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Organic-inorganic compound sensitization resin composition and LCD element using sclerotium thereof

A photosensitive resin, inorganic composite technology, used in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of high dielectric constant, insufficient heat resistance, low humidity resistance, etc.

Inactive Publication Date: 2012-01-25
KOREA ELECTROTECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The heat resistance of the acrylic organic insulating film currently used as an organic insulating film for passivation is about 280°C, which is somewhat low. For reliability, it is necessary to have heat resistance that can withstand high temperatures above 300°C. The existing SiO 2 Has many problems with acrylic insulators such as high cost, high dielectric constant, insufficient heat resistance, low moisture resistance, weak adhesion, and low heat resistance

Method used

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  • Organic-inorganic compound sensitization resin composition and LCD element using sclerotium thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0046] The first embodiment (preparation of inorganic sol)

[0047] Adjust the colloidal inorganic matter to be acidic between pH 3 and 5, and then add 1 to 120 parts by weight of organosilane diluted with ethanol, i.e. methyltrimethoxysilane (MTMS) or vinyltrimethoxysilane (VTMS), The organosilane is reacted with the surface of the inorganic nanoparticle to remove water, and the reaction medium is hydrophobized by adding an organic solvent.

[0048] When the trimethoxyl group of MTMS reacts with the surface of the colloidal inorganic material particles, the colloidal inorganic material becomes a form that can be dispersed in the organic resin as the methyl group is exposed on the surface, thereby adjusting the hydrophobicity of the inorganic material surface degree. The three trimethoxyl groups of VTMS condense with the OH groups at the interface of the above-mentioned hydrophobized colloidal inorganic matter to expose the vinyl group, and the above-mentioned hydrophobized c...

no. 2 example

[0049] Second embodiment (preparation of acrylic copolymer)

[0050] Add 10 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 200 parts by weight of propylene glycol monomethyl ether acetate, 20 parts by weight methacrylic acid, 35 parts by weight of glycidyl methacrylate, 15 parts by weight of methyl methacrylate and 30 parts by weight of styrene and slowly stirred after nitrogen replacement. The above reaction solution was heated to 62°C and maintained at that temperature for 5 hours to prepare a polymer solution including an acrylic copolymer.

[0051] The above-mentioned acrylic copolymer was poured into 5,000 parts by weight of hexane and separated by filtration after precipitation, then added 200 parts by weight of propionate and heated to 30 ° C, the solid concentration was 45% by weight, and the weight of the polymer was The average molecular weight was 11,000. In this case, the weight average molecular weight is the polystyrene conversion average molecular ...

no. 3 example

[0052] The third embodiment (preparation of organic-inorganic composite photosensitive resin composition)

[0053] 100 parts by weight of polymer solution comprising the above-mentioned acrylic copolymer, 15 parts by weight of photoinitiator Irgacure 819, 40 parts by weight of dipentaerythritol hexaacrylate and 10 parts by weight of trimethylol Propane triacrylate, 1 part by weight of silicon-based compound 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 2 parts by weight of silicon-based surfactant F171 were mixed. After adding diethylene glycol dimethyl ether to the above mixture, it was dissolved so that the solid content concentration became 35% by weight.

[0054] The mixing weight ratio of the prepared above-mentioned acrylic copolymer and the inorganic sol prepared in the first embodiment is 95:5.

[0055] Use a 0.2 μm microporous filter to filter the organic-inorganic composite resin composition prepared above to remove impurities. At this time, the viscosity is 15 ...

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Abstract

The invention relates to an organic-inorganic composite photosensitive resin combination and a liquid crystal display component comprising the hardened combination. The photosensitive resin combination comprises: a) colloidal state inorganic sol; b) acrylic copolymer; c) photoinitiator; d) polyfunctional monomer; e) silicon compound; and f) solvent. The organic-inorganic composite photosensitive resin combination achieves excellent low dielectric property, cohesive force, heat endurance, insulatibity, evenness and chemical resistance, is suitable imaging material for liquid crystal display component; the advantages of excellent dielectric constant, evenness, sensitivity, defective film rate and UV transmissivity of the composition play good roles while producing liquid crystal display components, so besides as a passivation organic insulation film in low dielectricity, the compositon also can be used as photoresistive resin in protective layer, a black matrix,, column divider or colorfilter. The composition also achieves the advantages of low dielectric property, high heat endurance and improved cohesive force.

Description

technical field [0001] The present invention relates to an organic-inorganic composite photosensitive resin composition for passivation and a liquid crystal display element using its hardened body. Especially relate to a kind of photosensitive resin composition that has good properties such as low dielectric property, cohesive force, heat resistance, insulation, flatness and chemical resistance and is suitable as the imaging material of liquid crystal display element; For the organic insulating film of components, the photosensitive resin composition can exhibit good low dielectric constant, moisture resistance, adhesive force and heat resistance, so it is not only suitable for use as an organic insulating film, but also can be used for protective layers Photoresist resin, photoresist resin for black matrix, photoresist resin for column spacer or photoresist resin for color filter, and enhance heat resistance and adhesion. Background technique [0002] Generally speaking, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/075G03F7/028G02F1/1335
CPCG03F7/0007G03F7/0045G03F7/023G03F7/0233G03F7/027G03F7/028G03F7/032G03F7/033
Inventor 韩东熙姜铜弼姜东俊金柄郁尹赫敏吕泰勋崔相角崔守延
Owner KOREA ELECTROTECH RES INST