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Preparation technology of heat conduction and heat dissipation material for 5G base station

A heat dissipation material and preparation technology, applied in the direction of adhesive additives, non-polymer adhesive additives, polymer adhesive additives, etc., can solve the problem of increasing the volume of the equipment shell, reducing the surface temperature of the shell, and failing to meet heat dissipation requirements, etc. problems, to achieve the effects of reducing labor costs, saving materials, and low oil output

Pending Publication Date: 2021-11-23
SHENZHEN DOERN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

5G base stations introduce large-scale antenna technology, and the size, weight, and heat dissipation of AAU are all challenged
[0003] At present, for the heat dissipation problem of the heat dissipation group, the traditional solution is to reduce the temperature difference between the chip and the shell, use high thermal conductivity interface materials and thermal bridging heat conduction blocks or heat pipes; or reduce the surface temperature of the shell, increase the shell volume of the device, and increase the surface area to improve the shell temperature. Uniformity; use cast aluminum to thicken the shell. However, these technical solutions still have many shortcomings in actual use. For example, when the shell is exposed to sunlight, its surface temperature can be as high as 60°C to 90°C
However, the Tc requirement of many chips is within 90°C, which will not meet the heat dissipation requirements at this time.

Method used

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  • Preparation technology of heat conduction and heat dissipation material for 5G base station
  • Preparation technology of heat conduction and heat dissipation material for 5G base station

Examples

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Effect test

Embodiment 1

[0021] A preparation process of heat conduction and heat dissipation materials for 5G base stations, specifically comprising the following steps:

[0022] S1: Add the base material, add 30 parts by mass of mixed silicone oil to the stirring tank, wherein the mixed silicone oil is a mixture of vinyl silicone oil, vinyl MQ silicone resin and hydroxyl silicone oil in a ratio of 1:1:2 by weight , the viscosity of the mixed silicone oil is controlled to be 2000cps, after adding the mixed silicone oil, the temperature in the stirring tank is raised to 70 degrees Celsius, and the constant temperature in the container is kept, and then 50 parts of powdery zinc oxide and powdery aluminum nitride are added successively in the stirring tank, and The mass ratio of powdered zinc oxide and powdered aluminum nitride is set to 1:1, and the stirring mechanism in the stirring tank is operated while the material is added, and the rotation speed is guaranteed to be 80r / min, and the counterclockwis...

Embodiment 2

[0029] A preparation process of heat conduction and heat dissipation materials for 5G base stations, specifically comprising the following steps:

[0030] S1: Add the base material, add 35 parts by mass of mixed silicone oil to the stirring tank, wherein the mixed silicone oil is a mixture of vinyl silicone oil, vinyl MQ silicone resin and hydroxyl silicone oil in a ratio of 1:1:2 by weight, The viscosity of the mixed silicone oil is controlled to be 2500cps. After adding the mixed silicone oil, raise the temperature in the stirring tank to 72 degrees Celsius, keep the constant temperature in the container, and then add 60 parts of powdery zinc oxide and powdery aluminum nitride to the stirring tank successively, and The mass ratio of powdered zinc oxide and powdered aluminum nitride is set to 1:1, and the stirring mechanism in the stirring tank is operated while the material is added, and the rotation speed is guaranteed to be 80r / min, and the counterclockwise constant speed i...

Embodiment 3

[0037] A preparation process of heat conduction and heat dissipation materials for 5G base stations, specifically comprising the following steps:

[0038] S1: Add the base material, add 40 parts by mass of mixed silicone oil to the stirring tank, wherein the mixed silicone oil is a mixture of vinyl silicone oil, vinyl MQ silicone resin and hydroxyl silicone oil in a ratio of 1:1:2 by weight, The viscosity of the mixed silicone oil is controlled to be 3000cps. After adding the mixed silicone oil, raise the temperature in the stirring tank to 74 degrees Celsius, keep the constant temperature in the container, and then add 70 parts of powdery zinc oxide and powdery aluminum nitride to the stirring tank successively, and The mass ratio of powdered zinc oxide and powdered aluminum nitride is set to 1:1, and the stirring mechanism in the stirring tank is operated while adding the materials, ensuring that the rotation speed is 80r / min and stirring counterclockwise at a constant speed ...

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Abstract

The invention discloses a preparation technology of a heat conduction and heat dissipation material for a 5G base station, and particularly relates to the technical field of heat conduction sol preparation. The preparation technology specifically comprises the following steps: S1, adding a base material, S2, adding an auxiliary material, S3, kneading, S4, carrying out vacuum defoaming, S5, preparing a reinforcing agent, and S6, preparing heat conduction sol. A certain amount of montmorillonite and sodium alginate are added into the raw materials to serve as the reinforcing agent, the montmorillonite has good adsorption capacity, cation exchange capacity and water swelling capacity due to the special crystal structure of the montmorillonite, the viscosity and hydrophobicity of the heat conduction sol are greatly improved, sodium alginate is natural polysaccharide, and has stability, solubility, viscosity and safety, is environment-friendly, safe and pollution-free, and the viscosity of the heat conduction sol is greatly improved on the original basis.

Description

technical field [0001] The present invention relates to the technical field of heat conduction sol preparation, and more specifically, the present invention relates to a preparation process of heat conduction and heat dissipation materials for 5G base stations. Background technique [0002] The 5G base station is based on 5G advanced technologies such as multi-antenna Massive MIMO (large-scale input and output), new coding LDPC / Polar, etc., with ultra-large bandwidth, the experience rate can reach 1Gbps, which is 100 times that of 4G, and the peak rate can reach 20Gbps. Equivalent to 200 times that of 4G. In addition to high speed, 5G also has two important features of high reliability, low latency, low power consumption and large connection, which can greatly promote the popularization of telemedicine, industrial control, remote driving, smart city, smart home and other applications. 5G base stations introduce large-scale antenna technology, and the volume, weight, and hea...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J183/07C09J11/04C09J11/08
CPCC09J183/04C09J11/04C09J11/08C08L2205/025C08L83/04C08L5/04C08K3/346
Inventor 张恩来赵一静刘乐华刘燕赵宁
Owner SHENZHEN DOERN CHEM