A kind of dielectric ceramic composition and its preparation method and application

Abstract

The invention discloses a dielectric ceramic composition, a preparation method and application thereof, and relates to a dielectric ceramic and a multilayer ceramic capacitor using the same. The dielectric ceramic composition of the present invention includes a main component, an auxiliary component and a compound of magnesium; the main component is a compound of the general formula ABO 3 The compound represented, A is a divalent main group metal element, B is a tetravalent sub-group metal element; the auxiliary components include M1, M2 and M3, and the M1 is La, Ce, Pr, Nd, Sm, Eu, At least one of Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, the M2 is at least one of Mn, V, Cr, Fe, Ni, Zn, and Mo, the M3 is Si, At least one of Al, B, Li; the magnesium compound is a magnesium oxide or a magnesium salt; in the dielectric ceramic composition, the ratio of the sum of the mole percentages of M2 and M3 to the mole percentage of the magnesium compound It is: (b+c) / d=0.8~5.

Description

technical field [0001] The invention relates to a dielectric ceramic and a multilayer ceramic capacitor using it, in particular to a dielectric ceramic composition and its preparation method and application. Background technique [0002] With the continuous improvement of the circuit integration level of information equipment, the miniaturization and high capacity of various electronic components installed in the circuit are also advancing. Multilayer ceramic capacitors, as one of the representative ceramic electronic components, usually consist of a ceramic body (composed of ceramic materials), internal electrodes (inside the ceramic body, forming a multilayer structure), external electrodes (outside the ceramic body, to connect the corresponding The internal electrode) consists of three parts. At present, the dielectric material used in the ceramic body is mainly barium titanate-based compounds. [0003] Due to the miniaturization and high capacity requirements of multila...

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Problems solved by technology

[0005] Recently, relatively cheap base metals (such as copper and nickel) have been widely used as internal electrode materials, but these base metals are easily oxidized in high-temperature oxidizing atmospheres, so they cannot play the role of internal electrodes; when neutral or reducing Sintering in the atmosphere to prevent the metal oxidation of the internal electrode, the dielectric ceramic layer will be reduced and modified into a semiconductor layer; in order to further improve product reliability, many of them increase the molar percentage of the first type of auxiliary components to improve the core shell. The thickness of the structure is used to improve the reliability of the product, but when the molar percentage of the first type of subcomponent is greater than 5 mol%, its electrostatic capacitance will decrease significantly, and it is difficult to meet the requirements of high capacity; at the same time, pyrochlore, etc. may be produced Secondary phase, the generation of these secondary phases has a significant impact on the thermal shock resistance of the product (CN1320936A)

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