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Charge regulator and preparation method and application thereof

A technology of charge regulators and regulators, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of insufficient charge regulation performance of charge regulators, and achieve enhanced charge regulation capabilities, stable dispersion systems, and uniform and dense coatings Effect

Active Publication Date: 2021-10-15
SHENZHEN BEIJIA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, to provide a charge regulator and its preparation method, to overcome the technical problem of insufficient charge regulation performance of the existing charge regulator

Method used

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  • Charge regulator and preparation method and application thereof
  • Charge regulator and preparation method and application thereof
  • Charge regulator and preparation method and application thereof

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preparation example Construction

[0045] Another aspect of the present invention provides a preparation method of a charge regulator, comprising the following steps:

[0046] S01: Measure each component according to the components contained in the charge regulator and the content ratio of each component;

[0047] S02: Mix the measured components.

[0048]In the preparation method of the charge regulator of the present invention, each component is accurately mixed in proportion, each component is uniformly dispersed, and the dispersion system of the charge regulator formed is stable. The preparation method of the charge regulator described in the present invention is simple and effective, and has no threshold, but the produced product has good effect and low production cost, so it is suitable for large-scale popularization and application.

[0049] Another aspect of the present invention provides a copper plating process, characterized in that the copper plating material in the copper plating process is pretre...

Embodiment 1

[0056] (1) Preparation of charge regulator (1L):

[0057] First weigh 500g of deionized water, add 50g of triethylene glycol and mix evenly, dissolve 10g of nonylphenol polyoxyethylene ether-10 and 10g of penetrant JFC in the mixed solvent, stir with an electromagnetic stirring device for 30 minutes, and then mix 10g polyamidoamine, stirred for 20 minutes, and finally made up to 1 L with deionized water to prepare a charge regulator solution.

[0058] (2) Verification of the effect of the charge regulator (electroless copper plating):

[0059] Electroless copper plating is used to verify the adjustment effect of the charge regulator. The FR-4 epoxy-glass fiber substrate board with holes is used as the test board. The size of the test board is 5cm×10cm, and the through holes of 0.5mm are evenly distributed. Purchase commercially available colloidal palladium supporting series solutions, including microetching solution, pre-dipping solution, colloidal palladium activation solut...

Embodiment 2

[0063] (1) Preparation of charge regulator (1L):

[0064] First weigh 500g of deionized water, add 50g of triethylene glycol butyl ether and mix evenly, dissolve 20g of nonylphenol polyoxyethylene ether-10 and 20g of penetrant JFC in the mixed solvent, stir with an electromagnetic stirring device for 30 minutes, and then 15 g of polyamidoamine was stirred for 20 minutes, and finally the volume was made up to 1 L with deionized water to prepare a charge regulator solution.

[0065] (2) Verification of the effect of the charge regulator (electroless copper plating):

[0066] Electroless copper plating is used to verify the adjustment effect of the charge regulator. The FR-4 epoxy-glass fiber substrate board with holes is used as the test board. The size of the test board is 5cm×10cm, and the through holes of 0.5mm are evenly distributed. Purchase commercially available colloidal palladium supporting series solutions, including microetching solution, pre-dipping solution, colloi...

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Abstract

The invention discloses a charge regulator and a preparation method and application thereof. The charge regulator comprises the following components in percentage by weight: 0.2%-20% of polyamide-amine dendritic polymer, 0.2%-20% of a surfactant, 0.5%-15% of a pH regulator, water and 60%-95% of an organic solvent. Firstly, the core component polyamide-amine dendritic polymer plays a charge adjusting role; the polyamide-amine dendritic polymer needs to achieve the charge adjusting effect in a solvent, the solvent is composed of water and an organic solvent, a charge adjusting agent dissolved in the solvent is added, and when the steady state needs to be maintained, a surfactant must be added to guarantee the homogeneous stability of the solution, and a pH adjusting agent must be added to guarantee the stability of the pH value of the solution; and finally, a uniform and stable dispersion system is formed. According to the charge regulator disclosed by the invention, the polyamide-amine dendritic polymer is adopted as the charge regulator, so the charge regulation capability is remarkably enhanced, and an ideal charge regulation function is realized through synergistic cooperation of all the components.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a charge regulator and its preparation method and application. Background technique [0002] The production process of printed circuit board (PCB) is generally the process of material cutting-gong board-drilling-removing slag-hole metallization-graphic transfer-solder mask-character-cutting and packaging. The hole metallization process is the basis for realizing the interconnection of circuits between layers. It plays an important role in the production of printed circuit boards. Hole metallization can be divided into two methods: chemical copper plating and direct electroplating. Whether it is chemical Copper plating or direct electroplating requires charge adjustment on the surface of the hole wall before the hole is metallized. The purpose of the charge adjustment is to adjust the negative charge carried by the surface of the resin and glass fiber itself to a po...

Claims

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Application Information

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IPC IPC(8): H05K3/42C23C18/18C23C18/20C25D5/54C25D5/56
CPCH05K3/429C23C18/1882C23C18/2066C25D5/54C25D5/56
Inventor 何康李荣侯阳高杨泽马斯才
Owner SHENZHEN BEIJIA ELECTRONICS MATERIAL
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