Composite heat dissipation film and preparation method thereof

A heat dissipation film and composite technology, applied in the direction of adhesive type, conductive adhesive, adhesive additive, etc., can solve the problems of poor heat dissipation of heat dissipation film, insufficient shielding function, poor heat dissipation effect, etc., and achieve convenient processing performance, film layer is thin, uniform and dense, and overcomes the effect of insufficient heat transfer and shielding functions

Pending Publication Date: 2022-04-05
广州宏庆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to improve the heat dissipation performance of the existing heat dissipation film, solve the technical problems of poor thermal conductivity and poor heat dissipation effect of graphite and graphene sheets in the Z direction (longitudinal direction), and provide a composite heat dissipation shielding film with integrated heat dissipation and shielding functions; The heat dissipation film layer and the 3D structure metal layer are superimposed reasonably; at the same time, the composite heat dissipation film with a 3D metal structure layer prepared by the method of the present invention is simple, light, thin, easy to use, and can be produced in batches, and is suitable for various electronic products and communication equipment; The composite heat dissipation shielding film is made of a heat dissipation layer and a 3D structural metal layer, which effectively solves the problems of poor heat dissipation in the Z direction and insufficient shielding function of the existing heat dissipation film

Method used

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  • Composite heat dissipation film and preparation method thereof
  • Composite heat dissipation film and preparation method thereof
  • Composite heat dissipation film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0139] Such as figure 1 , 2 As shown, the composite heat-fixing film having a 3D structural metal layer of the present invention includes a sequential thermally conductive layer 1, a thermally conductive attachment layer 2, 3D structural metal layer 3, a thermally conductive adhesive layer 4, a protective film layer 5, wherein the 3D structural metal The layer is composed of the base metal layer 31, the thick metal layer 32 is closely over.

[0140] 1, prepare the heat transfer layer

[0141] The graphene sheet having a thickness of 17 μm and a width of 140 mm is selected as the thermally conductive layer.

[0142] 2. Preparation of heat transfer layer

[0143] 2A) formulated by slurry

[0144] The heat-receiving paste is applied to the surface of the heat conductive layer, and then dry, the heat conductive receiving layer having a surface unevenness is formed, and has a three-dimensional surface structure (3D structure); the layer thickness is 5-20 μm, wherein the layer thickness...

Embodiment 1A

[0188] In addition to step 4), a conductive particle is also contained in the conductive plasma, and the weight ratio of the conductive particles is 15, the conductive particles are copper powder, and the average particle size of the copper powder is 10 μm, and the remaining is the same as in Example 1.

[0189] In a particular embodiment of the invention, the conductive particles will be described as an example of copper powder, and other conductive particles are nickel, copper, silver (powder), is suitable for use in the present invention.

[0190] The heat dissipation and shielding effect of the prepared composite heat dissipation film are shown in Table 1, 2.

Embodiment 2

[0192] Such as figure 1 As shown, the heat dissipation shield film having a 3D structural metal layer of the present invention includes a thermally conductive layer 1, a thermally conductive adhesive layer 3, a protective film layer 4, a thermally conductive adhesive layer 3, and a protective film layer 4.

[0193] 1, prepare the heat transfer layer

[0194] As in step 1 of Embodiment 1).

[0195] 2, prepare 3D structural metal layer

[0196] The manufacturing method of the 3D structural metal layer can be prepared as follows: The film layer of an irregular stereo surface structure or a microporous structure is formed on the surface of the existing metal foil.

[0197] A copper foil having a thickness of 18 μm (typically 12-100 μm) is used for etching, wherein the etching pressure is 2-6 kg / cm. 2 The etching treatment temperature is 30-60 ° C; the etching liquid is a copper chloride etching liquid, which has a thickness of 18 μm surface uneven, a 3D structural metal layer having...

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Abstract

The invention discloses a composite heat dissipation film and a manufacturing method thereof. The composite heat dissipation film comprises a heat conduction layer, a heat conduction bonding layer, a 3D structure metal layer, a heat conduction adhesive layer and a protective film layer which are connected in sequence. According to the composite heat dissipation film, the graphene sheet and the metal layer are used for heat dissipation, and the metal layer is treated through vapor phase physical deposition, plasma, chemical etching, chemical plating and other methods, so that a spur structure is grown on the surface of the metal layer, and the original smooth metal surface is rough; an original smooth plane structure is changed into a three-dimensional (3D) rough structure, and the spur structures can be embedded into the graphene heat conduction layer, so that the metal layer and the graphene layer are better embedded, and the heat dissipation effect and the shielding function are greatly improved while the metal layer and the graphene layer are tightly combined. According to the composite heat dissipation film, heat dissipation and shielding are organically integrated, so that a manufactured product has high heat dissipation performance and a shielding function, and the composite heat dissipation film is suitable for the aspects or fields of heat dissipation, electromagnetic shielding, copper-clad plates, flexible printed circuit boards (FPC), display, communication and the like.

Description

Technical field [0001] The present invention belongs to the field of display, electronic components, and communication, involves a heat sink, and more particularly to a composite heat absorbing film of 5G communication, an electronic component, a conductive film, an FPC, and a functional film such as a conductive film. Background technique [0002] The rapid development of information technology has led to a significant increase in chip power consumption of electronic components, and heat dissipation has become an important part. It is an effective means of achieving high efficiency heat dissipation, high densification, and miniaturization conditions. The internal heat dissipation in the mobile phone is mainly graphite. The artificial graphite film is used in the artificial graphite film formed by the polyimide (PI) film, and the high temperature graphite is formed. Although the thermal conductivity of the XY direction is excellent in thermal conductivity, the Z direction (longit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00C09J7/29C09J7/30C09J133/04C09J11/04C09J9/02
Inventor 郑永德郑凯晨
Owner 广州宏庆电子有限公司
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