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Ultraviolet curing adhesive tape for invisible cutting as well as preparation method and application of ultraviolet curing adhesive tape

A stealth cutting, ultraviolet light technology, applied in the direction of adhesive, film/sheet release coating, film/sheet release liner, etc., can solve the problems of low light transmission filter, high reflectivity, damage to laser equipment, etc. The effect of high initial adhesion, low adhesion, good optical properties

Pending Publication Date: 2021-08-06
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a UV-curable adhesive tape for invisible cutting, a preparation method and its application, which solves the problems of low light transmission and filtration in current UV-curable adhesive tapes, which leads to low laser utilization rate, high haze, which causes laser energy to be unable to gather, and poor cutting quality. The high reflectivity leads to low laser utilization and the reflected laser will damage the laser equipment

Method used

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  • Ultraviolet curing adhesive tape for invisible cutting as well as preparation method and application of ultraviolet curing adhesive tape
  • Ultraviolet curing adhesive tape for invisible cutting as well as preparation method and application of ultraviolet curing adhesive tape
  • Ultraviolet curing adhesive tape for invisible cutting as well as preparation method and application of ultraviolet curing adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of ultraviolet curing adhesive tape for stealth cutting and its preparation method:

[0032] Substrate layer:

[0033] The substrate is made of PE with a smooth surface and a matte surface with a thickness of 80 μm. Both sides have been treated with corona. The light transmittance of the substrate in the laser band is 89%, the light reflectance is 10%, and the haze is 28%. Dilute the fluororesin with anti-reflection function (the AR110 of Daikin Fluorochemical Co., Ltd. used in the present invention) with a solvent, and then apply it on the smooth surface of the substrate layer with a coating machine according to the dry coating amount of 0.1 μm, and then use The speed of 10m / min is dried through six 3-meter ovens. The temperature of the oven is 40°C, 50°C, 60°C, 60°C, 60°C, and 50°C, and then it is wound up to form a substrate layer to be used. .

[0034] Acrylic pressure sensitive adhesive layer:

[0035] The acrylic resin is SV-8900 from Showa Denko, the fu...

Embodiment 2

[0045] A kind of ultraviolet curing adhesive tape for stealth cutting and its preparation method:

[0046] Substrate layer:

[0047] The substrate is made of PO with a smooth surface and a matte surface with a thickness of 80 μm. The two sides have been treated with corona. The light transmittance of the substrate in the laser band is 84%, the light reflectance is 13%, and the haze is 32%. The fluororesin with anti-reflection function (the AR110 of Daikin Fluorochemical Industry used in the present invention) is diluted with a solvent, and then coated on the smooth surface of the substrate layer with a coating machine according to the dry coating amount of 0.5 μm, and then The speed of 10m / min is dried through six 3-meter ovens. The temperature of the oven is 40°C, 50°C, 60°C, 60°C, 60°C, and 50°C, and then it is wound up to form a substrate layer to be used. .

[0048] Acrylic pressure sensitive adhesive layer:

[0049] The acrylic resin is LKG1715 from Fujikura Chemical C...

Embodiment 3

[0059] A kind of ultraviolet curing adhesive tape for stealth cutting and its preparation method:

[0060] Substrate layer:

[0061] The substrate is made of PET with a thickness of 100 μm on both sides of the smooth surface, and its two sides have been treated with corona. The light transmittance of the substrate in the laser band is 89%, the light reflectance is 9%, and the haze is 6%. Dilute the fluororesin with anti-reflection function (the AR110 of Daikin Fluorochemical Co., Ltd. used in the present invention) with a solvent, and then apply it on the smooth surface of the substrate layer with a coating machine according to the dry coating amount of 1 μm, and then apply it on the smooth surface of the substrate layer with a 10m The speed of / min is dried through 6 ovens with 3 meters in length. The temperature of the oven is 40°C, 50°C, 60°C, 60°C, 60°C, and 50°C, and then it is wound up to form a ready-to-use substrate layer.

[0062] Acrylic pressure sensitive adhesive ...

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Abstract

The invention provides an ultraviolet curing adhesive tape for invisible cutting and a preparation method and application thereof. The ultraviolet curing adhesive tape comprises a using layer and a protective layer, the using layer is composed of a base material layer and an acrylic acid pressure-sensitive adhesive layer, when the ultraviolet curing adhesive tape is used, the protective layer is removed, the using layer composed of the base material layer and the pressure-sensitive adhesive layer is attached to a workpiece, and the using layer has the good optical characteristic, and laser can penetrate through the adhesive tape to cut a workpiece. The obtained ultraviolet curing adhesive tape for invisible cutting has good optical performance, can ensure that laser penetrates through the adhesive tape to cut a workpiece, has high initial adhesive force, can ensure that the whole processing procedure is free of chip falling and water seepage, has very low adhesive force after ultraviolet curing, and is easy to reverse a film and take a chip.

Description

technical field [0001] The invention relates to the field of special adhesive tapes, in particular to an ultraviolet light curing adhesive tape for invisible cutting, a preparation method and an application. Background technique [0002] In recent years, with the rapid development of the electronics industry, the application of thin and small workpieces has become more and more widespread, such as optical filters for cameras, wafers, etc. In these application fields, the traditional processing method is generally mechanical knife cutting, but due to the quality of mechanical knife cutting, there are large edge cracks, low production efficiency in efficiency, high cost of consumables and effective glass. The utilization rate is low, and there are a lot of water resource pollution and waste in environmental protection. At present, it is gradually replaced by laser cutting. [0003] The traditional laser cutting process is: paste the workpiece on the UV-curable tape - put it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/25C09J7/38C09J7/40C09J7/50
CPCC09J7/243C09J7/385C09J7/40C09J7/50C09J7/25C09J7/255C09J2203/326
Inventor 江磊陈恩厚王玺王军涛汪家全闫伟胡智勇李攀刘岩岩
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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