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Composite electroforming process of copper-base composite material

A copper-based composite material and electroforming technology, applied in electroforming, electrolytic coating, electrolytic process, etc., to achieve the effect of smooth material surface, uniform distribution, and large overall thickness

Inactive Publication Date: 2003-12-31
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a new composite electroforming preparation method for copper-based composite materials in view of the shortcomings of the traditional metal matrix composite material preparation method and composite electroplating process. Combining the composite electrodeposition principle and electroforming technology, the process cost is relatively When the temperature is low and the operating temperature is not high, the copper-based composite material with uniform distribution of reinforcing particles, larger overall thickness than ordinary electroplating coating, and excellent performance can be prepared

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Prepare copper sulfate electroforming plating solution in composite electroplating tank, its composition is:

[0010] Copper Sulfate (CuSO 4 ·5H 2 O): 230g / L; sulfuric acid (H 2 SO 4 ): 60g / L

[0011] The anode material is a domestic phosphor copper plate (99.9% of Cu, 0.02-0.06% of P), and a metal copper plate with a thickness of 1mm is used as the cathode deposition matrix. SiC for reinforcement p (particle size is 7 μ m) 35g / L, and the co-deposition accelerator composition is (the ratio of each additive is its composition ratio in the electroplating bath):

[0012] Cationic fluorocarbon surfactant: 2.5g / L;

[0013] Triethanolamine: 50ml / L;

[0014] Hexamethylenetetramine: 25g / L;

[0015] Thiourea: 10mg / L.

[0016] Process Steps: In SiC p Before adding to the electroforming plating solution, mix and dissolve part of the prepared co-deposition accelerator with pure water, and then SiC p Put into it for stirring treatment to break up agglomerated SiC p , and...

Embodiment 2

[0019] Prepare copper sulfate electroforming plating solution in composite electroplating tank, its composition is:

[0020] Copper Sulfate (CuSO 4 ·5H 2 O): 230g / L; sulfuric acid (H 2 SO 4 ): 60g / L

[0021] The anode material is a domestic phosphor copper plate (99.9% of Cu, 0.02-0.06% of P), and a metal copper plate with a thickness of 1mm is used as the cathode deposition matrix. SiC whisker 50g / L for the reinforcement, the co-deposition accelerator composition is (the ratio of each additive is its composition ratio in the electroplating bath):

[0022] Cationic fluorocarbon surfactant: 2.5g / L;

[0023] Triethanolamine: 50ml / L;

[0024] Hexamethylenetetramine: 25g / L;

[0025] Thiourea: 10mg / L.

[0026] Process step: same as the process step of example 1. The resulting Cu / SiC p The content of SiC whiskers in the composite material is 32% (volume percentage), and the SiC whiskers are evenly distributed in the material.

Embodiment 3

[0028] Prepare the fluoroborate electroforming plating solution in the composite electroplating tank, the composition of which is:

[0029] Copper fluoroborate [Cu(BF 4 ) 2 ]: 330g / L; fluoroboric acid (HBF 4 ): 23g / L; boric acid (H 3 BO 3 ): 23g / L.

[0030] The anode material is a domestic phosphor copper plate (99.9% of Cu, 0.02-0.06% of P), and a metal copper plate with a thickness of 1mm is used as the cathode deposition matrix. SiC for reinforcement p (particle size is 7 μ m) 35g / L, and the co-deposition accelerator composition is (the ratio of each additive is its composition ratio in the electroplating bath):

[0031] Cationic fluorocarbon surfactant: 2.5g / L;

[0032] Triethanolamine: 50ml / L;

[0033] Hexamethylenetetramine: 25g / L;

[0034] Thiourea: 10mg / L.

[0035] Process step: same as the process step of example 1.

[0036] The resulting Cu / SiC p SiC in composites p The content is 27% (volume percentage), SiC p Evenly distributed in the material. At th...

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Abstract

The metal copper is used as anode material and the metal copper plate is used as cathode deposition mother body, in the electroforming plating liquor the reinforcing body and codeposition promotor prepared with cationic fluorocarbon surfactant, triethanlamine, hexamethyne tetramine and sulfourea are added, then powdered on to make metal copper ions and reinforcing body copeposit on the cathode mother body, then the composite electroformed plating layer can be stripped from cathode to obtain the integrally-reinforced copper base composite material with low cost and excellent performance.

Description

Technical field: [0001] The invention relates to a preparation method for composite electroforming of copper-based composite materials, which belongs to the technical field of composite electroplating. Background technique: [0002] At present, there are many methods for preparing discontinuous reinforced metal matrix composites, such as diffusion bonding method, molten metal infiltration method, casting method, high-energy forming method, etc. ("Metal Matrix Composite Materials" Zhang Guoding, Zhao Changzheng, Shanghai Jiaotong University Press , 1996). These preparation methods all need to be carried out at high temperature, and the high operating temperature is likely to cause serious interfacial reactions and oxidation reactions between the metal matrix and the reinforcement, resulting in deterioration of the structure and performance of the interface between the metal matrix and the reinforcement. At the same time, during the preparation process, the reinforcement is e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/00C25D3/38C25D15/00
Inventor 胡文彬胡国华朱建华沈彬刘磊
Owner SHANGHAI JIAOTONG UNIV
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