PI/PEEK composite insulation lapped wire and preparation method thereof

A composite insulation and wrapping wire technology, used in conductor/cable insulation, insulated cables, insulated conductors, etc., can solve the problems of low interface bonding strength, low long-term thermal aging performance, and high regularity, and achieve improved bonding. Strength, improved roughness and chemical polarity, improved thermal performance

Pending Publication Date: 2022-01-21
沈阳方舟石油科技发展有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the molecular chain regularity of PEEK and PI is high, and the interfacial bonding strength betw

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] The discharge power of the low temperature air plasma is disposed of 100 watts, and the surface of the high temperature polyimide PI film is oxidized etching for 10 seconds to obtain a PI film having an active surface;

[0023] The commercially available 500 destination PEEK ultrafine powder was mixed with water to prepare a PEEK suspension, adding nano-stage trioxide, the mass of the trioxide and the PEEK of 0.5: 100, stirred until dispersion uniformly obtained PEEK emulsion;

[0024] The PEEK emulsion was sprayed onto the surface of the PI film having the active surface, dried to obtain a PI / PEEK composite film;

[0025] In the surface of the metal wire surface, the PI / PEEK composite film is sintered at 350 ° C to form an insulating layer on the surface of the metal wire, and the PI / PEEK composite insulated winding line is obtained.

Example Embodiment

[0026] Example 2

[0027] The discharge power of the low temperature air plasma is set to 600 watts, and the surface of the high temperature polyimide PI film is oxidized etching for 1 second, and a PI film having an active surface is obtained;

[0028] Mix the commercially available 2000 Purpose PEEK ultrafine powder and water to prepare a PEEK suspension, add nano-grade trioxide, and the mass of the trioxide and PEEK is 1.5: 100, stirred until dispersion is uniformly obtained.

[0029] The PEEK emulsion was sprayed onto the surface of the PI film having the active surface, dried to obtain a PI / PEEK composite film;

[0030] In the surface of the metal conductor, the PI / PEEK composite film is sintered at 380 ° C to form an insulating layer on the surface of the metal wire, and the PI / PEEK recombination is obtained.

Example Embodiment

[0031] Example 3

[0032] The discharge power of the low temperature air plasma is set to 400 watts, and the surface of the high temperature polyimide PI film is oxidized etching for 6 seconds to obtain a PI film having an active surface;

[0033] The commercially available 1000 destination PEEK ultrafine powder was mixed with water to prepare a PEEK suspension, adding nano-grade trioxide, the mass of trioxide and PEEK is 1: 100, thoroughly stirred to dispersion uniformly obtain PEEK emulsion;

[0034] The PEEK emulsion was sprayed onto the surface of the PI film having the active surface, dried to obtain a PI / PEEK composite film;

[0035] In the surface of the metal conductor, the Pi / PEEK composite film is sintered at 360 ° C to form an insulating layer on the surface of the metal wire, and the PI / PEEK recombination is obtained.

[0036] The present invention is a low temperature air plasma to form an oxidative etching treatment in the surface of the PI film, and the polar ...

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PUM

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Abstract

The invention discloses a PI/PEEK composite insulation lapped wire and a preparation method thereof. The preparation method comprises the following steps: carrying out oxidation etching treatment on the surface of a high-temperature-resistant polyimide PI film; spraying PEEK emulsion on the surface of the PI film subjected to oxidation etching treatment, and drying to obtain a PI/PEEK composite film; and wrapping the PI/PEEK composite film on the surface of the metal wire, and sintering at 350-380 DEG C to form an insulating layer on the surface of the metal wire. The preparation method of the PI/PEEK composite insulation lapped wire provided by the invention has important influence on the improvement of the heat resistance grade of the electromagnetic wire and the reliability and durability of the insulation structure of the electromagnetic wire, is also beneficial to prolonging the service life of electrical equipment such as a motor, and has bright application prospects.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wire insulation, in particular to a PI / PEEK composite insulated wrapping wire and a preparation method thereof. Background technique [0002] Electromagnetic wire is a kind of insulated wire used to manufacture coils or windings in electrical products such as motors, electrical appliances, instruments, and transformers; the electromagnetic effect is generated by winding the coil, and the purpose of converting electric energy and magnetic energy is realized by using the principle of electromagnetic induction. Called winding wire. The electromagnetic wire must be able to meet the needs of short-term and long-term work at high temperature, withstand corona and breakdown under high voltage, strong vibration in some occasions and centrifugal force at high speed; the performance of the insulating layer on the surface of the electromagnetic wire is The key to affecting its performance, most of t...

Claims

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Application Information

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IPC IPC(8): H01B13/06H01B13/00H01B7/28H01B7/29H01B7/02
CPCH01B13/06H01B13/0016H01B7/292H01B7/28H01B7/0291H01B7/0216Y02A30/14
Inventor 曲丽峰熊需海王静曲方舟
Owner 沈阳方舟石油科技发展有限公司
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