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Composite VC radiator containing copper/diamond sintering wicks and preparation method thereof

A diamond and liquid-absorbing core technology, which is applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve problems such as difficulty in meeting high-power heat dissipation requirements, limited improvement in thermal conductivity, and small diamond content , to achieve the effect of improving sintering bonding, improving heat transfer performance, and reasonable pore structure

Active Publication Date: 2021-12-07
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the core component of the VC board, the capillary wick is mostly copper-based at present, but due to the low thermal conductivity of copper itself, it will be difficult to meet higher power requirements in the future Cooling needs
As the material with the best thermal conductivity in nature, diamond has both high thermal conductivity and low thermal expansion characteristics. It has unique advantages as a thermal conductivity enhancing material. However, at present, diamonds are composited with copper liquid-absorbing cores by coating methods, and the diamond content is small. Limited improvement in thermal conductivity

Method used

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  • Composite VC radiator containing copper/diamond sintering wicks and preparation method thereof
  • Composite VC radiator containing copper/diamond sintering wicks and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Preparation of copper / diamond sintered body:

[0048] Get the diamond particles with a particle size of 150 μm (100 mesh) to deposit a Cr transition layer, magnetron sputtering power 200w, deposition time 20min, to obtain a thickness of 2 μm diamond particles containing a Cr transition layer, and then deposit a Cr transition layer on the diamond particles containing Cr Copper plating on the surface, the specific copper plating process is: magnetron sputtering power 200w, to obtain a copper cladding layer with a thickness of 2μm, and then the diamond particles containing the copper cladding layer and the copper powder with a particle size of 150μm are in a mass ratio of 40: Mix at 60°C to obtain mixed powder, loosely pack it into a graphite mold, and sinter in a hydrogen atmosphere. During sintering, first raise the temperature to 750°C at a speed of 5°C / min, and then raise the temperature to 900°C at a speed of 3.3°C / h , holding time for 60 minutes, and then air-cooled ...

Embodiment 2

[0052] Preparation of copper / diamond sintered body:

[0053] Get the diamond particle diameter that is 250 μm (60 order) to deposit the Cr transition layer, magnetron sputtering power 200W, deposition time 90min, obtain the diamond particle that is 9 μm in thickness and contain the Cr transition layer, and then on the diamond particle that contains the Cr overcoating layer Copper plating on the surface, the specific copper plating process is: magnetron sputtering power 200W, deposition time 90min to obtain a copper coating layer with a thickness of 9μm, and then the diamond particles containing the copper coating layer and the copper powder with a particle size of 150μm are mixed by mass Mix at a ratio of 50:50 to obtain a mixed powder, loosely pack it in a graphite mold, and sinter it under a hydrogen atmosphere. During sintering, first raise the temperature to 750°C at a rate of 300°C / h (5°C / min), and then increase the temperature at 200°C The temperature was raised to 850°C...

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Abstract

The invention discloses a composite VC radiator containing copper / diamond sintering wicks and a preparation method thereof. The VC radiator comprises a lower shell plate, a concave cavity is formed in the center of the inner surface of the lower shell plate, a boss consistent with the plane size of the concave cavity is arranged in the center of the outer surface of the lower shell plate, and a copper / diamond composite plate is arranged on the surface of the boss or the surface of the concave cavity; and when the copper / diamond composite plate is arranged on the surface of the boss, a copper / diamond sintered body of a three-dimensional porous structure is directly arranged on the surface of the concave cavity, and when the copper / diamond composite plate is arranged on the surface of the concave cavity, the copper / diamond sintered body of the three-dimensional porous structure is then arranged on the surface of the copper / diamond composite plate. The composite VC radiator provided by the invention is internally and externally provided with the copper / diamond sintered bodies which are reasonable in pore structure, excellent in heat conduction performance, wide in heat dissipation area and good in hydrophilicity, the heat dissipation performance is improved to the maximum extent under the cooperation of the structure and the material, and the heat dissipation requirement of a new generation of high-power electronic devices is better met.

Description

technical field [0001] The invention discloses a composite VC radiator containing a copper / diamond sintered liquid-absorbing core and a preparation method thereof, belonging to the technical field of thermal management equipment. Background technique [0002] With the advent of the 5G era, in order to meet the growing needs of use, various electronic devices have been updated and developed in the direction of miniaturization, high integration, and high performance. Under the requirements of sharply increasing working power and smaller size, the power density of electronic components has increased sharply. Electronic components perform high-power work in such a small area, which is bound to bring amazing heat. When the heat cannot be dissipated in time, it will lead to failure, damage, or even meltdown of electronic devices. The heat dissipation problem of high-power electronic devices has become a bottleneck in the application of new-generation electronic devices. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/046H05K7/20336
Inventor 魏秋平周科朝马莉王熹
Owner CENT SOUTH UNIV
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