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PDMS micro-fluidic chip injection mold and manufacturing method

A technology of microfluidic chips and injection molds, which is applied in household appliances, other household appliances, household components, etc., can solve the problems of not being suitable for mass production, difficult to remove air bubbles, waste of raw materials, etc., and achieve the effect of saving PDMS consumption

Inactive Publication Date: 2021-08-06
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, some small air bubbles will remain in the fine structure of the mold surface, which is more difficult to remove when the PDMS chip is thinner
The above reasons lead to poor quality, poor uniformity, long time-consuming, waste of raw materials and other problems in the manufactured PDMS chips, which are not suitable for mass production.

Method used

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  • PDMS micro-fluidic chip injection mold and manufacturing method
  • PDMS micro-fluidic chip injection mold and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, this embodiment provides a PDMS microfluidic chip injection mold, including a rigid mold and a semi-rigid upper cover; the semi-rigid upper cover includes a semi-rigid support layer, an elastic sealing layer and an anti-adhesion from top to bottom. layer; the semi-rigid support layer or the elastic sealing layer is provided with a support micro-column array, and the gaps between the support micro-column arrays form cavities. The semi-rigid support layer is made of polycarbonate sheet. The elastic sealing layer is made of PDMS. The anti-adhesion layer is a gas-permeable nano-coating that prevents PDMS from adhering. The injection mold is provided with an air outlet connected with the cavity.

Embodiment 2

[0023] 1. Clean the silicon wafer, and make a cavity mold containing an array of supporting pillars on the silicon wafer.

[0024] 2. Mix the polydimethylsiloxane and the curing agent evenly, degas it, pour it on the cavity mold, and heat-cure to form a PDMS film with integrated cavity.

[0025] 3. The upper surface of the PDMS membrane is treated with plasma activation, spin-coated with PTFE-AF2400 solution, and cured to form an anti-adhesion nano-coating.

[0026] 4. The PDMS membrane with integrated cavity and the PC support layer are flatly bonded together to make a semi-rigid breathable upper cover.

[0027] 5. Clean the silicon wafer, and make a three-layer rigid mold with SU-8 on the silicon wafer. The total thickness of the mold is 200 microns, the 10 micron high part is used for branch pipes, and the 60 micron high part is used as chip micro-reaction unit and main channel . Rigid mold surfaces are anti-stick treated.

[0028] 6. Combine the rigid injection mold wit...

Embodiment 3

[0036] 1. Clean the silicon wafer and spin coat a thin layer of PDMS on the silicon wafer.

[0037] 2. The upper surface of the PDMS membrane is treated with plasma activation, spin-coated with PTFE-AF2400 solution, and cured to form an anti-adhesion nano-coating.

[0038] 3. Fabrication of the injection mold for the support layer to create the integrated cavity of the PC material.

[0039] 4. Use the injection mold to injection mold the support layer of the integrated cavity of PC material.

[0040] 5. Lay the PDMS membrane and the support layer of the integrated cavity of the PC material together to make a semi-rigid breathable upper cover.

[0041] 6. The metal mold is made by micro-machining technology, and the surface of the metal mold is treated with anti-adhesion treatment.

[0042] 7. Combine the rigid injection mold with the semi-rigid upper cover and fix it tightly with clamps;

[0043] 8. Inject the mixture of PDMS prepolymer and cross-linking agent through the i...

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PUM

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Abstract

The invention relates to a PDMS micro-fluidic chip injection mold and a manufacturing method. The PDMS micro-fluidic chip injection mold comprises a rigid mold and a semi-rigid upper cover. The semi-rigid upper cover comprises a supporting layer, an elastic sealing layer and an anti-adhesion layer from top to bottom. A supporting micro-column array is arranged on the supporting layer or the elastic sealing layer, and gaps in the supporting micro-column array form cavities. The PDMS chip with the precise shape and thickness can be manufactured, particularly, high-quality through hole structures can be manufactured in batches, the chip casting time is short, and the links of gas exhaust, cutting and punching in the conventional PDMS chip manufacturing process are omitted. The consumption of PDMS is reduced, almost all PDMS mixed liquid is used for casting the chip, no raw material is wasted, and the PDMS micro-fluidic chip injection mold and the manufacturing method can be used for automatic industrial manufacturing of the PDMS micro-fluidic chip.

Description

technical field [0001] The invention belongs to the field of PDMS, in particular to a PDMS microfluidic chip injection mold and a manufacturing method. Background technique [0002] Polydimethylsiloxane (PDMS) is elastic, transparent, biocompatible, low-value, and easy to fabricate, and is widely used in the processing and prototyping of microfluidic chips and flexible wearable devices. Organic polymers. The conventional production process of PDMS chips is mainly divided into the following steps: 1. Mix the PDMS prepolymer and cross-linking agent, and then remove the air bubbles in the mixture by degassing. 2. Pour the mixture on the surface of the microstructured mold and heat-cure after self-leveling by gravity. 3. Manually cut off the PDMS at the edge and punch out the inlet and outlet with a hole punch. The overall process takes a long time. In addition, due to manual operations, it is difficult to manufacture chips with precise geometric structures, and it is also di...

Claims

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Application Information

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IPC IPC(8): B29C45/26B29C33/40B29C33/42B29L31/34B29K83/00
CPCB29C45/263B29C33/40B29C33/42B29L2031/34B29K2083/00
Inventor 徐铁刚李昕欣吴蕾高式沅王雪凤
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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