Full-implantation brain-computer interface based on system-level integration process and manufacturing method
A technology of brain-computer interface and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, sensors, electrodes, etc., can solve the problem of low quality factor of on-chip inductance, limitation of magnetic coupling wireless power supply efficiency, and the inability of single-chip integrated circuits to integrate large-area capacitors To achieve the effect of maintaining the recording signal quality, improving the long-term implantation ability, and solving the problem of power supply limitation
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[0044] Such as figure 1 As shown, a fully implanted brain-computer interface based on a system-level integration process includes an in vitro base station part and an in vivo implant part; wherein the in vitro base station part is connected to the in vivo implant part.
[0045] The in vitro base station part includes a wireless power supply system U1, a wireless power supply transmitting coil L TX , Resonant matching capacitor C TX , wireless communication system U2, onboard antenna L1; wireless power supply transmitting coil L TX and the resonant matching capacitor C TX After being connected in series, it is connected to the wireless power supply system U1; the wireless communication system U2 is connected to the on-board antenna L1, and the on-board antenna L1 adopts a high-gain antenna. The wireless communication system U2 is also connected with external devices, including computers and so on. Wireless Power Transmitting Coil L TX and the resonant matching capacitor C ...
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