Process method for assembling PCB substrate antenna and carrier structural member

Abstract

The invention discloses a process method for assembling a micro-strip array antenna PCB substrate antenna 4 and a carrier structural member, and aims to provide a process method capable of improving the welding yield of a PCB substrate antenna and a carrier and reducing the voidage. According to the technical scheme, the method comprises the steps that a solder coating tool and a welding tool which are matched with a printed circuit board (PCB) substrate antenna in shape are prepared, solder is applied to the welding face of the PCB substrate antenna through the solder coating tool, reflowing solder paste on a heating plate is placed after the solder is controlled, the PCB substrate antenna is cooled, and solder fixing is completed; the printed board PCB substrate antenna and the carrier structural member are fixed through a welding tool; and the PCB substrate antenna and the carrier structural member which are provided with the tool are put into a reflow soldering furnace together, and the PCB substrate antenna and the carrier structural member are finally fixed together through reflow soldering, thereby completing the welding assembly of the PCB substrate antenna and the carrier structural member.

Description

technical field [0001] The invention relates to an assembly process method suitable for 512 array elements of KA frequency band dual-polarized microstrip array printed board PCB substrate antenna 4 and carrier structural member 3, especially for applications with broadband dual-polarization high isolation and high polarity The dual-polarization microstrip array printed board PCB substrate antenna 4 antenna and the carrier structural member 3 assembly process method for the requirements of chemical purity. Background technique [0002] Active phased array (AESA) radar has become the standard configuration of modern advanced fighters. Its target tracking / searching capability, high resolution, strong electronic interference and high data communication capabilities far surpass radars with traditional mechanical scanning systems. . [0003] With the development of microelectronics and micromechanical technology, AESA has also penetrated into the missile-borne radar seeker field ...

AI Technical Summary

Problems solved by technology

The second type is to use different layers of antenna arrays to achieve different polarizations respectively. The disadvantage is that the structure is complex, the production is difficult, and the cost is high.

However, the welding process of the high-density microstrip antenna and the metal carrier plate is very difficult to assemble and has always been a problem. The penetration rate is less than 50%, the RF through-hole is short-circuited, and the assembly yield is extremely low. There are almost no successful cases.

[0010] 2. The poor penetration rate of the PCB substrate antenna and the carrier structure will cause an air section between the printed board and the metal base. The impact on the performance of the antenna is mainly reflected in the increase of the voltage standing wave ratio, resulting in a phased array antenna. The radiation efficiency decreases

If the area of ​​the air section is large, it may even cause a serious shift in the operating frequency of the antenna. Therefore, the penetration rate is the key to determining the electrical performance index. It is a huge challenge for the welding of large-scale, high-density, and small-pitch array antennas.

Due to the above problems, the performance of the antenna index is very satisfactory, which limits the development of the millimeter-wave phased array antenna to the extremely miniaturized side. In order to reduce the impact of the above problems, it is urgent to solve the technical problems of large-scale high-density welding technology and improve Process integration capability

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