and the substrate, decrease in antenna efficiency, decrease in electrical performance of plastic materials, etc., achieve good dielectric constant and dielectric loss, and improve structural stability. properties, good dielectric constant
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Embodiment 1
[0043] Embodiment 1: the preparation of the antenna containing LCP substrate
[0044] A method for preparing an antenna containing an LCP substrate, comprising the following steps:
[0045] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then bake at 125°C for 20 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then perform PVD copper plating, the thickness of the copper layer is 0.1 μm, and obtain an LCP antenna with a copper layer on the surface Substrate;
[0046] (2) The making of circuit pattern: the LCP antenna substrate that the surface that step (1) is obtained has copper layer is printed out the circuit pattern of antenna with insulating varnish, then immerses in etching solution, etches ...
Embodiment 2
[0049] Embodiment 2: the preparation of the antenna containing LCP substrate
[0050] A method for preparing an antenna containing an LCP substrate, comprising the following steps:
[0051] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then baked at 135°C for 15 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then PVD copper plating layer, the thickness of the copper layer is 0.2μm, to obtain an LCP antenna with a copper layer on the surface Substrate;
[0052] (2) The making of circuit pattern: the LCP antenna base material that the surface that step (1) obtains has copper layer uses the method for laser laser (the method for laser laser is this area conventional method) copper layer is etched...
Embodiment 3
[0055] Embodiment 3: the preparation of the antenna containing LCP substrate
[0056] A method for preparing an antenna containing an LCP substrate, comprising the following steps:
[0057] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then baked at 135°C for 10 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then PVD copper plating layer, the thickness of the copper layer is 0.3μm, to obtain an LCP antenna with a copper layer on the surface Substrate;
[0058] (2) The making of circuit pattern: the LCP antenna substrate that the surface that step (1) is obtained has copper layer is printed out the circuit pattern of antenna with insulating varnish, then immerses in etching solution, etches awa...
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