Full-implantation brain-computer interface based on system-level integration process and manufacturing method

A technology of brain-computer interface and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, sensors, electrodes, etc., can solve the problem of low quality factor of on-chip inductance, limitation of magnetic coupling wireless power supply efficiency, and the inability of single-chip integrated circuits to integrate large-area capacitors To achieve the effect of maintaining the recording signal quality, improving the long-term implantation ability, and solving the problem of power supply limitation

Pending Publication Date: 2022-04-26
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the area of ​​existing implanted integrated circuits is limited, so that monolithic integrated circuits cannot integrate large-area capacitors, which limits the power of electrical stimulation.
Moreover, the traditional integrated circuit process cannot etch thick metal layers, which makes the quality factor of the on-chip inductance low, which limits the efficiency of magnetically coupled wireless power supply.
Low power supply efficiency limits the function of the fully implanted brain-computer interface of the SoC solution, so that the existing system-on-chip (SoC) solution of the fully implanted brain-computer interface system usually has low wireless communication rate, low neural signal sampling rate and low stimulation current
Seriously restricting the application of fully implanted brain-computer interface systems in neuroscience, biomedicine, etc.

Method used

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  • Full-implantation brain-computer interface based on system-level integration process and manufacturing method
  • Full-implantation brain-computer interface based on system-level integration process and manufacturing method
  • Full-implantation brain-computer interface based on system-level integration process and manufacturing method

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Embodiment 1

[0044] Such as figure 1 As shown, a fully implanted brain-computer interface based on a system-level integration process includes an in vitro base station part and an in vivo implant part; wherein the in vitro base station part is connected to the in vivo implant part.

[0045] The in vitro base station part includes a wireless power supply system U1, a wireless power supply transmitting coil L TX , Resonant matching capacitor C TX , wireless communication system U2, onboard antenna L1; wireless power supply transmitting coil L TX and the resonant matching capacitor C TX After being connected in series, it is connected to the wireless power supply system U1; the wireless communication system U2 is connected to the on-board antenna L1, and the on-board antenna L1 adopts a high-gain antenna. The wireless communication system U2 is also connected with external devices, including computers and so on. Wireless Power Transmitting Coil L TX and the resonant matching capacitor C ...

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Abstract

The invention discloses a system-level integration process-based full-implantation brain-computer interface and a manufacturing method thereof. The existing SoC scheme full-implantation brain-computer interface system generally has low wireless communication rate, low neural signal sampling rate and low stimulation current; the application of the fully implanted brain-computer interface system in the aspects of neuroscience, biomedical treatment and the like is seriously restricted; a system-level integration process is adopted, a special brain-computer interface ASIC (application specific integrated circuit) chip, a wireless power supply and wireless communication chip and an SMD (surface mounted device) device are subjected to miniaturized heterogeneous integration, a fully-implanted brain-computer interface system structure with complete functions is realized, and a part of wireless power supply receiving coils implanted in a body is deposited by thick metal layers, so that the wireless power supply receiving coils are completely implanted in the body. Compared with an SoC integration scheme, the integrated inductor with a higher quality factor is realized, the integrated inductor is used as a receiving coil for wireless power supply, and the wireless power supply receiving efficiency of implantable equipment is improved; and finally, a miniaturized high-performance fully-implanted brain-computer interface system is realized, so that the fully-implanted brain-computer interface can be applied to specific neuroscience research.

Description

technical field [0001] The invention relates to the field of implantable brain-computer interfaces, in particular to a fully implantable brain-computer interface based on a system-level integration process and a manufacturing method. Background technique [0002] As a pathway connecting the target brain and external devices, the brain-computer interface is an important means of neuroscience research. Current research on neural research includes recording and stimulation techniques across different temporal and spatial scales, such as multiphoton calcium imaging and optogenetics, which have been shown to have a powerful ability to decode functional neural connections, but compared with electrical neural interface-based For BCIs, existing recording and stimulation techniques have low resolution. Brain-computer interfaces based on electrical neural interfaces can record individual action potentials with unparalleled ultra-high resolution. Long-term, continuous recording of ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/293A61N1/05H01L23/64H01L23/29H01L23/31H01L21/50H01L21/56
CPCA61B5/293A61N1/0529H01L23/645H01L23/291H01L23/293H01L23/3107H01L21/50H01L21/56
Inventor 洪慧王浩传
Owner HANGZHOU DIANZI UNIV
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