Processing method for processing rectangular photovoltaic cell silicon wafer by using primary single crystal silicon rod

Abstract

The invention discloses a processing method for processing a rectangular photovoltaic cell silicon wafer by using a primary single crystal silicon rod. The method comprises the following steps of step 1, determining eight longitudinal tangent lines formed by four straight lines shaped like a Chinese character "jing" and four edge straight lines on a cross section plane of the primary single crystal silicon rod; step 2, longitudinally cutting the primary single crystal silicon rod to obtain rectangular silicon ingots; step 3, splicing the rectangular silicon ingots to obtain a spliced silicon ingot; and step 4, cutting the spliced silicon ingot by using multiple planes to obtain the silicon wafer of a single crystal silicon photovoltaic cell. Compared with the prior art, the processing method is favorable for using a large-diameter single crystal silicon rod, is favorable for improving the distribution uniformity and symmetry of impurities doped in the silicon wafer, is favorable for improving the working production efficiency, and is favorable for reducing the head and tail slice loss; and in the slicing process, cutting silicon powder can be discharged, the cutting environment is improved, the production efficiency is improved, and the product quality is improved.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon photovoltaic cells, in particular to a processing method for processing rectangular photovoltaic cell silicon wafers with raw monocrystalline silicon rods. Background technique [0002] Photovoltaic cells made of monocrystalline silicon have the advantages of mature manufacturing process, stable quality, and high photoelectric conversion efficiency. Therefore, most of the current industrialized high-efficiency silicon photovoltaic cells use monocrystalline silicon wafers as the basic material. [0003] In order to improve the packaging efficiency of photovoltaic modules, it is hoped that the monocrystalline silicon wafer has a standard, rectangular shape with no corners. In order to improve production efficiency and reduce costs, it tends to use larger area monocrystalline silicon wafers and draw larger diameter single crystals. silicon crystals. [0004] Background technology, I...

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Problems solved by technology

[0012]Second, because the truncated length of the invention CN 108068221 B silicon rod depends on the size of the opposite side of the silicon chip, the size of the opposite side of the silicon chip is small, so the monocrystalline silicon rod Shorter length, more joints during slicing, more loss of the first and last piece, more processing steps, and more auxiliary man-hours, which affect the slicing rate and production efficiency

[0013] Third, the invention CN 108068221 B needs to process the cylindrical surface of the monocrystalline silicon rod before slitting, so that part of the monocrystalline silicon that can be directly recycled becomes chips Silica fume discharge wastes material, increases emissions and increases processing time

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