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A/C type foled packaging material and preparation method

A packaging material, A4BX6 technology, used in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc., can solve the problems of low temperature tolerance, film peeling, thermal expansion coefficient mismatch, etc., to improve packaging reliability, The effect of prolonging the service life and guaranteeing the bond strength

Active Publication Date: 2022-07-05
TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Existing technologies such as the Chinese invention patent with the application authorization number CN112054109A disclose a kind of UV LED packaging glue and packaging structure with high light extraction efficiency and light aging resistance. , a quencher accounting for 0.1-10% of the colloid mass percent, a hydroperoxide decomposing agent accounting for 0.1-10% of the colloid mass percent, a free radical scavenger accounting for 0.1-15% of the colloid mass percent, accounting for the colloid mass percent The encapsulation glue made of 0.1-15% hindered amine light stabilizer, 0.5-5% coupling agent and 1-5% colloid dispersant has high energy consumption, time and High economic cost is not conducive to market application
[0009] Moreover, the polymer material has poor barrier ability to water vapor and oxygen; low temperature resistance, easy to distort; low glass transition temperature, low room temperature conductivity; in addition, the thermal expansion coefficient of the polymer and ITO film does not match very much, and the temperature rises When the connection interface produces a large thermal stress, the film will fall off from the substrate and damage the device and other problems continue to be further solved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • A/C type foled packaging material and preparation method
  • A/C type foled packaging material and preparation method
  • A/C type foled packaging material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The preparation of an A / C type FOLED encapsulation material comprises the following steps:

[0036] 1) Add 0.5 parts of dimethyl sulfoxide, 0.5 parts of N-N-dimethylacetamide, and 18 parts of PVDF to N-N-dimethylamide and stir at a constant temperature of 30° C. After stirring, ultrasonically vibrate for 3 hours to obtain a polar PVDF solution;

[0037] 2) Add 37 parts of cross-linked low molecular weight polyethylene glycol methyl ether methacrylate (PEGMA) to the solution in step 1) successively,

[0038] 5 TEOS, 3 Cs 4 PbBr 6 Then adjust the PH value to 7.5, put it into a polytetrafluoroethylene liner and heat it at a constant temperature of 50 °C for 3 hours;

[0039] 3) To step 3), add 18 parts of lithium bisfluorosulfonimide, 18 parts of Mg(ClO) 4 ) 2 Ultrasound for 0..5 to 1 h, introducing alkali metal ions Due to the introduction of alkali metal ions, the free ions gathered on the surface of the electrode have a certain attraction or repulsion effect, thereb...

Embodiment 2

[0041] The preparation of an A / C type FOLED encapsulation material comprises the following steps:

[0042] 1) Add 0.5 part of dimethyl sulfoxide, 0.5 part of N-N-dimethylacetamide, and 16 parts of PVDF to N-N-dimethylamide and stir at a constant temperature of 30° C. After stirring, ultrasonically vibrate for 3 hours to obtain a polar PVDF solution;

[0043] 2) Add 43 parts of cross-linked low molecular weight polyethylene glycol methyl ether methacrylate (PEGMA) to the solution in step 1) successively,

[0044] 2 copies of TEOS, 3 copies of Cs 4 PbBr 6 Then adjust the PH value to 7.5, put it into a polytetrafluoroethylene liner and heat it at a constant temperature of 50 °C for 3 hours;

[0045] 3) Add 16 parts of lithium bisfluorosulfonimide and 18 parts of Mg(ClO) to step 2). 4 ) 2 Ultrasound for 0..5 to 1 h, introducing alkali metal ions Due to the introduction of alkali metal ions, the free ions gathered on the surface of the electrode have a certain attraction or rep...

Embodiment 3

[0047] The preparation of an A / C type FOLED encapsulation material comprises the following steps:

[0048] 1) Add 0.5 part of dimethyl sulfoxide, 0.5 part of N-N-dimethylacetamide, and 17 parts of PVDF to N-N-dimethylamide and stir at a constant temperature of 30°C, and after stirring, ultrasonically vibrate for 3 hours to obtain a polar PVDF solution;

[0049] 2) 40 parts of cross-linked low-molecular-weight polyethylene glycol methyl ether methacrylate (PEGMA), 3 parts of TEOS, 3 parts of Cs were sequentially added to the solution in step 1). 4 PbBr 6 Then adjust the PH value to 7.5, put it into a polytetrafluoroethylene liner and heat it at a constant temperature of 50 °C for 3 hours;

[0050] 3) 17 parts of lithium bisfluorosulfonimide, 18 parts of Mg(ClO) were added to step 2). 4 ) 2 Ultrasound for 0..5 to 1 h, introducing alkali metal ions Due to the introduction of alkali metal ions, the free ions gathered on the surface of the electrode have a certain attraction or ...

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Abstract

The invention relates to an A / C type FOLED encapsulation material and a preparation method. The A / C type FOLED encapsulation material is prepared by the principle of anion and cation (A / C) electrostatic adsorption, and the A / C type FOLED encapsulation material is uniformly mixed in a polymer A flexible film with perovskite quantum dots with good light transmission, the polymer starting material formula components (by weight) are: 15-18 parts lithium bisfluorosulfonimide, 15-18 parts Mg(ClO 4 ) 2 , 20~23 parts of cross-linked low molecular weight polyethylene glycol methyl ether methacrylate (PEGMA), 15~18 parts of sodium alginate or PVDF, 0.5~0.8 parts of dimethyl sulfoxide, 0.5~0.8 parts of N‑ N-dimethylacetamide, 5~8 parts TEOS / A 4 BX 6 . By introducing lithium bisfluorosulfonimide, Mg(ClO) on PVDF or sodium alginate containing dimethyl sulfoxide, N-N dimethylacetamide 4 ) 2 , cross-linked low molecular weight polyethylene glycol methyl ether methacrylate (PEGMA) and reintroduce TEOS / A 4 BX 6 The preparation has both high water vapor and oxygen barrier energy, high temperature tolerance, good flexibility and excellent ionic conductivity.

Description

technical field [0001] The patent of the invention belongs to the technical field of preparation of FOLED packaging materials, and particularly relates to an anion-cation electrostatic adsorption type (A / C) FOLED packaging material and a preparation method. Background technique [0002] Organic electroluminescent display devices (Organic Light-Emitting Devices, OLED) have many advantages such as ultra-thin, light weight, energy saving, high luminous efficiency, no viewing angle limitation, fast response speed, etc. A new generation of display devices. Encapsulating OLEDs with flexible substrate materials can achieve bending, folding and wearable properties of OLED devices. Therefore, flexible organic electroluminescence display devices are an important direction for the development of display technology in the future. [0003] The organic functional materials in display devices are very unstable under atmospheric environmental conditions, and are sensitive to chemical and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/02C08L27/16C08K3/24C08K5/435C08K3/16H01L51/52
CPCC08L71/02H10K50/844C08L27/16C08K3/24C08K5/435C08K3/16Y02E10/549
Inventor 刘翠荣赵为刚阴旭杨兰栋王亚柯孟庆森孟员员
Owner TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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