Use of polyphenol compounds and hydrophilic polymers for reducing or preventing colloids adhesion and/or fouling on substrate
A polyphenolic compound, polymer technology, used in polyether coatings, biocide-containing paints, antifouling/underwater coatings, etc., can solve problems such as functional damage
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example 1
[0175] Example 1. Modification of plastic surfaces
[0176] Modify polypropylene (PP), polycarbonate (PC), and polyvinyl chloride (PVC) substrates according to the following procedures.
[0177] Tannic acid (TA) powder (2 mg / mL) was dissolved in 0.1 M Bicine buffer containing 0.6 M NaCl, after which the pH was adjusted to pH 7.8. The plastic substrates were each immersed in the TA solution for the desired amount of time (1, 2, 4, 7 and 22 h), and then washed with pH 7.4 (1st wash) and pH 5 (2nd wash). Wash with 0.01M phosphate buffer. The modified surface was treated with a hydrophilic polysulfobetaine polymer (poly(sulfopropyldimethylammonioethyl methacrylate); "pSPE") solution [1 mg / mL, 0.17M NaCl, from 2 pH to 7] for 5 to 15 min, followed by washing with 0.01 M phosphate buffer with 0.17 M NaCl. in N 2 Dry the modified surface under ambient conditions or in air.
[0178] Regarding the TA solution, the 0.1M Bicine buffer was also replaced with 0.01M phosphate buffer or ...
example 2
[0179] Example 2. Modification of metal surfaces
[0180] Aluminum (Al 2 o 3 ) samples (unpassivated or passivated by treatment with nitric acid) were immersed in tannic acid solution (1 mg / mL in 0.1M bicine+0.6M NaCl) for 1 or 3.5h. After deposition, the samples were washed twice with 0.01 M phosphate buffer at pH 7.4 (1st wash) and pH 5 (2nd wash). Hydrophilic polymer at pH 5 (pSPE, 1 mg / mL in 0.01M phosphate buffer + 0.17M NaCl) was deposited by immersing the TA-coated coupon in the polymer solution for 5 or 15min. Unattached polymer was removed by two washing steps with buffer at pH 5 (0.01M buffer + 0.17M NaCl). Air dry the samples.
[0181] Carbon steel substrates were similarly modified. Tannin was deposited from a 0.1 mg / ml solution (0.01 M phosphate buffer, pH 7.4) over a period of 7 min, followed by washing with 0.01 M phosphate buffer (pH 7.4 and pH 5, two washes). The hydrophilic polymer was deposited under the same conditions as described for the aluminum s...
example 3
[0182] Example 3. Characterization of Coating Thickness
[0183] The thickness of the first layer (polyphenol-containing layer) of the coating was determined by using ellipsometry.
[0184] Silicon wafers are used for ellipsometry measurements. Since tannic acid does not adhere well to silicon wafers, a cleaned Si wafer was first coated with polyethyleneimine by spin coating. The primed wafers were then immersed in TA solution (2 mg / mL, 0.1 Mbicine, 0.6 M NaCl) for 20 min, 4 h and 24 h. After deposition, the wafers were washed in 0.01 M phosphate buffer and air-dried before ellipsometry measurements.
[0185] It was observed that the thickness of the tannin layer on the surface increased from 4.5 nm (after 20 min) to about 20 nm (after 24 h) with increasing deposition time.
[0186] In addition, the increase in layer thickness is not linear over time because the rate of polymerization of tannin is rapid during the first 4-5 hours and decreases due to the smaller amount of a...
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