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Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member

A technology of boron nitride particles and thermally conductive resins, applied in nitrogen compounds, chemical instruments and methods, electrical equipment structural parts, etc., can solve the problem of cumbersome manufacturing processes, poor fluidity, and difficulty in ensuring sheet thickness and dimensional accuracy And other issues

Pending Publication Date: 2021-11-09
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, there are the following problems: (1) it is necessary to laminate the oriented sheet in a subsequent process, and the manufacturing process tends to become complicated; (2) it is necessary to thinly cut into sheets after lamination and curing, and it is difficult to ensure the size of the sheet thickness precision
In addition, the shape of hexagonal boron nitride particles is in the shape of scales, so when filling the resin, the viscosity increases and the fluidity deteriorates, so it is difficult to fill high

Method used

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  • Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
  • Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
  • Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member

Examples

Experimental program
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Effect test

Embodiment 1

[0131] Example 1 Aggregate boron nitride particles were synthesized by boron carbide synthesis, pressurized nitriding process, and decarburization crystallization process as follows, and filled with resin.

[0132] (Boron carbide synthesis)

[0133] 100 parts by mass of orthoboric acid (hereinafter referred to as boric acid) manufactured by Nippon Denko Co., Ltd. and 35 parts by mass of acetylene black (HS100) manufactured by Denka Company were mixed using a Henschel mixer, and then filled in a graphite crucible. Under argon atmosphere, boron carbide (B 4 C). The synthesized boron carbide block was pulverized by a ball mill for 1 hour, sieved to a particle size of 75 μm or less, washed with an aqueous solution of nitric acid to remove impurities such as iron components, and then filtered and dried to produce boron carbide powder with an average particle size of 20 μm. . The carbon content of the obtained boron carbide powder was 20.0%.

[0134] (pressurized nitriding proce...

Embodiment 2

[0145] In Example 2, the amount of boric acid mixed with 100 parts by mass of boron carbonitride in the decarburization crystallization process was changed from 90 parts by mass to 110 parts by mass, and block nitride was synthesized in the same manner as in Example 1. Boron particles are used to make heat dissipation components.

Embodiment 3

[0147] In Example 3, the amount of boric acid mixed with 100 parts by mass of boron carbonitride in the decarburization and crystallization process was changed from 90 parts by mass to 75 parts by mass, and block nitride was synthesized in the same manner as in Example 1. Boron particles are used to make heat dissipation components.

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Abstract

The present invention relates to boron nitride aggregated particles which are formed by aggregating hexagonal boron nitride primary particles, have a specific surface area of 2-6 m2 / g as measured by the BET method, and have a collapse strength of 5 MPa or more. A thermal conductive resin composition according to the present invention contains boron nitride aggregated particles according to the present invention. A heat dissipation member according to the present invention uses a thermal conductive resin composition according to the present invention. According to the present invention, it is possible to provide: boron nitride aggregated particles capable of suppressing the occurrence of voids in a heat dissipation member, and improving the dielectric breakdown characteristics and thermal conductivity of the heat dissipation member; a thermal conductive resin composition comprising said boron nitride aggregated particles; and a heat dissipation member using said thermal conductive resin composition.

Description

technical field [0001] The present invention relates to bulk boron nitride particles, a thermally conductive resin composition containing the bulk boron nitride particles, and a heat dissipation member using the thermally conductive resin composition. Background technique [0002] In heat-generating electronic components such as power devices, transistors, thyristors, and CPUs, how to effectively dissipate heat generated during use has become an important issue. Conventionally, as such heat dissipation countermeasures, (1) high thermal conductivity of the insulating layer of the printed wiring board on which the heat generating electronic The printed wiring board of the component is mounted on the heat sink through an electrically insulating thermal interface material (Thermal Interface Materials). As insulating layers and thermal interface materials of printed wiring boards, silicone resins and epoxy resins filled with ceramic powder are used. [0003] In recent years, al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B21/064C08K3/38C08K7/00C08L101/00
CPCC01B21/064C08K3/38C08L101/00C01B21/0645C09K5/14C08K2003/385C08K2201/006C08K2201/003C08K2201/001C08L83/04C08K7/00H05K7/20481C01P2004/50C01P2004/54C01P2004/61C01P2006/12C01P2006/32C01P2002/76C01P2006/90C08K2201/005
Inventor 竹田豪田中孝明
Owner DENKA CO LTD
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