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A nerve fiber-shaped device, a chip prepared from the device and its preparation method

A nerve fiber and device technology, applied in the field of artificial nerve fiber chips, can solve the problems of reducing power supply, shortening response time, and lack of a good solution for long axonal nerve simulation, achieving strong air permeability, high sensitivity, and stability. high sex effect

Active Publication Date: 2022-05-17
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, three-terminal organic electrochemical transistors have been widely used in the field of bioelectronics, but real-world applications have unique requirements for device performance; Ions can shorten the response time (τ). In addition, geometric engineering can effectively improve the function of OECTs. For example, cross-shaped photosensitive elements have recently been used for highly sensitive biosensing of deoxyribonucleic acid (DNA); in integrated circuits, integrated Devices always require a smaller gate voltage (VTH) to reduce power supply, especially for portable or wearable devices; in terms of structure, OECTs require extremely short channel distances, planar devices are difficult to achieve, and vertical distribution is usually adopted structure to shorten the distance of the channel, and the fiber-like three-dimensional OECTs sensor can be easily realized through the cross structure; in terms of wearability, it is difficult to integrate the device into clothes and textiles with the process of planar structure, and the fiber-like three-dimensional OECTs OECTs sensors can be easily combined with textiles through the cross structure and flexible characteristics. The current OECTs devices can only be used to simulate the function of synapses, but there is no good solution for the neural simulation of long axons.

Method used

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  • A nerve fiber-shaped device, a chip prepared from the device and its preparation method
  • A nerve fiber-shaped device, a chip prepared from the device and its preparation method
  • A nerve fiber-shaped device, a chip prepared from the device and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] Example 1: Preparation of a novel three-dimensional artificial nerve fiber device:

[0075] Structure description:

[0076] image 3 It is a schematic diagram of the three-dimensional structure of the device in Embodiment 1 of the present invention. The device comprises a shell (1) and a fiber (2), and the shell (1) is arranged outside the fiber (2).

[0077] Figure 4 It is a schematic cross-sectional view of the device in Embodiment 1 of the present invention. The fiber (2) includes a skeleton (3), a first metal wire (4), an organic semiconductor layer (5), a second metal wire (6), a gel layer (7), a third metal wire (8) and External wires (9); the first metal wire (4) is helically wound on the outside of the frame (3), the organic semiconductor layer (5) is arranged on the outside of the frame (3) and the first metal wire (4), the second The second metal wire (6) is spirally wound on the outside of the organic semiconductor layer (5), the gel layer (7) is arrang...

Embodiment 2

[0106] Example 2: Preparation of an artificial nerve fiber chip with an external imitation optic nerve long axon:

[0107] Structure description:

[0108] Image 6 It is a schematic diagram of the three-dimensional structure of the chip in Embodiment 2 of the present invention. The chip includes a photosensitive module group (101), a control module (102) and wires (103).

[0109] Figure 7 It is a schematic cross-sectional structure diagram of the control module of the second embodiment of the present invention. The control module (102) includes a shell (1), a skeleton (3), a first metal wire (4), an organic semiconductor layer (5), a second metal wire (6), a gel layer (7), a third Metal wire (8) and external line (9);

[0110] Specifically, the first metal wire (4) is helically wound on the outside of the frame (3), the organic semiconductor layer (5) is arranged on the outside of the frame (3) and the first metal wire (4), and the second metal wire (6) Helically wound ...

Embodiment 3

[0160] Embodiment 3: Preparation of an artificial nerve fiber chip for detecting pH:

[0161] Structure description:

[0162] Figure 10 It is a schematic diagram of the chip structure of Embodiment 3 of the present invention. The chip includes a shell (1) and a fiber (2), and the shell (1) is arranged outside the fiber (2).

[0163] Figure 11 It is a schematic diagram of a cross-sectional structure of a chip according to Embodiment 3 of the present invention. The fiber (2) includes a skeleton (3), a first metal wire (4), an organic semiconductor layer (5), a second metal wire (6), a gel layer (7), a third metal wire (8), A pH-sensitive membrane (10) and a window (11), wherein the pH-sensitive membrane (10) may be a bromothymol blue (BTB) membrane.

[0164] The first metal wire (4) is helically wound on the outside of the frame (3), the organic semiconductor layer (5) is arranged on the outside of the frame (3) and the first metal wire (4), and the second metal wire (6) ...

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Abstract

The invention claims to protect a nerve fiber-shaped device, a chip prepared from the device and a preparation method, and belongs to the technical field of artificial nerve fiber-shaped chips; the technical problem to be solved is: to provide a nerve fiber-shaped device and a chip structure prepared from the device and the improvement of the preparation method; the technical solution adopted to solve this technical problem is: comprising a shell and fibers, the shell is arranged on the outside of the fiber, the fiber is a multi-layer structure, and the fiber is sequentially provided with a skeleton, the first A metal wire, an organic semiconductor layer, a second metal wire, a gel layer, and a third metal wire; the first metal wire is wound spirally on the outside of the skeleton; the organic semiconductor layer covers the outside of the skeleton and the first metal wire, and the second metal The wire is spirally wound outside the organic semiconductor layer; the gel layer covers the organic semiconductor layer and the outside of the second metal wire, and the third metal wire is spirally wound outside the gel layer; the invention is applied to biosensing.

Description

technical field [0001] The invention claims to protect a nerve fiber-shaped device, a chip prepared from the device and a preparation method, belonging to the technical field of artificial nerve fiber-shaped chips. Background technique [0002] Organic electrochemical transistors (OECTs) have great application potential in the field of bioelectronics due to their advantages of low operating voltage, flexibility and good biocompatibility; the basic element in the biological nervous system is the synapse, which is used in the Numerous neurons transmit spatiotemporal information; relying on adjustable synaptic weights, the biological nervous system can perform a series of functions with high efficiency and low energy consumption, including perception, transmission and response to external stimuli. Inspired by this, artificial synapses can be used to receive, respond and output information. [0003] At present, in the field of artificial sensing systems, researchers have report...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/05H01L51/40G01N27/26G06N3/067
CPCG01N27/26G06N3/0675H10K10/46Y02E10/549
Inventor 高志鹏彭钰博刘燃冀健龙马晓璐陈维毅
Owner TAIYUAN UNIV OF TECH