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Packaging composition with high adhesive force as well as use method and application thereof

A high-adhesion, composition technology, used in non-polymer organic compound adhesives, electrical components, circuits, etc., can solve the problems of high water and oxygen insulation, low volume shrinkage, high thermal stability, etc. Internal stress, improving mechanical properties, and the effect of strong deformation ability

Pending Publication Date: 2021-10-29
XIAN SMART MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the packaging of optoelectronic devices requires materials to meet the requirements of high light transmittance, high curing rate, low volume shrinkage, high thermal stability, and high water-oxygen barrier, but the current system cannot meet the above requirements

Method used

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  • Packaging composition with high adhesive force as well as use method and application thereof
  • Packaging composition with high adhesive force as well as use method and application thereof
  • Packaging composition with high adhesive force as well as use method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] This embodiment provides a kind of encapsulation composition with high adhesion, which is denoted as encapsulation composition (1), and the components it uses are as follows:

[0072] (A) Silicon-containing monomers: (meth)acrylic monomers containing dimethylsiloxane;

[0073] (B) Photocurable monomers containing ethoxylate groups: (B1) monomers of general formula (3);

[0074] (C) Initiator: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO);

[0075] (D) Photocurable monomer: 2-phenylethyl (meth)acrylate.

[0076] In a brown glass bottle, add 15% (A), 60% (B1), 5% (C) and 20% (D) by mass, shake and mix at room temperature for 2 hours, and then filter to obtain the packaging composition (1) ; Then the encapsulation composition (1) is coated on the surface of the ITO substrate by inkjet printing to form a sample with a size of 10cm×10cm×10 μm (length×width×thick), and then pass through 100mW / cm 2 The UV curing equipment cures the encapsulation composition by ultrav...

Embodiment 2

[0087] The present embodiment provides a kind of encapsulation composition with high adhesion, denoted as encapsulation composition (two), and the components that it uses are as follows:

[0088] (A) Silicon-containing monomers: (meth)acrylic monomers containing dimethylsiloxane;

[0089] (B) Photocurable monomers containing ethoxylate groups: (B2) monomers of general formula (4);

[0090] (C) Initiator: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO);

[0091] (D) Photocurable monomer: 2-phenylethyl (meth)acrylate.

[0092] In a brown glass bottle, add 15% (A), 60% (B2), 5% (C) and 20% (D) of the total mass, shake and mix at room temperature for 2 hours, and then filter to obtain the encapsulation composition (2) ; Then the packaging composition (two) is coated on the surface of the ITO substrate by inkjet printing to form a sample with a size of 10cm * 10cm * 10μm (length * width * thickness), and then pass 100mW / cm 2 The UV curing equipment cures the packaging compo...

Embodiment 3

[0094] The present embodiment provides a kind of encapsulation composition with high adhesion, which is denoted as encapsulation composition (3), and the components it uses are as follows:

[0095] (A) Silicon-containing monomers: (meth)acrylic monomers containing dimethylsiloxane;

[0096] (B) Photocurable monomers containing ethoxylate groups: (B1) monomers of general formula (3);

[0097] (C) Initiator: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO);

[0098] (D) Photocurable monomer: 2-phenylethyl (meth)acrylate.

[0099] In a brown glass bottle, add 60% (A), 10% (B1), 5% (C) and 25% (D) of the total mass, shake and mix at room temperature for 2 hours, and filter to obtain the packaging composition (3) ; Then the packaging composition (three) is coated on the surface of the ITO substrate by inkjet printing to form a sample with a size of 10cm × 10cm × 10μm (length × width × thickness), and then pass through 100mW / cm 2 The UV curing equipment cures the packaging co...

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Abstract

The invention belongs to the technical field of OLED packaging, and relates to a packaging composition with high adhesive force as well as a use method and application thereof. The packaging composition comprises the following components in percentage by mass: 15-80% of a silicon-containing monomer, 10-60% of a photocuring monomer containing an ethoxy group, 1-10% of a photoinitiator and 15-75% of a photocuring monomer, wherein the structure of the silicon-containing monomer is as shown in a general formula (1), and the structure of the ethoxylated group is shown in a general formula (2). The packaging composition can form a film through ink-jet printing, spin coating, silk-screen printing or blade coating and the like, and further forms an organic protective layer through ultraviolet curing. An organic protective layer prepared from the packaging composition has the characteristics of high adhesiveness, high curing rate, high light transmittance, low volume shrinkage, high heat resistance, low yellowing property and the like, can be effectively applied to packaging protection of optoelectronic devices, can effectively block water and oxygen, and further prolongs the service life of OLED devices.

Description

technical field [0001] The invention belongs to the technical field of OLED encapsulation, and relates to a composition for optoelectronic device encapsulation, in particular to an encapsulation composition with high adhesion and its use method and application. Background technique [0002] Organic light-emitting diode (OLED) display products have gradually become leaders in the display product market due to their advantages such as wide color gamut, fast response, energy saving, and flexibility. People not only want to use rigid OLED products, but also want to experience the unique charm of flexible OLED. The materials of the OLED device itself (including the active metal cathode and the organic layer) are extremely sensitive to water vapor and oxygen in the daily environment, and the presence of water and oxygen will gradually corrode and damage these functional layers. In order to ensure the normal service life of OLEDs, OLED panels must be packaged before they can be as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02H01L51/52
CPCC09J4/00H10K50/84
Inventor 李欢乐雷霆吴朝新周桂江毋妍妍
Owner XIAN SMART MATERIALS CO LTD