Film thickness measuring and finishing equipment, film coating system and film preparation method

Abstract

The invention provides thin film thickness measuring and finishing equipment, a PVD coating system and a thin film preparation method. The film thickness measuring and trimming equipment comprises a slide glass device, a thickness measuring device, a film trimming device, a conveying device and a PLC (Programmable Logic Controller) control device, the wafer carrying device comprises a first shell with a wafer carrying cavity, and a wafer carrying device for accommodating a wafer is placed in the wafer carrying cavity; the thickness measuring device comprises an X-ray fluorescence measuring device and a laser confocal microscopic measuring device; the film repairing device comprises a fourth shell with a film repairing cavity; a film repairing slide holder and a focused ion beam device for cleaning and flattening the surface of the wafer are arranged in the film repairing cavity; the conveying device comprises a fifth shell with a conveying cavity; a manipulator for taking and placing the wafer is arranged in the transmission cavity; and the PLC control device is respectively connected with the devices. By adopting the film thickness measuring and trimming equipment, the film coating system and the film preparation method, the 4-8-inch wafer with the film thickness uniformity smaller than or equal to 0.1% can be obtained.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a thin film thickness measuring and trimming device, a coating system and a thin film preparation method. Background technique [0002] The multi-functional development of wireless communication terminals has put forward high technical requirements for radio frequency devices such as miniaturization, high frequency, high performance, low power consumption, and low cost. The traditional surface acoustic wave filter (SAW) has a large insertion loss in the high frequency band above 2.4GHz, and the dielectric filter has good performance but is too large. Film Bulk Acoustic Resonator (FBAR) technology is a new radio frequency device technology that has emerged in recent years with the improvement of processing technology and the rapid development of modern wireless communication technology, especially personal wireless communication technology. It has a very high qu...

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Problems solved by technology

[0003] At present, magnetron sputtering is mainly used to prepare AlN materials in the world. With the development of international semiconductor device processing towards large-size (6, 8, 12 inches) substrates, FBAR filter chips are no exception. As the size of the substrate increases, the differences in properties such as stress and roughness at various positions on the substrate will also increase. Therefore, using the traditional PVD magnetron sputtering system to ensure that the film thickness uniformity difference on the large-size substrate is within It is very difficult below 1nm, and the frequency of FBAR filter is closely related to the thickness, and the frequency of 1nm thickness difference will shift to MHz level. Therefore, designing a coating equipment that can prepare thin films with high thickness uniformity is crucial to the production of FBAR filters. important

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