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Ultra-thick graphite heat-conducting film as well as preparation method and application thereof

A graphite heat-conducting film, ultra-thick technology, applied in chemical instruments and methods, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve the problem of affecting the performance of graphite film and downstream applications, difficult gas discharge, powder drop, etc. Problems, to avoid product delamination, high compressive strength, high thermal conductivity effect

Active Publication Date: 2021-12-14
ZHONGTIAN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the process of firing ultra-thick graphite heat-conducting film from traditional PI thick film, when high-temperature graphitization, the gas generated by foaming inside the film is not easy to discharge, which may easily lead to appearance defects such as delamination, powder falling, bending or even cracking. Seriously affect the performance and downstream application of graphite film

Method used

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  • Ultra-thick graphite heat-conducting film as well as preparation method and application thereof

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Experimental program
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Effect test

Embodiment 1

[0046] (1) Synthesis of core layer resin: 200.2g of 4,4'-diaminodiphenyl ether and 218g of pyromellitic dianhydride were successively added to 1.67kg of N,N-dimethylformamide, and the polycondensation reaction was carried out for 2 hours to obtain Core resin;

[0047] (2) Synthesis of foam layer resin: Add 200.2g of 4,4'-diaminodiphenyl ether and 218g of pyromellitic dianhydride to 1.67kg of N,N-dimethylformamide in sequence, and conduct polycondensation reaction for 2 hours. Then add 0.84 g of calcium hydrogen phosphate (particle size 500 nm) dispersed by ultrasonic waves, and conduct polycondensation reaction for 2 hours to obtain foamed layer resin;

[0048] (3) After vacuum defoaming, add chemical imidization reagents to the core layer and foam layer resin respectively, specifically add 204.2g of acetic anhydride and 25.8g of isoquinoline, and send them to the three-layer co-extrusion die head Extrusion-type film production, the middle is imidized resin for the core layer...

Embodiment 2

[0051] (1) Synthesis of core layer resin: 200.2 g of 4,4'-diaminodiphenyl ether and 218 g of pyromellitic dianhydride were sequentially added to 1.67 kg of N,N-dimethylformamide, and the polycondensation reaction was carried out for 2 hours;

[0052] (2) Synthetic foam layer resin: on the basis of the core layer resin formula, add 2.1 g of calcium hydrogen phosphate (particle size 500nm) dispersed through ultrasonic, and polycondense for 2 hours;

[0053] (3) After vacuum degassing, add chemical imidization reagents to the core layer and the foam layer resin respectively, specifically add 204.2g of acetic anhydride and 25.8g of isoquinoline, then core layer imidization resin and The imidized resin of the foaming layer is sent to the three-layer co-extrusion die for extrusion film making, the middle is the imidized resin of the core layer, and the imidized resin of the foaming layer is used on both sides, and the polyimide produced by extrusion is The thickness of the amine fil...

Embodiment 3

[0056] (1) Synthesis of core layer resin: 200.2 g of 4,4'-diaminodiphenyl ether and 218 g of pyromellitic dianhydride were sequentially added to 1.67 kg of N,N-dimethylformamide, and the polycondensation reaction was carried out for 2 hours;

[0057] (2) Synthetic foam layer resin: on the basis of the core layer resin formula, add 3.35 g of calcium hydrogen phosphate (particle size 500nm) dispersed through ultrasonic, and polycondense for 2 hours;

[0058] (3) After vacuum degassing, add chemical imidization reagents to the core layer and the foam layer resin respectively, specifically add 204.2g of acetic anhydride and 25.8g of isoquinoline, then core layer imidization resin and The imidized resin of the foaming layer is sent to the three-layer co-extrusion die for extrusion film making, the middle is the imidized resin of the core layer, and the imidized resin of the foaming layer is used on both sides, and the polyimide produced by extrusion is The thickness of the amine fi...

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Abstract

The invention aims to provide an ultra-thick graphite heat-conducting film. The graphite heat-conducting film is obtained by carbonizing, graphitizing, rolling and cutting a polyimide film, wherein the thickness of the graphite heat-conducting film is 40-90 microns, and the heat conductivity of the graphite heat-conducting film is greater than 1600 W / (m.K). The polyimide film is a three-layer co-extrusion type polyimide film, wherein foaming layers are arranged on two sides, and a middle layer is a core layer. According to the ultra-thick graphite heat-conducting film prepared in the invention, the defects of layering, powder falling, cracking and the like of the graphite film caused by unsmooth gas discharge in a firing process are avoided.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to an ultra-thick graphite heat-conducting film, a preparation method thereof, and an application thereof. Background technique [0002] With the advent of the 5G era, the communication frequency is getting higher and higher, the power consumption of electronic equipment is also increasing, and the heat generation is also increasing. The heat dissipation problem of electronic devices has become an urgent problem for 5G communication equipment. Polyimide (PI) film can obtain a highly oriented graphite film close to the structure of single crystal graphite after high temperature, and has excellent thermal conductivity. It is one of the core materials for electronic products to solve heat dissipation problems. However, the thickness of the current graphite heat-conducting film is generally less than 40 μm. If the heat flux is to be increased, the thickness of the graphite film must be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/205H05K7/20
CPCC01B32/205H05K7/20472
Inventor 刘贺金鹰曾彩萍杨继明曹义张维彦
Owner ZHONGTIAN ELECTRONICS MATERIALS CO LTD
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