PI/PEEK composite insulation lapped wire and preparation method thereof
A composite insulation and wrapping wire technology, used in conductor/cable insulation, insulated cables, insulated conductors, etc., can solve the problems of low interface bonding strength, low long-term thermal aging performance, and high regularity, and achieve improved bonding. Strength, improved roughness and chemical polarity, improved thermal performance
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Embodiment 1
[0022] Set the discharge power of the low-temperature air plasma to 100 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 10 seconds to obtain a PI film with an active surface;
[0023] Mix commercially available 500-mesh PEEK ultrafine powder with water to make a PEEK suspoemulsion, add nano-scale lanthanum trioxide, the mass of lanthanum trioxide and PEEK is 0.5:100, stir well until the dispersion is uniform to obtain a PEEK emulsion;
[0024] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;
[0025] Wrap PI / PEEK composite film on the surface of the metal wire, and sinter at 350°C to form an insulating layer on the surface of the metal wire to obtain PI / PEEK composite insulated wrapping wire.
Embodiment 2
[0027] Set the discharge power of the low-temperature air plasma to 600 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 1 second to obtain a PI film with an active surface;
[0028] Mix commercially available 2000-mesh PEEK ultrafine powder with water to make PEEK suspoemulsion, add nano-scale lanthanum trioxide, the quality of lanthanum trioxide and PEEK is 1.5:100, stir well until the dispersion is uniform to obtain PEEK emulsion;
[0029] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;
[0030] Wrap PI / PEEK composite film on the surface of the metal wire, sinter at 380°C to form an insulating layer on the surface of the metal wire, and obtain the PI / PEEK composite insulated wrapping wire.
Embodiment 3
[0032] Set the discharge power of the low-temperature air plasma to 400 watts, and oxidize and etch the surface of the high-temperature-resistant polyimide PI film for 6 seconds to obtain a PI film with an active surface;
[0033] Mix commercially available 1000-mesh PEEK ultrafine powder with water to make PEEK suspoemulsion, add nano-scale lanthanum trioxide, the mass of lanthanum trioxide and PEEK is 1:100, stir well until the dispersion is uniform to obtain PEEK emulsion;
[0034] Spray PEEK emulsion evenly on the surface of PI film with active surface, and dry to obtain PI / PEEK composite film;
[0035] A PI / PEEK composite film is wrapped on the surface of the metal wire, and sintered at 360°C to form an insulating layer on the surface of the metal wire to obtain a PI / PEEK composite insulated wrapping wire.
[0036] The invention uses low-temperature air plasma to oxidize and etch the PI film, forms nanoscale pits on the surface of the PI film and introduces polar groups, ...
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Abstract
Description
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Application Information

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