Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Local porous silicon microneedle array and preparation method thereof

A microneedle array, porous silicon technology, applied in the field of silicon microneedles, achieves the effects of adjustable drug release, flexible drug loading, and large drug loading

Pending Publication Date: 2022-02-08
JIANGSU UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the research on the preparation of porous silicon microneedles or partially porous silicon microneedles for transdermal drug delivery is very rare, and there is room for development and research

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Local porous silicon microneedle array and preparation method thereof
  • Local porous silicon microneedle array and preparation method thereof
  • Local porous silicon microneedle array and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] A method for preparing a partially porous silicon microneedle array, see figure 1 and combine figure 2 , Figure 4 shown. figure 2 The above is an array of 3 needles.

[0054] The preparation method of the local porous silicon microneedle array comprises the following steps:

[0055] Step S1, preparing a double-layer thin film on the surface of the silicon wafer, specifically includes the following steps:

[0056] 1.1. Put the P-type monocrystalline silicon wafer 3 with (100) crystal orientation, preferably with a thickness of 525 ± 25 μm, into a beaker filled with deionized water, ethanol and acetone in turn for ultrasonic cleaning to remove the silicon wafer surface. Impurities are dried and dehydrated, wherein the P-type single crystal silicon wafer is heavily doped, preferably, the resistance value is 0.01-0.02Ωcm.

[0057] 1.2. Submerge the above-mentioned silicon wafer in the first mixed solution for 3 minutes to prepare a hydrogen-terminated silicon (H-Si)...

Embodiment 2

[0077] A method for preparing a locally porous silicon microneedle array. The difference in structure between this example 2 and the locally porous silicon microneedle array in Example 1 is that the locally porous silicon on the tip of the microneedle is composed of regular macroscopic pore array, and the partially porous silicon in Example 1 is mesoporous silicon, see figure 1 and combine image 3 , Figure 4 , Figure 5 shown. In order to more clearly show the local porous silicon microneedle structure in this embodiment, image 3 Only the preparation process and structure of a single partially porous silicon microneedle are expressed, but in fact the microneedles in this embodiment have an array structure.

[0078] The preparation method of the local porous silicon microneedle array in this embodiment comprises the following steps:

[0079] Step S1, preparing a double-layer thin film on the surface of the silicon wafer, specifically includes the following steps:

[00...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a local porous silicon microneedle array and a preparation method thereof. The preparation method comprises the following steps: S1, preparing a double-layer film on the surface of a silicon wafer; s2, transferring the pattern of the mask plate, and preparing an electrochemical etching mask on the silicon wafer; s3, performing electrochemical etching, and preparing local porous silicon on the silicon wafer; s4, preparing a patterned aluminum mask subjected to dry etching on the silicon wafer; and S5, preparing a local porous silicon microneedle array on the silicon wafer. Compared with a common solid microneedle, a local porous silicon layer is prepared on the tip of the microneedle; according to the structure, the drug loading capacity of the microneedle can be increased by utilizing a relatively large surface area; the control ability of the microneedle to drug release is enhanced by adjusting the property of the porous silicon; two drug loading modes are provided, and tissue fluid can be extracted by utilizing a macro-hole array with a high aspect ratio; compared with a full-porous silicon microneedle, the structure has the advantage that the mechanical property and the puncture capacity of the microneedle are remarkably enhanced.

Description

technical field [0001] The invention belongs to the technical field of silicon microneedles, and in particular relates to a partially porous silicon microneedle array and a preparation method thereof. Background technique [0002] Transdermal drug delivery is an efficient drug delivery method with great potential. Its principle is that drugs pass through the epidermis of the skin to reach the dermis through diffusion or penetration, and then are absorbed into the systemic circulation by capillaries, so as to achieve the goal of drug delivery. Purpose. Compared with traditional oral administration, transdermal administration can avoid problems such as the degradation of some drugs in the body due to pH changes, low permeability when passing through the intestinal wall into the blood, and the first-pass effect of the liver. The way of administration is easier to be accepted by patients, so it is more suitable for long-term treatment. In 2019, the market value of transdermal ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A61M37/00C25F3/04C25F3/12C25F3/14
CPCA61M37/0015C25F3/14C25F3/12C25F3/04A61M2037/0023A61M2037/0053A61M2037/0046
Inventor 张立强朱晨曦葛道晗周卓然曾洲
Owner JIANGSU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com