Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of antenna containing LCP base material

An antenna and substrate technology, applied in the field of electronic products, can solve the problems of poor bonding force between the metal layer and the substrate, decrease in antenna efficiency, decrease in electrical performance of plastic materials, etc., achieve good dielectric constant and dielectric loss, and improve structural stability. properties, good dielectric constant

Pending Publication Date: 2021-07-30
JIANGMEN DENGZHONGTAI ENG PLASTICS CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can not be limited by the product structure, but this method also has the following disadvantages: 1. The antenna circuit pattern is made by laser etching the surface of the antenna substrate, and the production efficiency is low. The uneven rough surface will further reduce the efficiency of the fabricated antenna in terms of signal reception and transmission
2. Due to the addition of metal chelate or carbon powder and other laser-absorbing substances in the plastic material, the dielectric constant and dielectric loss of the plastic material increase, thereby reducing the electrical properties of the plastic material and causing shielding of electromagnetic signals. Antenna transmission efficiency drops
3. Metal layers such as copper and tin are deposited on the surface of the antenna circuit pattern. The bonding force between the metal layer and the substrate is poor, which makes the antenna structure unstable and affects the normal use of the antenna.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1: the preparation of the antenna containing LCP substrate

[0044] A method for preparing an antenna containing an LCP substrate, comprising the following steps:

[0045] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then bake at 125°C for 20 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then perform PVD copper plating, the thickness of the copper layer is 0.1 μm, and obtain an LCP antenna with a copper layer on the surface Substrate;

[0046] (2) The making of circuit pattern: the LCP antenna substrate that the surface that step (1) is obtained has copper layer is printed out the circuit pattern of antenna with insulating varnish, then immerses in etching solution, etches ...

Embodiment 2

[0049] Embodiment 2: the preparation of the antenna containing LCP substrate

[0050] A method for preparing an antenna containing an LCP substrate, comprising the following steps:

[0051] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then baked at 135°C for 15 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then PVD copper plating layer, the thickness of the copper layer is 0.2μm, to obtain an LCP antenna with a copper layer on the surface Substrate;

[0052] (2) The making of circuit pattern: the LCP antenna base material that the surface that step (1) obtains has copper layer uses the method for laser laser (the method for laser laser is this area conventional method) copper layer is etched...

Embodiment 3

[0055] Embodiment 3: the preparation of the antenna containing LCP substrate

[0056] A method for preparing an antenna containing an LCP substrate, comprising the following steps:

[0057] (1) Surface treatment of LCP antenna base material: The injection-molded LCP antenna base material (flat LCP antenna base material) is surface-treated with a silane coupling agent. The surface treatment process is to coat the surface of the LCP antenna base material with silane Coupling agent, then baked at 135°C for 10 minutes, so that the silane coupling agent reacts with the LCP antenna substrate, and then PVD copper plating layer, the thickness of the copper layer is 0.3μm, to obtain an LCP antenna with a copper layer on the surface Substrate;

[0058] (2) The making of circuit pattern: the LCP antenna substrate that the surface that step (1) is obtained has copper layer is printed out the circuit pattern of antenna with insulating varnish, then immerses in etching solution, etches awa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the field of electronic products, and discloses a preparation method of an antenna containing an LCP base material. The preparation method comprises the following step of performing surface treatment on the LCP antenna base material by using a coupling agent, wherein the manufactured antenna comprises an LCP antenna base material and a metal layer, the LCP antenna base material is an LCP antenna base material subjected to coupling agent surface treatment, and the metal layer is arranged on the surface of the LCP antenna base material. According to the invention, the LCP is used as the antenna base material, the metal layer is deposited after the coupling agent surface treatment, so that the binding force between the metal layer and the LCP base material is strong and can reach 10N, and the structural stability of the antenna is improved. The LCP has good dielectric constant, dielectric loss and other properties, is very beneficial to penetration of electromagnetic signals, and avoids addition of metal chelate or carbon powder and other laser absorption substances, so that the finally manufactured antenna can maintain good dielectric constant, dielectric loss and other electrical properties, the dielectric loss is lower than 0.005, and the transmission efficiency of the electromagnetic signals is high.

Description

technical field [0001] The invention belongs to the field of electronic products, in particular to a method for preparing an antenna containing an LCP substrate. Background technique [0002] Antenna is a very important component of electronic products and a functional part of electronic products for signal transmission. In electronic products such as mobile phones, due to the limitation of the structure of mobile phone products, when designing and manufacturing the antenna, the antenna cannot be made into a simple planar shape, and it needs to be made into a three-dimensional shape according to the structural space of the mobile phone product. [0003] The existing methods for making antennas in the related art mainly include LDS technology (laser direct structuring technology). In this method, additives containing metal chelates, which can be activated and reduced to metal atoms by laser, are mixed into plastic materials such as PA (nylon) and PC (polycarbonate), and then...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H05K3/06H05K3/00H05K3/18
CPCH01Q1/38H05K3/06H05K3/0026H05K3/188
Inventor 梁永华黄贤智郑红专金良文
Owner JIANGMEN DENGZHONGTAI ENG PLASTICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products