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A curved multi-layer three-dimensional interconnected structure

An interconnected structure and three-dimensional technology, which is applied in the structural form of the radiating element, the structural connection of the antenna grounding switch, the antenna support/installation device, etc., can solve the problem that the electrical performance cannot meet the design requirements, the environmental adaptability and reliability are poor, and the manufacturing consistency is poor. and other problems, to achieve the effect of widening the design margin, large bandwidth and other electrical indicators, and good consistency

Active Publication Date: 2022-07-29
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to address the high loss of electrical properties caused by the material system in the prior art, the poor manufacturing consistency caused by the preparation technology, and ultimately the electrical properties that cannot meet the design requirements, the structural strength is poor and uncontrollable, and the environmental adaptability and reliability are poor. etc., the present invention discloses a curved multi-layer three-dimensional interconnection structure, which has the characteristics of broadband, light weight, low loss, high consistency, stable electrical performance, high strength and high reliability, and is suitable for mass production

Method used

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  • A curved multi-layer three-dimensional interconnected structure
  • A curved multi-layer three-dimensional interconnected structure
  • A curved multi-layer three-dimensional interconnected structure

Examples

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Effect test

Embodiment 1

[0066] like figure 2 As shown, a low-loss and high-consistency curved multi-layered three-dimensional interconnected radiator structure covering low frequency to high frequency includes: a first base 21, which is made of aluminum alloy, on which a first connector 211 and a first The external mounting hole 212; the third dielectric layer 22, the material is PMI foam, the density is 110Kg / m³; the third prepreg layer 23, the material is quartz cloth cyanate prepreg, the thickness is 1mm; the third film layer 24 , the material is modified cyanate resin, the thickness is 0.2mm; the third radiation pattern layer 25, the material is Ni, Cu composite coating, the total thickness of the coating is 10μm; the electronic components are carbon paste resistors, the resistance value is 500Ω; the fourth dielectric layer 27, the material is PMI foam, the density is 71Kg / m³; the fourth prepreg layer 28, the material is quartz cloth cyanate prepreg; the fourth film layer 29, the material is mod...

Embodiment 2

[0074] like Figure 4 As shown in the figure, a low-loss and high-consistency curved multi-layered interconnected radiator structure covering a low frequency band includes: a second substrate 41, which is made of polyimide PI, and a fifth radiation pattern has been prepared on its convex surface. layer 411, and a second connector 412 and a second external mounting hole 413 are placed on it; the second wave absorbing layer 42 is made of metal powder wave absorbing material, and the fifth film layer 43 is made of cyanate ester modified material. epoxy resin; the fifth dielectric layer 44 is made of pure polyetheretherketone PEEK, with a density of 1300Kg / m³; the sixth film layer 45 is made of cyanate modified epoxy resin; the sixth radiation pattern layer 46, The material is Ni, Cu composite coating, and the total thickness of the coating is 10 μm; the second electronic component 47 is a carbon paste resistor with a resistance value of 1000Ω; the second interlayer metallized int...

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Abstract

The invention discloses a curved multi-layered three-dimensional interconnection structure, the curved multi-layered three-dimensional interconnected structure at least comprises: a base body, the base body is configured to realize electrical signal transmission and mechanical bearing of the curved multi-layered three-dimensional interconnection structure; a first wave absorbing layer , the first wave-absorbing layer is covered on the substrate and is made of materials with electromagnetic wave absorption function; the first dielectric layer, the first dielectric layer is a wave-transmitting foam material, and the first dielectric layer is the attachment of the radiation pattern layer The base layer, and the material selection is completed based on the preset electrical performance requirements; the first prepreg layer, the first prepreg layer is arranged on the first dielectric layer; the first radiation pattern layer, the first radiation pattern layer is prepared in On the first prepreg layer, the pattern therein is not limited to be obtained by a prefabricated mask method, a laser processing method or a mechanical processing method. The structure of the invention has the characteristics of wide band, light weight, low loss, high consistency, stable electrical performance, high strength and high reliability, and is suitable for mass production.

Description

technical field [0001] The invention belongs to the field of three-dimensional circuit manufacturing, and in particular relates to a curved multi-layer three-dimensional interconnection structure with the characteristics of low loss and high consistency. Background technique [0002] Due to the requirement of curved multi-layer interconnected structure, the core radiation parts are generally one or more thin metal surfaces, and the curved surface can be divided into expandable surfaces and non-expandable surfaces. And due to usage requirements, this curved radiator has high mechanical performance requirements. In the case of such mechanical performance requirements, the structural strength of the metal surface of this thin layer cannot be satisfied by itself, so it is necessary to support the structure. The support structure must be made of non-metallic materials, with good electrical properties, such as good dielectric constant and loss tangent, as well as good mechanical ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/12H01Q1/50
CPCH01Q1/38H01Q1/12H01Q1/50
Inventor 王天石张怡刘镜波邓超范民徐利明万养涛赵行健关迪周雅慧羊慧李鹏全旭林况泽林陈曦杨培刚刘正勇曹洪志谷岩峰王庆兵
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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