Getter with thin film coating as well as preparation method and application of getter
A getter and coating technology, applied in chemical instruments and methods, coatings, sputtering coating, etc., can solve the problem of poor mechanical strength of compressed non-evaporable getters, difficulty in controlling the thickness of thin film coatings, and problems of getters Easy to be polluted and other problems, to achieve the effect of guaranteed life, stability and reliability, good absorption capacity, and improved sintering performance
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Embodiment 1
[0047] Such as figure 1 As shown, the present embodiment provides a getter (Zr-ZrVFe-Ni-1h) with a thin film coating, which is composed of a getter substrate 1 and a thin film coating 2 on its surface, and its preparation method is as follows:
[0048] (1) Preparation of ZrVFe alloy powder
[0049] According to the mass content of Zr, V and Fe are 70%, 24.6% and 5.4% respectively, the ZrVFe alloy ingot is smelted in a vacuum electric arc furnace, that is, the high-purity metal raw material is put into a copper crucible, and the argon gas with a purity of 99.999% is used Clean the melting chamber of the vacuum electric arc furnace 3 times, and then melt the metal raw materials 4 times. Then, under the protection of argon, the alloy ingot is crushed, vacuum ground, and sieved to obtain ZrVFe alloy powder with a particle size not higher than 75 μm.
[0050] (2) Preparation of getter substrate
[0051] Fully mix Zr powder and ZrVFe alloy powder at a mass ratio of 1:1, use a mol...
Embodiment 2
[0057] This example provides a getter (Zr-ZrVFe-Ni-1h) with a thin film coating, the preparation method of which is referred to Example 1, the only difference is that the deposition time of the Ni film is 2h.
[0058] The getter base material obtained by vacuum sintering in this embodiment has a porous structure, and the thickness of the thin-film coating Ni deposited by magnetron sputtering is 580 nm, showing a loose structure.
Embodiment 3
[0060] This example provides a getter (Zr-ZrVFe-Ni-3h) with a thin film coating, the preparation method of which is referred to Example 1, the only difference is that the deposition time of the Ni film is 3h.
[0061] The getter base material obtained by vacuum sintering in this embodiment has a porous structure, and the thickness of the Ni film coating deposited by magnetron sputtering is 860 nm, showing a relatively compact structure.
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Abstract
Description
Claims
Application Information
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