Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

TSV-based compact power divider using parallel RC

A compact and power divider technology, applied in the direction of inductors, electric solid devices, semiconductor devices, etc., can solve the problems of transmission power leakage, etc., and achieve the effects of reducing electromagnetic interference, high integration, and reducing floor space

Pending Publication Date: 2021-12-17
XIAN UNIV OF TECH
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the Wilkinson power divider based on the traditional microstrip line structure is easy to cause the leakage of transmission power, so the research on the miniaturization and high performance Wilkinson power divider is the current research hotspot

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • TSV-based compact power divider using parallel RC
  • TSV-based compact power divider using parallel RC
  • TSV-based compact power divider using parallel RC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] The present invention is a compact power divider using parallel RC based on TSV (through silicon via), such as Figure 1~3 As shown, it includes an upper silicon dioxide layer 1 and a lower silicon dioxide layer 2 arranged in parallel up and down, and a silicon substrate 3 is filled between the upper silicon dioxide layer 1 and the lower silicon dioxide layer 2; the upper silicon dioxide layer 1 There are input compensation capacitors C in turn 1 , output isolation capacitor C 2 and isolation resistance R 2 , the input compensation capacitor C 1 , output isolation capacitor C 2 There is a TSV inductor L made by winding TSV4 in parallel 1 and the TSV inductor L made by winding the TSV arrangement 2 ;TSV inductance L 1 and TSV inductor L 2 It is arranged in the silicon substrate in the vertical direction. TSV inductor L 1 and TSV...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a TSV-based compact power divider using parallel RC. TheTSV-based compact power divider comprises an upper silicon dioxide layer and a lower silicon dioxide layer which are arranged in parallel up and down, wherein a silicon substrate is filled between the upper silicon dioxide layer and the lower silicon dioxide layer, an input end compensation capacitor C1, an input end isolation capacitor C2 and an isolation resistor R2 are sequentially arranged on the upper silicon dioxide layer in parallel, a TSV inductor L1 formed by arranging and winding TSVs and a TSV inductor L2 formed by arranging and winding TSVs are connected between the input end compensation capacitor C1 and the input end isolation capacitor C2 in parallel, the TSV inductor L1 and the TSV inductor L2 are arranged in the silicon substrate in the vertical direction. According to the invention, one-tenth wavelength transmission is realized, and the integration level and the performance of the power divider are improved.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional integrated circuits, and relates to a TSV-based compact power divider utilizing parallel RC. Background technique [0002] With the development of wireless communication technology, the application of passive devices working in the microwave radio frequency range is more and more extensive. As a multi-port microwave device, microwave power dividers occupy an important position in wireless communication systems. It can distribute the power signal according to the requirements of the communication system. Therefore, power dividers are widely used in civil fields such as mobile communication, satellite communication and wireless local area network, as well as in military fields such as aerospace, radar and remote sensing. With the advancement of science and technology, communication systems have higher and higher requirements for the integration and application performance of microwave pow...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/64H03H7/01
CPCH01L28/10H03H7/01
Inventor 王凤娟李瑞奇余宁梅杨媛朱樟明尹湘坤
Owner XIAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com