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Printed wiring board, printed circuit board, and method of manufacturing printed wiring board

A printed circuit board and circuit technology, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of complex subtractive method and low output

Pending Publication Date: 2021-08-06
YAZAKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a subtractive method requires complex and very lengthy processes such as photolithography, etching, and chemical vapor deposition, and thus has a problem of very low yield

Method used

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  • Printed wiring board, printed circuit board, and method of manufacturing printed wiring board
  • Printed wiring board, printed circuit board, and method of manufacturing printed wiring board
  • Printed wiring board, printed circuit board, and method of manufacturing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

example

[0100] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.

[0101] [Preparation of conductive paste]

[0102] First, the electroconductive pastes of the respective examples and comparative examples were prepared by stirring the metal nanoparticles, the metal particles, the first resin, the curing agent, the second resin, and the organic solvent at the compounding ratios shown in Tables 1 to 6 using a rotation-revolution stirrer material. Materials used as raw materials of the electroconductive pastes of the respective examples and comparative examples are as follows.

[0103] (Metal Nanoparticles)

[0104] Silver nanoparticles with average particle diameters of 25nm, 30nm, 70nm, 350nm, 600nm and 700nm

[0105] (metal particles)

[0106] Silver particles having average particle diameters of 1.0 μm, 3.0 μm and 5.0 μm

[0107] (first resin)

[01...

example 2-1

[0156] The conductive paste obtained in the example 1-1 is coated on the substrate of the polyimide film by the screen printing method, to have such as image 3 The pattern shown, and calcined in a furnace above 140°C for more than 30 minutes to obtain a printed wiring board. For screen printing, use such as figure 2 Shown is a squeegee with cutouts at the corners. The length L1 of the first outer surface and the length L2 of the second outer surface forming the cut portion were 2 mm, and the inner angle formed by the first outer surface and the second outer surface was 90 degrees.

[0157] image 3 is a plan view showing printed wiring boards manufactured in Examples and Comparative Examples. Such as image 3 As shown, in Pattern 1, a conductor pattern having a length of 800 mm and a width of 1.4 mm was formed. In Pattern 2, a conductor pattern having a length of 400 mm and a width of 0.7 mm was formed. In Pattern 3, a conductor pattern having a length of 200 mm and a ...

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PUM

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Abstract

A printed wiring board includes a substrate and a circuit disposed on a surface of the substrate. The circuit includes a cured conductive paste. The conductive paste includes metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an ethylene oxide ring in a molecule, a curing agent, and a cellulose resin. The line has a length of 100 mm or more and 1600 mm or less, a width of 0.3 mm or more and 3 mm or less, a thickness of 10 [mu] m or more and 40 [mu] m or less, and a resistance value of 1000 m [omega] / m or less.

Description

technical field [0001] The invention relates to a printed circuit board, a printed circuit board and a method for manufacturing the printed circuit board. Background technique [0002] In recent years, as the wiring space of vehicles decreases, flexible printed wiring boards (FPCs) capable of miniaturization, thinning, and three-dimensionalization of wiring harnesses and their peripheral components are required. In particular, in order to control a battery installed with electric motorization of a vehicle, a sensor module equipped with an FPC capable of detecting a current of each battery cell needs to be thinned. [0003] As an FPC responding to demands for miniaturization, thinning, and three-dimensionalization, there is known an FPC in which a circuit is formed by bonding a thin, flexible base film having electrical insulation properties to a conductive metal such as copper foil. The circuit of the FPC is usually manufactured by a method called a subtractive method. For...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/10
CPCH05K1/092H05K3/10H05K1/095H05K2201/0257H05K1/097H05K2201/0266H05K1/0265H05K3/1216H05K3/1233H05K2203/0139C09D101/02C09D101/284C09D163/00H05K3/1283
Inventor 青山征人佐藤将太刀根梨江田代广祐山口敏夫
Owner YAZAKI CORP