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Liquid molding compound for wafer level packaging and preparation method thereof

A wafer-level packaging and molding compound technology, applied in semiconductor devices, photovoltaic power generation, electrical components, etc., to achieve high Tg, low shrinkage, and low CTE effects

Active Publication Date: 2022-06-07
连云港华海诚科电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The downside is that as the diameter of the package gets larger and the thickness of the plastic package gets thinner, the warpage problem becomes more and more of a challenge

Method used

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  • Liquid molding compound for wafer level packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1, a liquid molding compound for wafer-level packaging, the main components of the liquid molding compound are as follows:

[0028] Epoxy resin 1.5%; curing agent 5%;

[0029] Accelerator 2%; Toughener 1%;

[0030] Filler 90%; Coupling agent 0.3%;

[0031] Colorant 0.2%;

[0032] The epoxy resin is composed of the following components A and B:

[0033] Component A: one of bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene ring epoxy resin, dicyclopentadiene epoxy resin, and alicyclic epoxy resin; component A accounts for the liquid molding compound 1%;

[0034] Component B: composed of three-dimensional cage-like structure silicone epoxy resin and glycidoxy functional group-containing silicone resin; Component B accounts for 0.5% of the liquid molding compound;

[0035] The three-dimensional cage-like structure organosilicon epoxy resin accounts for 50% of the organosilicon modified epoxy resin, and the balance is the organosilicon resin conta...

Embodiment 2

[0040] Example 2: Comparative experiment

[0041] Experiment 1: 0.7% of bisphenol A epoxy resin, 1% of dicyclopentadiene epoxy resin, 0.6% of alicyclic epoxy resin, 0.6% of three-dimensional cage-like structure resin, and silicone containing glycidoxy functional group 0.6%, carbon black 0.5%, cross-linked acrylate polymer 1%, acid anhydride 5.6%, γ-glycidyl ether propyl trimethoxy silane 0.1%, γ-mercaptopropyl trimethoxy silane 0.1%, added to the reaction kettle , 50 ℃ vacuum high-speed mixing for 30 minutes. Add 88% spherical silica with a maximum particle size of 75um, vacuumize at 40°C and mix at high speed for 4 hours, and then cool down to 25°C. Add 1.2% amine catalyst, vacuumize and mix at medium speed for 30 minutes at 20°C, and pack and store after mixing evenly.

[0042] Experiment 2: 0.8% of bisphenol F epoxy resin, 0.5% of naphthalene ring epoxy resin, 0.5% of dicyclopentadiene epoxy resin, 0.6% of alicyclic epoxy resin, 0.6% of three-dimensional cage-like structu...

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Abstract

The invention relates to a liquid molding compound for wafer-level packaging. The liquid molding compound comprises the following main components: epoxy resin, a curing agent, an accelerant, a flexibilizer, a filler, a coupling agent and a coloring agent, the epoxy resin is formed by combining a component A and a component B, wherein the component A is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene ring epoxy resin, dicyclopentadiene epoxy resin and alicyclic epoxy resin; the component B is composed of three-dimensional cage-shaped structure organic silicon epoxy resin and organic silicon resin containing epoxy propoxy functional groups. The invention also discloses a preparation method of the liquid molding compound for wafer level packaging. The liquid molding compound for wafer level packaging has the advantages of low shrinkage, high Tg, low CTE and low modulus due to the use of the special two-component epoxy resin, and the good warping performance of the liquid molding compound can meet gt; the diameter is 300 mm, and the thickness is 1t; and the wafer level packaging requirement of 400 [mu] m is met.

Description

technical field [0001] The invention relates to a liquid plastic sealing material for wafer-level packaging and a preparation method thereof, and belongs to the field of semiconductor packaging materials. Background technique [0002] Wafer-level packaging is generally defined as performing most or all of the packaging and testing procedures directly on the wafer, followed by singulation to produce individual components. This packaging form uses the redistribution process, so that I / O can be distributed on the entire surface of the IC chip instead of being limited to the peripheral area of ​​the narrow IC chip, thus solving the problem of high-density, fine-pitch I / O chips electrical connection problems. The molding process of wafer-level packaging is to put a single die into the epoxy system molding compound to cure and shape, and then cut into individual particles. Dies can be packaged individually or combined with other dies or other components or functional components....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/06C08K3/36C08K7/18H01L33/56
CPCC08L63/00H01L33/56C08L83/06C08K3/36C08K7/18Y02E10/50
Inventor 秦苏琼陶军吴淑杰韩江龙张佳云封昌红刘兆明徐丹丹
Owner 连云港华海诚科电子材料有限公司