Electrochemical discharge energizing micro-grinding method for silicon-based material micro part

Abstract

The invention discloses a silicon-based material micro-part electrochemical discharge energizing micro-grinding method, which comprises the following specific steps: a micro-grinding tool and an auxiliary electrode are respectively connected with a negative electrode and a positive electrode of a pulse direct-current power supply, and when current passes through a loop, the micro-grinding tool is subjected to electrochemical hydrogen evolution reaction in grinding fluid to generate hydrogen bubbles; the multiple hydrogen bubbles are fused to form an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the voltage is greater than the critical discharge voltage, the gas film is broken down to form electrochemical discharge and generate discharge sparks; under the action of discharge sparks, on one hand, a workpiece surface layer material in the discharge area is directly ablated to generate a heat affected layer, namely physical modification, and on the other hand, discharge temperature rise promotes the workpiece material to chemically react with grinding fluid to generate silicate, namely chemical modification, the mechanical property of a modified layer is remarkably reduced, and the modified layer can be quickly and efficiently ground away by a micro grinding tool. According to the method, high-precision, high-efficiency and low-damage machining of hard, brittle and difficult-to-conduct silicon-based material micro parts can be achieved, and the shape retentivity of the micro grinding tool is good.

Description

technical field [0001] The invention relates to the technical field of micro-grinding, in particular to an electrochemical discharge energized micro-grinding method for tiny parts of silicon-based materials. Background technique [0002] Silicon-based materials are playing an increasingly important role in the modern technology industry. Typical silicon-based materials include monocrystalline silicon, monocrystalline silicon carbide, and silicon-based ceramics, which have important characteristics such as high strength, high hardness, wear resistance, and difficulty in conducting electricity. Silicon-based materials are mainly used to manufacture ultra-precise three-dimensional tiny parts such as micro-sensors, micro-fluidic devices, and micro-optical components. . [0003] Due to the characteristics of high hardness, high brittleness and poor conductivity of silicon-based materials, when using existing processing methods to process tiny parts of silicon-based materials, it...

AI Technical Summary

Problems solved by technology

However, for high-melting silicon-based materials such as monocrystalline silicon, silicon carbide, and silicon-based ceramics, it is difficult to efficiently melt the workpiece material by electrochemical discharge, so its processing efficiency is extremely low

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