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High-purity gold-silver-palladium-platinum alloy bonding wire and preparation method thereof

An alloy bonding, gold and silver technology, applied in metal processing equipment, equipment for feeding molten metal into casting molds, casting equipment, etc., can solve problems such as unsatisfactory mixing effect, waste of water resources, waste of cooling heat of casting molds, etc. To achieve the effect of shortening the time required for smelting, speeding up the cooling rate, and reducing equipment costs

Pending Publication Date: 2022-02-01
江西蓝微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above preparation process, when gold, palladium and some silver are mixed mechanically, it is usually carried out by extrusion mixing at room temperature, and the mixing effect is not ideal. At the same time, in the subsequent process of preparing ingots, in order to To reduce production costs within a reasonable range, permanent casting molds are usually used to make ingots. When using permanent casting molds, it is also necessary to set up a supporting water cooling system to ensure rapid cooling of the casting molds, but this will lead to water resources in the preparation process. waste, and the heat when the mold is cooled will also be wasted

Method used

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  • High-purity gold-silver-palladium-platinum alloy bonding wire and preparation method thereof
  • High-purity gold-silver-palladium-platinum alloy bonding wire and preparation method thereof
  • High-purity gold-silver-palladium-platinum alloy bonding wire and preparation method thereof

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Effect test

Embodiment 1

[0040] The invention provides a high-purity gold-silver-palladium-platinum alloy bonding wire, which contains 4-7% of gold, 85-94% of silver, 3-4% of palladium and 1-2% of platinum.

Embodiment 2

[0042] The present invention also provides a method for preparing a high-purity gold-silver-palladium-platinum alloy bonding wire. The method is realized by using a preheating preparation device. The preheating preparation device includes an equipment box 1, and the top of the equipment box 1 is provided with The vacuum smelting mechanism 2 and the preheating mechanical mixing mechanism 3, the preheating mechanical mixing mechanism 3 is located on the left side of the vacuum smelting mechanism 2, and the vacuum smelting mechanism 2 melts the first batch of materials and the second batch of materials , the first hydraulic cylinder 33 in the preheating mechanical mixing mechanism 3 drives the pressure plate 32 to pressurize and mix the first batch of materials, and the equipment box 1 is provided with a casting mechanism 4 and a waste heat utilization mechanism 5. The molten metal output pipe 25 in the vacuum smelting mechanism 2 inputs the smelted molten metal into the casting m...

Embodiment 3

[0056] Described method specifically comprises the following steps:

[0057] S1. Addition of raw materials: During the discharge of molten metal produced in the previous processing step, the first batch of materials is stacked on the top of the metal carrier plate 34, and the second batch of materials is put into the left chamber of the hopper 63 At this time, the first batch of materials presses the elastic member 35 through the metal bearing plate 34, and the metal bearing plate 34 drives the second blocking block 39 to descend through the lifting cross bar 38. At this time, the hot air distribution pipe 54 is located at the first The output end inside the housing 31 is opened, and the output end of the hot air distribution pipe 54 located inside the second housing 55 is blocked;

[0058]S2. Utilization of waste heat and preheating of the first batch of materials: start the vacuum pump 52, and the vacuum pump 52 extracts the air inside the top cover 61 through the vacuum tub...

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Abstract

The invention discloses a high-purity gold-silver-palladium-platinum alloy bonding wire and a preparation method thereof, and relates to the technical field of alloy materials. The high-purity gold-silver-palladium-platinum alloy bonding wire comprises the following components in percentage by weight: 4-7% of gold, 85-94% of silver, 3-4% of palladium and 1-2% of platinum. According to the invention, no matched water cooling needs to be arranged during actual implementation, so that the equipment cost is reduced, waste heat generated in the cooling process can be recycled, the mechanical mixing effect of the first batch of raw materials is more ideal, the time required by the process is further shortened, and more energy conservation and environmental protection are realized while the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of alloy materials, in particular to a high-purity gold-silver-palladium-platinum alloy bonding wire and a preparation method thereof. Background technique [0002] Bonding wire is an essential material to realize the function of the chip. Although the chip obtained after the semiconductor integrated circuit is manufactured has a specific function, but to realize this function, it must be connected with external electronic components, and the semiconductor integrated circuit chip needs After the bonding process with the package body, the chip package is finally obtained, so that the pins of the package can be connected to external electronic components. In the bonding process of the chip and the package body, the pads on the chip and the The pins of the package are electrically connected. [0003] Bonding wires can be divided into many types according to different metal materials. Among them, gold-silver-pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/06B22D7/00B22D7/06B22D27/04C22F1/14B22D35/04F27D17/00F27B14/04F27B14/06F27B14/08F27B14/14F27D13/00
CPCH01L24/45H01L24/43H01L21/4885C22C5/06B22D7/005B22D7/064C22F1/14B22D35/04F27D17/004F27B14/061F27B14/04F27B14/08F27B14/14F27D13/00H01L2224/45139H01L2224/45144H01L2224/45164H01L2224/45169H01L2224/43H01L2224/43985Y02P10/25H01L2924/00011H01L2924/01049
Inventor 彭庶瑶彭晓飞
Owner 江西蓝微电子科技有限公司
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