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Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

A resin composition and compound technology, which is applied in the fields of multilayer printed wiring boards and semiconductor packages, laminates, prepregs, and resin compositions, can solve the problem of poor dielectric properties, increased dielectric properties of printed wiring boards, Insufficient dielectric properties of printed wiring boards, etc., to achieve the effect of sufficient flame retardancy and excellent dielectric properties

Pending Publication Date: 2021-11-16
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to impart flame retardancy to halogen-free printed wiring board materials, phosphorus-containing flame retardants are usually used, but flame retardancy of halogen-free materials requires a large amount of flame retardants, so the dielectric properties of flame retardants have a significant impact on printed wiring boards. The influence caused by its own dielectric properties gradually becomes larger
However, the flame retardant is also a material with poor dielectric properties among the materials constituting printed wiring board materials, so the dielectric properties of the printed wiring board may become insufficient due to the increase in the amount added, which is a problem for printed wiring boards. Impediments to the improvement of the dielectric properties of the

Method used

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  • Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
  • Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
  • Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0402] Hereinafter, the present invention will be described concretely with reference to examples. However, the present invention is not limited to the following examples.

[0403] In addition, in each example, weight average molecular weight (Mw) was measured by the following method.

[0404] Conversion was performed by gel permeation chromatography (GPC) based on a calibration curve using standard polystyrene. The standard curve uses standard polystyrene: TSK standard POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [Tosoh Corporation Company system, product name], approximated by a cubic formula. The measurement conditions of GPC are shown below.

[0405] device:

[0406] Pump: Model L-6200 [manufactured by Hitachi High-Tech Co., Ltd.]

[0407] Detector: L-3300 type RI [manufactured by Hitachi High-Tech Co., Ltd.]

[0408] Column oven: L-655A-52 [manufactured by Hitachi High-Tech Co., Ltd.]

[0409] Column: guard column; TSK Guardcolumn HHR-L+ colu...

manufacture example 1

[0416] [Production Example 1: Production of Modified Maleimide Compound (X-1)]

[0417] Put 2,2-bis[4-(4-maleimidephenoxy) in a reaction vessel with a volume of 5 liters capable of heating and cooling attached to a moisture meter with a thermometer, a stirring device, and a reflux condenser. ) 100 parts by mass of phenyl] propane, 5.6 parts by mass of siloxane compound (functional group equivalent weight 750 g / mol) having amino groups at both ends, 3,3'-diethyl-4,4'-diaminodiphenylmethane 7.9 parts by mass and 171 parts by mass of propylene glycol monomethyl ether were reacted for 2 hours while refluxing. This was concentrated at reflux temperature over 3 hours to produce a modified maleimide compound (X-1) solution having a solid content concentration of 65% by mass. The weight average molecular weight (Mw) of the obtained modified maleimide compound (X-1) was about 2700.

Embodiment 1 and 2、 comparative example 1～6

[0419] Each component described in Table 1 was stirred and mixed at room temperature with 58 parts by mass of toluene and 10 parts by mass of methyl isobutyl ketone according to the compounding composition described in Table 1 to prepare a resin having a solid content concentration of 55 to 65 mass % combination.

[0420] The resin composition obtained in each example was coated on glass fiber cloth (E glass, manufactured by Nitto Boshen Co., Ltd.) with a thickness of 0.08 mm, and then heated and dried at 150° C. for 5 minutes to prepare a solid material derived from the resin composition. A prepreg having a component content of about 47% by mass. On the upper and lower sides of the prepreg, a low-smoothness copper foil (BF-ANP18, Rz of the M surface: 1.5 μm, manufactured by CIRCUIT FOIL Co., Ltd.) with a thickness of 18 μm is arranged so that the M surface is in contact with the prepreg, and the temperature is 230 ° C. , pressure 3.0MPa, time 90 minutes under the conditions ...

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Abstract

This invention pertains to a resin composition containing: a phosphate ester flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures; and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both terminals.

Description

technical field [0001] The present invention relates to a resin composition, a prepreg, a laminate, a multilayer printed wiring board, and a semiconductor package. Background technique [0002] The speed and capacity of signals used in mobile communication equipment such as mobile phones, base station devices, network infrastructure equipment such as servers and routers, and large computers are increasing year by year. Along with this, printed wiring boards mounted on these electronic devices need to cope with higher frequencies, and require dielectric characteristics (low dielectric constant and low dielectric loss tangent ; Hereinafter, sometimes referred to as high-frequency characteristics.) Excellent substrate material. In recent years, as applications for processing such high-frequency signals, in addition to the above-mentioned electronic equipment, implementation plans and implementation plans of new systems for processing high-frequency wireless signals in the ITS ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08G73/00C08J5/24C08K3/013C08K5/521C08L53/02C08L63/00C08L79/04
CPCC08K5/521C08G73/121C08G73/127C08L79/085C08G65/485C08J3/226C08J2379/08C08J2471/12H05K1/0373H05K2201/012H05K1/0366C08J5/244C08J5/249C08K3/36C08L53/025C08L71/12C08L71/126C08L63/00C08L79/08C08L101/00C08K3/013B32B15/08C08J2371/12C08K5/523C08K5/0066C08J5/24C08J2400/00C08J2463/00C08J2479/08B32B5/022B32B15/14B32B15/20B32B37/18B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2305/076B32B2307/204B32B2307/3065B32B2307/748B32B2311/12B32B2315/085B32B2457/08C08G73/128C08J2425/04C08J2471/00H01L23/49822H05K1/024
Inventor 泷贵大江尻贵子岩仓哲郎内村香奈藤井俊希大森由佳子加藤哲也藤冈藏
Owner RESONAC CORP
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