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PI/PEEK composite insulation lapped wire and preparation method thereof

A composite insulation and wrapping wire technology, used in conductor/cable insulation, insulated cables, insulated conductors, etc., can solve the problems of low interface bonding strength, low long-term thermal aging performance, and high regularity, and achieve improved bonding. Strength, improved roughness and chemical polarity, improved thermal performance

Pending Publication Date: 2022-01-21
沈阳方舟石油科技发展有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the molecular chain regularity of PEEK and PI is high, and the interfacial bonding strength between them is low; the long-term thermal aging performance of PEEK resin is also lower than that of PI film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Set the discharge power of the low-temperature air plasma to 100 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 10 seconds to obtain a PI film with an active surface;

[0023] Mix commercially available 500-mesh PEEK ultrafine powder with water to make a PEEK suspoemulsion, add nano-scale lanthanum trioxide, the mass of lanthanum trioxide and PEEK is 0.5:100, stir well until the dispersion is uniform to obtain a PEEK emulsion;

[0024] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;

[0025] Wrap PI / PEEK composite film on the surface of the metal wire, and sinter at 350°C to form an insulating layer on the surface of the metal wire to obtain PI / PEEK composite insulated wrapping wire.

Embodiment 2

[0027] Set the discharge power of the low-temperature air plasma to 600 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 1 second to obtain a PI film with an active surface;

[0028] Mix commercially available 2000-mesh PEEK ultrafine powder with water to make PEEK suspoemulsion, add nano-scale lanthanum trioxide, the quality of lanthanum trioxide and PEEK is 1.5:100, stir well until the dispersion is uniform to obtain PEEK emulsion;

[0029] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;

[0030] Wrap PI / PEEK composite film on the surface of the metal wire, sinter at 380°C to form an insulating layer on the surface of the metal wire, and obtain the PI / PEEK composite insulated wrapping wire.

Embodiment 3

[0032] Set the discharge power of the low-temperature air plasma to 400 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 6 seconds to obtain a PI film with an active surface;

[0033] Mix commercially available 1000-mesh PEEK ultrafine powder with water to make PEEK suspoemulsion, add nano-scale lanthanum trioxide, the mass of lanthanum trioxide and PEEK is 1:100, stir well until the dispersion is uniform to obtain PEEK emulsion;

[0034] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;

[0035] A PI / PEEK composite film is wrapped on the surface of the metal wire, and sintered at 360°C to form an insulating layer on the surface of the metal wire to obtain a PI / PEEK composite insulated wrapping wire.

[0036] The invention uses low-temperature air plasma to oxidize and etch the PI film, forms nanoscale pits on the surface of the PI film and introduces polar groups, ...

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Abstract

The invention discloses a PI / PEEK composite insulation lapped wire and a preparation method thereof. The preparation method comprises the following steps: carrying out oxidation etching treatment on the surface of a high-temperature-resistant polyimide PI film; spraying PEEK emulsion on the surface of the PI film subjected to oxidation etching treatment, and drying to obtain a PI / PEEK composite film; and wrapping the PI / PEEK composite film on the surface of the metal wire, and sintering at 350-380 DEG C to form an insulating layer on the surface of the metal wire. The preparation method of the PI / PEEK composite insulation lapped wire provided by the invention has important influence on the improvement of the heat resistance grade of the electromagnetic wire and the reliability and durability of the insulation structure of the electromagnetic wire, is also beneficial to prolonging the service life of electrical equipment such as a motor, and has bright application prospects.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wire insulation, in particular to a PI / PEEK composite insulated wrapping wire and a preparation method thereof. Background technique [0002] Electromagnetic wire is a kind of insulated wire used to manufacture coils or windings in electrical products such as motors, electrical appliances, instruments, and transformers; the electromagnetic effect is generated by winding the coil, and the purpose of converting electric energy and magnetic energy is realized by using the principle of electromagnetic induction. Called winding wire. The electromagnetic wire must be able to meet the needs of short-term and long-term work at high temperature, withstand corona and breakdown under high voltage, strong vibration in some occasions and centrifugal force at high speed; the performance of the insulating layer on the surface of the electromagnetic wire is The key to affecting its performance, most of t...

Claims

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Application Information

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IPC IPC(8): H01B13/06H01B13/00H01B7/28H01B7/29H01B7/02
CPCH01B13/06H01B13/0016H01B7/292H01B7/28H01B7/0291H01B7/0216Y02A30/14
Inventor 曲丽峰熊需海王静曲方舟
Owner 沈阳方舟石油科技发展有限公司
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