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Copper deposition pretreatment liquid and pretreatment method thereof

A pretreatment liquid and copper sinking technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as weak adhesion, increased cost burden, copper plating quality limitation, etc., to improve backlight Effect, improvement of peel strength, effect of enhanced viscosity strength

Active Publication Date: 2021-10-19
广东硕成科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] CN200510008522 adjusts the concentration of the surface finishing agent by using alkyltrialkoxysilane surface-treated bentonite, so that the dispersion stability of the surface regulator is excellent, but the adhesion between the substrate and the coating after the regulator is treated The force is weak, which is affected by various components in the copper deposition process, and the quality of copper plating is limited by the base material; at the same time, the current horizontal copper deposition process has poor backlight effect of the plated parts due to the use of concentrated activators. Moreover, it also increases the cost burden, and at the same time, the copper deposition rate is unstable in the electroless copper deposition process, and it is difficult to maintain a balance
CN201811619234 adopts purified water, phosphopeptide mixture, phosphate, polyoxyethylene ether, alkaline reagent and surfactant to provide a kind of liquid surface regulator, which has good storage stability and promotes the formation of phosphating film coating, but its The resulting coating is poorly lit

Method used

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  • Copper deposition pretreatment liquid and pretreatment method thereof
  • Copper deposition pretreatment liquid and pretreatment method thereof
  • Copper deposition pretreatment liquid and pretreatment method thereof

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Embodiment 1-16

[0050] Embodiments 1-16 of the present invention provide a copper-copper precursor, which are as follows.

[0051] Among them, the resin substrate 1 represents the roughness Ra: 590-630 nm, purchased from the birth of a technique, and the model is S1000-m.

[0052] The resin substrate 2 represents the roughness Ra: 480-500 nm, purchased from the use of the benefit technology, the model is S1150G.

[0053] The resin matrix 3 represents an epoxy substrate, a roughness RA: 900 to 1000 nm, purchased from the birth product, and the model is S1141.

[0054] Nitrogen-containing unique amine compound A: 2-hydrazine (from Shanghai Macillin Biochemical Technology Co., Ltd., Item No .: H831435, CAS: 4930-98-7)

[0055] Nitrogen-containing unique amine compound B: 4-imidazole acrylic acid (from Shanghai Macillin Biochemical Technology Co., Ltd., Item No .: U833629, CAS: 104-98-3)

[0056] Cationic polymer C: copolymer containing a pyridin six-membered heterocyclic (from Guangdong Shuo Technol...

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Abstract

The invention relates to the field of chemical plating on a non-conductive substrate plate, in particular to copper deposition pretreatment liquid and a pretreatment method thereof. The copper deposition pretreatment liquid comprises 0.01-100 g / L of a cationic polymer; and the polymer comprises the polymer which is formed by polymerizing at least one of epoxy group, alkenyl, reactive hydrogen and benzene ring with a heterocyclic nitrogen-containing compound, quaternizing and cation treatment. After the copper deposition pretreatment liquid is used, the growth state of copper in a hole is good, no copper nodule is generated, the quality of a plating layer is high, the adhesion performance between the plating layer and a resin substrate is excellent, and meanwhile, the backlight grade reaches the grade 9 or above and even the grade 10.

Description

Technical field [0001] The present invention relates to the field of chemical plating on non-conductive substrate plates, and in particular, the present invention relates to C23C22 / 78. Background technique [0002] CN200510008522 Adjusts the concentration of the surface finish by using an alkyl trialkoxysilane to adjust the concentration of the surface finish, so that the dispersion stability of the surface regulator is excellent, but the adhesion between the substrate and the plating layer after the adjustment agent is treated. The force is weak, and it is affected by the components in the copper process, the copper plating quality is limited by the substrate material; the current horizontal copper process due to the use of the concentrated activator, the rendering of the plating supplies is poor, Moreover, the cost burden is also increased, and the copper rate in the chemical copper process is unstable, it is difficult to maintain a balance. CN201811619234 provides a liquid s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18
CPCC23C18/1834
Inventor 孙宇曦曾庆明
Owner 广东硕成科技股份有限公司
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