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Method for plating copper on surface of brass casting

A brass casting and copper plating technology, which is applied in the field of surface treatment, can solve the problems of poor activation ability of the plating solution, poor bonding force of the plating layer, unsuitable electroplating of complex parts, etc., to expand the range of cathode current density and resist chemical deposition , Improve the effect of throwing ability and deep plating ability

Inactive Publication Date: 2021-09-24
惠州市安泰普表面处理科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cyanide copper plating is used as a base coating on substrates such as steel and zinc alloys; sulfate copper plating cannot be directly plated with bright acid copper on highly active substrates, and is not suitable for electroplating complex parts
Therefore, pyrophosphate copper plating is more suitable for electroplating the bottom copper plating layer on brass castings, but when pyrophosphate copper plating is applied to brass castings, there are technical problems such as poor activation of the plating solution and poor adhesion of the coating.

Method used

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  • Method for plating copper on surface of brass casting

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Embodiment 1

[0022] This embodiment provides a method of copper plating on a brass casting surface, which comprises the steps of:

[0023] Steps, in the oil repellent process, including the ultrasonic removal step and electrically released oily process, wherein the ultrasonic deficient step is: placed the yellow copper casting in a concentration of 50- under conditions having a temperature of 25-45 ° C. After the commercially available alkaline removal of 110 g / L, the ultrasonic cleaning is carried out by ultrasonic cleaning, then washing brass castings with water; the electrolyte oil process is: under conditions of 25-45 ° C, put brass The casting is placed in a commercially available medium alkali-oil solution solution for 50-110 g / L for 5-10 min, and the current density is 2-10a / dm. 2 , Then clean the brass castings with water;

[0024] Step two, the pick-up process was placed in a sulfuric acid solution having a concentration of 90-150 ml / L at a temperature of 25-45 ° C, and then w...

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Abstract

The invention relates to a method for plating copper on the surface of a brass casting. The method comprises the following steps: step 1, an oil removal process; step 2, a pickling process; step 3, a brass plating process, wherein the brass casting is placed in a plating solution containing 270-330 g / L of potassium pyrophosphate and 200-300 ml / L of a copper supplement for copper plating for 10-60 minutes under the conditions that the temperature ranges from 10 DEG C to 45 DEG C, an anode adopts oxygen-free high-conductivity copper, and the cathode current density ranges from 0.5-5.5 A / dm<2>, and the copper supplement comprises following components by concentration: 1.5-2.5 mg / L of SPS, 40-50 g / L of copper pyrophosphate, and 1.2-1.4 mg / L of 2-amino-N-cyclohexyl acetamide; and step 4, a passivating process.

Description

Technical field [0001] The present invention relates to the field of surface treatment, and more particularly to a method of copper plating on a brass casting surface. Background technique [0002] Since the brass casting structure is low in dysplastic, if the non-copper metal layer (such as nickel plating, tin, silver plating, gold plating, etc.) is directly plated directly in the surface of the brass casting, and the brass castings The mutual adhesion is poor, and since the brass casting contains impurity metal ion zinc, the zinc ion is easily transimated to the surface of the metal plating layer, resulting in surface oxidation of the metal plating layer (formation of copper oxide) and vulcanization (zinc sulfide). [0003] In order to solve the above technical problem, the prior art solution is a layer of copper plated in the surface of the brass casting, the copper plated layer is used as the bottom layer, and then other metal layers are plated on the surface of the copper-pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/34
CPCC25D3/38C25D5/34
Inventor 庞美兴曾文涛
Owner 惠州市安泰普表面处理科技有限公司