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Method for in-situ catalytic chemical plating of plasma modified polyimide film

A technology of polyimide film and in-situ catalysis, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., to achieve good wettability, conducive to circuit forming, and good bonding effect

Active Publication Date: 2021-11-16
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Apply milder plasma surface modification to the precursor treatment of electroless plating, explore the mechanism of plasma and polyimide film, and immobilize active species in situ on the surface of the modified film in a fully additive manner to achieve a flexible substrate There is no relevant report on the research of selective deposition of metal wires on

Method used

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  • Method for in-situ catalytic chemical plating of plasma modified polyimide film
  • Method for in-situ catalytic chemical plating of plasma modified polyimide film
  • Method for in-situ catalytic chemical plating of plasma modified polyimide film

Examples

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preparation example Construction

[0035] (2) Preparation of silver ammonia solution: take appropriate amount of ammonia water for experiment, add deionized water to dilute, and prepare 0.05-0.15mol / L silver nitrate solution, take it out into a test tube, and add diluted ammonia drop by drop to the test tube Aqueous solution, while dripping while oscillating, brown flocculent precipitates are formed when just dropping, continue to drop and oscillate until the precipitate disappears completely, and obtain a colorless transparent solution; the silver ammonia solution in step (2) has a mass concentration of 3%-5 Ammonia or sodium hydroxide solution in the range of % is added dropwise to the silver nitrate solution, from clear to turbid and then back to a colorless transparent solution state, the concentration of silver nitrate is 0.05-0.15mol / L.

[0036] (3) Plasma modification of polyimide: put the clean polyimide film obtained in (1) into the chamber of the plasma equipment, set the relevant parameters of the pla...

Embodiment 1

[0041] (1) Cleaning of polyimide: Take the kapton polyimide film developed by DuPont Company, with a length and width of 7×3cm and a thickness of 0.125mm, and place it in absolute ethanol for ultrasonic cleaning for 5min, with an ultrasonic power of 110W , the frequency is 40KHz, and then washed with a large amount of deionized water, and then dried to obtain a clean PI film. The kapton process polyimide film developed by DuPont is an aromatic polyimide film material with imide ring as the characteristic functional group on the main chain.

[0042] (2) Preparation of silver-ammonia solution: measure 1ml mass concentration of 25% ammonia solution, add 4ml deionized water to dilute to obtain 5% ammonia solution (A), weigh 0.17g silver nitrate and add 10ml deionized water Ionized water to obtain a silver nitrate solution (B) with a molar concentration of 0.1mol / L, take 1ml of the silver nitrate (B) solution in a clean test tube, and add the diluted ammonia solution (A) drop by dr...

Embodiment 2

[0047] (1) Cleaning of polyimide: take the kapton polyimide film developed by DuPont Company, with a length and width of 7 cm x 7 cm and a thickness of 0.125 mm, and place it in absolute ethanol for ultrasonic cleaning for 10 min, with an ultrasonic power of 110 W , the frequency is 40KHz, and then washed with a large amount of deionized water, and then dried to obtain a clean PI film.

[0048] (2) The preparation of silver ammonia solution: measure 1ml mass concentration and be 25% sodium hydroxide solution (A), add 8ml deionized water to dilute and obtain mass concentration and be 3%, take by weighing 0.17g silver nitrate and add 10ml deionized Water to obtain a silver nitrate solution (B) with a molar concentration of 0.1mol / L, take 1ml of the silver nitrate (B) solution in a clean test tube, add the diluted sodium hydroxide solution (A) drop by drop to the test tube, and drop While oscillating, a brown flocculent precipitate was formed at the beginning of the dropwise addi...

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Abstract

The invention provides a method for in-situ catalytic chemical plating of a plasma modified polyimide film. The method comprises the following steps: generating an aromatic chain aldehyde group reducing group on the surface of the plasma modified polyimide film, reducing silver-ammonia ions to metal silver by using the aromatic chain aldehyde group reducing group, and depositing in situ in a preset circuit area to form active species catalytic chemical plating, wherein the polyimide is an aromatic polyimide film material with an imide ring as a characteristic functional group on a main chain. The method is short in technological process, easy to operate, low in implementation cost, free of acid and alkali corrosion agents, environmentally friendly, capable of being matched with a computer to assist in manufacturing a complex fine conductive circuit, high in selectivity and capable of guaranteeing the good binding force of a plating layer, and is a supplement of a fully-additive circuit manufacturing method. The method has a good application prospect in the field of flexible wearable electronics and microelectronic manufacturing.

Description

technical field [0001] The invention belongs to the technical field of making flexible electronic metal circuits, and in particular relates to a method for in-situ catalytic electroless plating of a plasma-modified polyimide film. Background technique [0002] With the increasingly high level of process integration involved in electronic information products and the miniaturization and flexibility development requirements of high-frequency interconnection communication equipment, metal conductive lines are fabricated on the surface of flexible and bendable substrates to complete various functional electrical interconnections. Devices or electronic circuit products have become one of the hot spots of many researches. Flexible electronic components are mainly composed of four parts: flexible substrate, electronic device, conductive circuit and packaging layer. Among them, the key to the process is to deposit the required metal conductive lines on the flexible substrate and ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/20C23C18/38
CPCC23C18/1608C23C18/2073C23C18/38
Inventor 周国云相君伦何为王守绪杨文君陈苑明唐耀孙玉凯张伟华
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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