Main grid slurry containing silver-copper alloy powder and preparation method thereof

The technology of silver-copper alloy powder and silver powder is applied in the field of busbar paste containing silver-copper alloy powder and its preparation, which can solve the problems of affecting battery performance, high glass content and high proportion of silver, so as to improve the battery efficiency and improve the wettability of the battery. Good performance, the effect of reducing glass content

Pending Publication Date: 2022-07-05
上海银浆科技有限公司
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Problems solved by technology

[0004] In view of the above problems, the present invention provides a silver-containing copper alloy powder busbar paste, which solves the technical problems of high cost caused by high proportion of silver in traditional silver paste, and high glass content which affects battery performance and other technical problems

Method used

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  • Main grid slurry containing silver-copper alloy powder and preparation method thereof

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] The proportioning ratios of specific different embodiments and reference examples are as follows:

[0028] Example 1 Embodiment 2 Embodiment 3 Embodiment 4 Reference example silver powder one 80.00％ 75.00％ 80.00％ 75.00％ 80.00％ silver powder two 5.00％ 5.00％ glass powder 0.60％ 0.40％ 0.40％ 0.80％ 1.20％ Silver copper alloy powder one 5.00％ 5.00％ 3.00％ 3.00％ Silver copper alloy powder II 2.00％ 2.00％ organic carrier 14.40％ 14.60％ 14.60％ ...

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Abstract

The invention discloses main grid slurry containing silver-copper alloy powder and a preparation method of the main grid slurry. The main grid slurry comprises the following components in percentage by weight: 75-90% of silver powder, 0.2-2% of glass powder, 0.1-20% of silver-copper alloy powder and 8-25% of an organic carrier. The glass powder is one of Mn-Cu system glass and Pb-Si-Ti system glass; the silver-copper alloy powder is silver-copper binary, ternary and quaternary alloy powder, and the organic carrier comprises a solvent, a plasticizer, a thixotropic agent, a thickening agent and a dispersing agent. According to the invention, the silver-copper alloy powder is matched with the silver powder for use, so that under the condition of low glass content, a high-density main gate electrode is realized, the resistivity of the main gate electrode body is reduced, the welding resistance of the main gate silver paste is improved, a high-electrical-performance battery structure is further obtained, the glass content of the main gate paste is reduced, the open voltage of the battery is improved, and the photoelectric conversion efficiency of the battery is improved. As the silver-copper alloy powder is used, the consumption of silver is reduced, the consumption of slurry is saved, and the cost is further reduced.

Description

technical field [0001] The invention belongs to the technical field of crystalline silicon solar cells, in particular to a busbar paste containing silver-copper alloy powder and a preparation method thereof. Background technique [0002] With the increasing installed capacity of photovoltaics, the consumption of silver in photovoltaic cells accounts for an increasing proportion of industrial silver, and it is more urgent for photovoltaic silver paste to reduce or replace silver. In the traditional step-by-step printing of the busbar silver paste, in order to ensure better conductivity, pure silver paste is used to match specific glass to meet the needs of conduction and welding. Therefore, the proportion of silver in such busbar silver paste is high, and the unit consumption of silver in the printing process is high, and the cost is difficult to effectively control. In addition, in order to reduce the volume resistivity and improve the welding reliability, a certain amount ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00H01L31/0224
CPCH01B1/16H01B1/22H01B13/00H01L31/022441Y02E10/50
Inventor 陈小龙冯海鹏史伟刘洁
Owner 上海银浆科技有限公司
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