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Modified bismaleimide prepolymer, composition prepared from modified bismaleimide prepolymer, prepreg, and laminated plate

A bismaleimide and prepolymer technology, which is applied in the field of modified bismaleimide prepolymers and thermosetting resin compositions prepared by using them, can solve prepolymer precipitation, peel strength drop, Short storage period and other problems, to achieve the effect of prolonging the prepolymerization time, improving the prepolymerization process, and excellent heat resistance

Pending Publication Date: 2022-02-08
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Yet, allyl compound modified bismaleimide resin still has several problems: 1, the prepolymer gelation time in the modification process is shorter, and the storage period is shorter under normal temperature, if in order to prolong If the gelation time is shortened or the prepolymerization temperature is lowered, the prepolymer obtained after modification will have a precipitation problem after being dissolved in a solvent, so this problem has been difficult to solve
2. After the high-temperature treatment of the copper clad laminate prepared by the prepolymer, the peel strength drops significantly
Specifically, from a theoretical analysis, the polysiloxane oligomer with two or more epoxy structures in this patent has extremely high reactivity, and can react with a multifunctional compound to generate a cured product with a crosslinked structure, making the combination It has excellent bonding performance and chemical resistance, which enables it to be used in the fields of coatings, sealants, and adhesives, so the properties of the organic resin itself have not been improved.

Method used

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  • Modified bismaleimide prepolymer, composition prepared from modified bismaleimide prepolymer, prepreg, and laminated plate
  • Modified bismaleimide prepolymer, composition prepared from modified bismaleimide prepolymer, prepreg, and laminated plate
  • Modified bismaleimide prepolymer, composition prepared from modified bismaleimide prepolymer, prepreg, and laminated plate

Examples

Experimental program
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Effect test

preparation example Construction

[0045] Preparation of epoxy silane oligomer Ⅰ: Add 3-glycidoxypropyl methyl diethoxy silane (124g, 0.5mol) in a 1000ml three-necked flask, stirred open, and then gradually added 50g manner titration aqueous boric acid solution (molar concentration of boric acid of 0.01mol / L), to control the temperature of 15 ~ 30 ℃, under normal pressure 18h. The mixture was then heated to 80 ℃, vacuum distillation 3h, cooled after distillation, sealed and stored until use.

[0046] Epoxy silane oligomer Ⅱ: Momentive coatosil MP200. By the formula Hydrolysis, prepared by a condensation reaction, wherein, R1, R2, R3 is a saturated alkane group having 1 to 5 carbon atoms, R4 is a saturated alkane or alkoxy group having 1 to 5 carbon atoms.

[0047] Benzene aminosilane: Momentive silquest Y-9669, of formula

[0048]

Embodiment 1

[0051] 500mL beaker was added 140 g of diallyl bisphenol A, bis (4-maleimide phenyl) methane 200g, phenylamino silane 8g, the reaction 90min at 140 deg.] C, then cooled to 110 deg.] C, was added Epoxy silane oligomer ⅰ12g, reaction was continued for 30min at 110 ℃, to obtain prepolymer Y1. The prepolymer was dissolved in acetone Y1, a solid content of 60%.

[0052] Solubility prepolymer acetone: preparation prepolymerization, 60% acetone solution dubbed, solubility and precipitation situation observed after 5 days.

[0053] Meanwhile, the method of this embodiment, respectively, to adjust the quality and epoxy silane oligomer Ⅰ aminosilane percent benzene to obtain prepolymer Y1-1, Y1-2, Y1-3, Y1-4, particularly the proportion shown in Table 1.

Embodiment 2

[0055] In a 500mL beaker was added allyl bisphenol A 100g, bis (4-maleimide phenyl) methane 200g, benzene aminosilane Y-9669 10g, 140 ℃ reaction 70min, then cooled to 110 ℃, added ring oxygen silane oligomer ⅱ16g, reaction was continued for 30min at 110 ℃, to obtain prepolymer Y2. The prepolymer was dissolved in acetone Y2, solids content of 60%.

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Abstract

The invention provides a modified bismaleimide prepolymer. The modified bismaleimide prepolymer is prepared through a pre-reaction and a polymerization reaction. The pre-reaction comprises the step of performing a reaction on a bismaleimide compound, an allyl compound and an amino compound. Then, an epoxy silane oligomer is added to continue reaction, so as to obtain the modified bismaleimide prepolymer. The equivalence ratio of a double bond in the bismaleimide compound to a double bond in the allyl compound is 5 to 0.5. The sum of the bismaleimide compound and the allyl compound is 100 parts by weight, the addition amount of the amino compound is 0.5-5 parts by weight, and the addition amount of the epoxy silane oligomer is 0.5-10 parts by weight. The epoxy silane oligomer and the amino compound in a certain proportion are added in the prepolymerization process of the allyl compound modified bismaleimide, so that the prepolymerization process is improved, the prepolymerization time and the gelatinization time of the prepolymer are prolonged, and the storage period of the prepolymer is improved.

Description

Technical field [0001] The present invention relates to the field of electronic materials, in particular, it relates to a modified bismaleimide prepolymer and the preparation thereof using the thermosetting resin composition, prepreg and laminates, can be used in high heat, HDI, IC packaging and other fields. Background technique [0002] Bismaleimide resins have excellent heat resistance, the advantages of heat resistance, high rigidity, resistance to radiation and the like, but bismaleimide very brittle cured product can not be used alone, subject to modification after use. In the prior art, the main method of the bismaleimide compound include amine-modified Michael addition reaction of an allyl compound and the modified diene ENE addition modification. [0003] Amine compound-modified bismaleimide resins, while improving toughness, but the toughness is limited degree of improvement, and the modified resin were dissolved in only some of the high-boiling solvent, such as DMF, DM...

Claims

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Application Information

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IPC IPC(8): C08G73/12C08L79/08C08K7/14B32B17/02B32B17/12B32B15/20B32B15/14B32B27/04B32B27/28
CPCC08G73/126C08K7/14B32B5/02B32B5/26B32B15/20B32B15/14B32B2250/40B32B2262/101B32B2307/306B32B2457/08B32B2260/021B32B2260/046C08L79/085
Inventor 黄荣辉崔春梅马建
Owner SHENGYI TECH SUZHOU
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