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High-performance epoxy encapsulating material

A potting material, high-performance technology, applied in epoxy resin glue, non-polymer adhesive additives, adhesive types, etc., can solve the problems of high filler dosage, low efficiency, unfavorable mechanical properties, etc. Chemically stable and environmentally friendly

Pending Publication Date: 2022-01-04
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent uses bisphenol F epoxy resin with a higher price, the mass dosage of aluminum hydroxide is 9%, and the mass dosage of aluminum oxide is as high as 54%. The inorganic material filler improves the resistance of the material system to environmental damage factors, but The amount of filler is too high, which is not conducive to the basic mechanical properties, such as compressive strength and impact strength
In addition, aluminum hydroxide and aluminum oxide exist in the state of particles or powder in epoxy resin, and the efficiency of resisting environmental factors is relatively low.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 100 parts epoxy resin E-51, 2 parts tetrafunctional epoxy resin N,N,N',N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane and 32 parts 1,4- Add butanediol diglycidyl ether to the mixing tank and stir, add 12 parts of silane coupling agent to treat kaolin, stir evenly, add 25 parts of polyamide 650, 5 parts of fatty amine 593, 2 parts of 2,4,6-tri( Dimethylaminomethyl)phenol. Mix well at room temperature, remove air bubbles, potting, and complete curing at 40°C.

[0020] Determination of compressive strength and elastic modulus: the determination method refers to GB / T2567-2008.

Embodiment 2

[0022] The implementation steps are the same as in Example 1, except that the tetrafunctional epoxy resin N, N, N', N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane is replaced by a trifunctional ring Oxygen resin 3-(2,3-epoxypropoxy)-N, N-bis(2,3-epoxypropyl) aniline, kaolin changed from 12 parts to 20 parts.

[0023] Performance measurement: the method is the same as in Example 1.

Embodiment 3

[0025] The implementation steps are the same as Example 1, except that kaolin is not treated with coupling agent.

[0026] Performance measurement: the method is the same as in Example 1.

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Abstract

The invention relates to a high-performance epoxy encapsulating material. The encapsulating material is prepared by compounding and encapsulating organic component epoxy resin, a diluent, a curing agent, an accelerant and an inorganic filler at room temperature, and curing at the temperature of 40-60 DEG C. According to the invention, the protective effect of the epoxy encapsulating material on electronic components, electronic component combinations and circuit boards is improved in high-humidity, strong-ultraviolet and high-salt-fog environments through the kaolin dispersed in a layered manner. The cured product does not contain harmful volatile matters and is beneficial to environmental protection.

Description

technical field [0001] The invention relates to a potting material for electronic components, and more particularly to a high-performance epoxy potting material. Background technique [0002] Epoxy resin encapsulation of electronic components can block air, moisture and carbon dioxide, improve the working environment of electronic components, electronic component combinations, and circuit boards, prolong the service life of components, and also improve the transportation and use of electronic components. Stability during the process, preventing mechanical forces such as vibration and impact from damaging electronic components, combinations of electronic components, and circuit boards. However, traditional epoxy resin potting materials have limited barrier properties after curing, and it is difficult for electronic components, electronic component combinations, and circuit boards to work normally in high temperature, high humidity, strong ultraviolet and high salt spray envir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08L2203/20C08L63/00C08K3/346C08K9/06
Inventor 张福强闫怀洁李志鹏秦治远殷福星
Owner HEBEI UNIV OF TECH
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