PDMS micro-fluidic chip injection mold and manufacturing method
A technology of microfluidic chips and injection molds, which is applied in household appliances, other household appliances, household components, etc., can solve the problems of not being suitable for mass production, difficult to remove air bubbles, waste of raw materials, etc., and achieve the effect of saving PDMS consumption
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Embodiment 1
[0021] Such as figure 1 As shown, this embodiment provides a PDMS microfluidic chip injection mold, including a rigid mold and a semi-rigid upper cover; the semi-rigid upper cover includes a semi-rigid support layer, an elastic sealing layer and an anti-adhesion from top to bottom. layer; the semi-rigid support layer or the elastic sealing layer is provided with a support micro-column array, and the gaps between the support micro-column arrays form cavities. The semi-rigid support layer is made of polycarbonate sheet. The elastic sealing layer is made of PDMS. The anti-adhesion layer is a gas-permeable nano-coating that prevents PDMS from adhering. The injection mold is provided with an air outlet connected with the cavity.
Embodiment 2
[0023] 1. Clean the silicon wafer, and make a cavity mold containing an array of supporting pillars on the silicon wafer.
[0024] 2. Mix the polydimethylsiloxane and the curing agent evenly, degas it, pour it on the cavity mold, and heat-cure to form a PDMS film with integrated cavity.
[0025] 3. The upper surface of the PDMS membrane is treated with plasma activation, spin-coated with PTFE-AF2400 solution, and cured to form an anti-adhesion nano-coating.
[0026] 4. The PDMS membrane with integrated cavity and the PC support layer are flatly bonded together to make a semi-rigid breathable upper cover.
[0027] 5. Clean the silicon wafer, and make a three-layer rigid mold with SU-8 on the silicon wafer. The total thickness of the mold is 200 microns, the 10 micron high part is used for branch pipes, and the 60 micron high part is used as chip micro-reaction unit and main channel . Rigid mold surfaces are anti-stick treated.
[0028] 6. Combine the rigid injection mold wit...
Embodiment 3
[0036] 1. Clean the silicon wafer and spin coat a thin layer of PDMS on the silicon wafer.
[0037] 2. The upper surface of the PDMS membrane is treated with plasma activation, spin-coated with PTFE-AF2400 solution, and cured to form an anti-adhesion nano-coating.
[0038] 3. Fabrication of the injection mold for the support layer to create the integrated cavity of the PC material.
[0039] 4. Use the injection mold to injection mold the support layer of the integrated cavity of PC material.
[0040] 5. Lay the PDMS membrane and the support layer of the integrated cavity of the PC material together to make a semi-rigid breathable upper cover.
[0041] 6. The metal mold is made by micro-machining technology, and the surface of the metal mold is treated with anti-adhesion treatment.
[0042] 7. Combine the rigid injection mold with the semi-rigid upper cover and fix it tightly with clamps;
[0043] 8. Inject the mixture of PDMS prepolymer and cross-linking agent through the i...
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