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Manufacturing method of PCB

A production method and solder mask technology, which are applied in the cleaning/polishing of conductive patterns, secondary treatment of printed circuits, drying of printed circuits, etc., can solve the problems of complex operation, difficulty in achieving low ionic pollution, and poor adaptability, etc. Achieve the effect of avoiding ion migration, reducing ion contamination, and reducing ion residue

Pending Publication Date: 2021-10-01
广东世运电路科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Different surface treatment methods, different ink types, different treatment levels, etc. have different effects on the ion pollution degree of the PCB surface. Therefore, in the actual PCB cleaning process, in addition to the problem that it is difficult to achieve low ion pollution degrees, there It is necessary to formulate different cleaning processes according to the actual production test results of the factory, the operation is complicated and the adaptability is not wide

Method used

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  • Manufacturing method of PCB

Examples

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Effect test

Embodiment 1

[0044] A method for manufacturing a PCB without plugged holes, comprising the steps of:

[0045] (1) For material cutting, select halogen-free plates (the content of any element of fluorine, chlorine, bromine, and iodine is <900ppm), and the total element content is <1500ppm). After testing, the ion pollution degree of the halogen-free plate is 2.83μg / square inch;

[0046] (2) Make the inner layer circuit;

[0047] (3) Browning;

[0048] (4) lamination;

[0049] (5) half gong;

[0050] (6) drilling;

[0051] (7) Immersion copper, plate plating;

[0052] (8) Make the outer layer circuit, obtain the PCB substrate that has completed circuit making;

[0053] (9) Outer AOI (automatic optical inspection of outer lines);

[0054] (10) Solder resist: After ultrasonic cleaning in DI water, use halogen-free solder resist ink (SO 4 2- <2.0μg / square inch), baked at a low temperature of 75°C, exposed and developed to make a solder mask;

[0055] (11) Curing: UV baking is performe...

Embodiment 2

[0062] A method for making a PCB, the difference from Example 1 is that the ion pollution degree of the halogen-free plate selected in step (1) is 2.84 μg / square inch, and the UV energy in step (11) is 3000MJ / cm 2 , in step (15), the temperature of the ionic cleaning agent solution and hot water is 65° C., the concentration of the ionic cleaning agent is 15 wt %, the conductivity is 1.86 μs / cm, and the cleaning time is 4 minutes.

Embodiment 3

[0064] A method for making a PCB, the difference from Example 1 is that the ion pollution degree of the halogen-free plate selected in step (1) is 2.33 μg / square inch, and the UV energy in step (11) is 2700MJ / cm 2 , in step (15), the temperature of the ionic cleaning agent solution and hot water is 65° C., the concentration of the ionic cleaning agent is 15 wt %, the conductivity is 1.86 μs / cm, and the cleaning time is 4 minutes.

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Abstract

The invention relates to a manufacturing method of a PCB. According to the manufacturing method, the residues of various ions can be effectively reduce by controlling the selection of raw materials, carrying out pretreatment before resistance welding, adding a high-temperature curing process before surface treatment, carrying out ion cleaning before packaging, adding an ultrasonic cleaning step for an HDI board with tiny holes, and optimizing the working procedures of appearance processing, electrical testing and appearance detection, so the bad problems of ion migration and the like after a piece is attached to a PCB can be avoided.

Description

technical field [0001] The invention belongs to the technical field of PCB, and in particular relates to a method for manufacturing a PCB. Background technique [0002] With the rapid development of the electronics industry and the improvement of the requirements for long-term stability of functions, the integration of electronic products is getting higher and higher, and the functional life is getting longer and longer. The density of components on the circuit board is also increasing, and the wiring It is becoming more and more dense, the distance between lines is getting smaller and smaller, and the harshness of adapting to the environment is becoming more and more extensive. These phenomena are more manifested in the fields of aerospace, automotive circuit boards, high-end communication boards, and high-end medical equipment. obvious. The surface ion pollution of traditional printed circuit board (PCB) is too high or clean enough, which can no longer meet the special re...

Claims

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Application Information

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IPC IPC(8): H05K3/22H05K3/26H05K3/28
CPCH05K3/22H05K3/227H05K3/26H05K3/28
Inventor 谢富民周静
Owner 广东世运电路科技股份有限公司