Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board
A resin composition, low dielectric technology, applied in printed circuits, printed circuits, printed circuit parts, etc., can solve problems such as difficulty in melt processing, and achieve the effects of good melt processability and excellent low dielectric properties
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[0062] As a method for preparing the monomer mixture, it is preferable to acylate a monomer mixture containing a monomer having a phenolic hydroxyl group to obtain a monomer mixture containing an acylate of a monomer having a phenolic hydroxyl group in terms of cost and production time. method.
[0063] Examples of constituent units constituting liquid crystal polymers include aromatic oxycarbonyl units, aromatic dicarbonyl units, aromatic dioxy units, aromatic aminooxy units, aromatic diamino units, and aromatic aminocarbonyl units. , and aliphatic dioxy units, etc.
[0064] It should be noted that the liquid crystal polymer may contain an amide bond or a thioester bond as bonds other than the ester bond.
[0065] The aromatic oxycarbonyl unit is a unit derived from an aromatic hydroxycarboxylic acid.
[0066] Specific examples of suitable aromatic hydroxycarboxylic acids include p-hydroxybenzoic acid, m-hydroxybenzoic acid, o-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid...
Embodiment 1～12、 and comparative example 1～6
[0194] In Examples and Comparative Examples, a wholly aromatic liquid crystal polyester resin having a melting point of 280° C. was used as the liquid crystal polymer (A) (component (A)). In addition, in the examples, as the graft modified polyolefin (B) ((B) component), the modified polyolefin 1 to the modified polyolefin 4 obtained in the production example 1 to the production example 4 were used.
[0195] In the comparative example, as the resin mixed with the liquid crystal polymer (A), unmodified polymethylpentene and ethylene / glycidyl methacrylate / methyl acrylate / vinyl acetate copolymer (Sumitomo Chemical Co., Ltd. Manufactured, BONDFAST7L (BF-7L)). BONDFAST 7L is a non-graft modified resin with epoxy groups as polar groups.
[0196] Each material in the amount recorded in Tables 1 to 4 was supplied from the hopper mouth to a twin-screw extruder ( L / D=40, manufactured by TECHNOVEL CORPORATION) and melt kneading were carried out to obtain the resin compositions of the ...
Embodiment 13
[0233] In Example 13, the resin composition obtained in Example 9 was used to obtain a double-sided copper-clad laminate film including a film formed of the resin composition and copper foil. In Comparative Example 7, a double-sided copper-clad laminated film was obtained in the same manner as in Example 13 using the liquid crystal polymer (A) described in Comparative Example 1.
[0234] Specifically, a double-sided copper-clad laminated film was produced by the following method.
[0235]As the copper foil, a copper foil having a thickness of 12 μm and a surface roughness Ra of 0.45 μm or less of the surface in contact with the thin film of the resin composition was used.
[0236] Width w of wiring formed of copper foil was calculated from the following formula.
[0237] Z=(d / ε×w) 0.5
[0238] In the above formula, Z is the characteristic impedance, which is 50Ω. D is the thickness of the film and is 100 μm. ε is the dielectric constant of the resin composition.
[0239]...
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