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Wafer cyanide-free electrogilding liquid medicine formula and preparation method thereof

A technology of electroplating gold and liquid medicine, applied in the field of electroplating gold, can solve the problems of poor practicability, affecting the use effect of cyanide-free gold electroplating liquid on wafers, incomplete dissolution of organic additives and inorganic additives, etc., and achieves high practicability and progress. The effect of remarkable property and improving the dissolution effect

Inactive Publication Date: 2022-07-15
深圳市天跃新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the current existing wafer-free cyanide electroplating liquid is actually used, especially in the process of preparation, it is simply stirred and mixed by a mixer, and some organic additives and inorganic additives have the problem of incomplete dissolution, which affects the The use effect of the cyanide-free gold plating solution for wafers is poor in practicability and needs to be improved

Method used

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  • Wafer cyanide-free electrogilding liquid medicine formula and preparation method thereof
  • Wafer cyanide-free electrogilding liquid medicine formula and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] see figure 1 , a formula of a cyanide-free gold electroplating solution for wafers, wherein the cyanide-free gold electroplating solution includes the following components in parts by weight:

[0031] 78 parts of N,N-dimethylethanolamine, 12 parts of main complexing agent, 6 parts of auxiliary complexing agent, 2 parts of potassium gold chloride, 23 parts of ultrapure water, 25 parts of potassium carbonate, 9 parts of additional additives, potassium tartrate 5 parts, 1 part phenylalanine.

[0032] In this embodiment, the resistivity of the ultrapure water is 18.25 MΩ / cm, and the pH value of the cyanide-free gold electroplating solution is between 8 and 11 to ensure the quality of the ultrapure water.

[0033] In this embodiment, the primary complexing agent includes any one or two combinations of hydantoin derivatives, sodium pyrophosphite and 5,5-dimethylhydantoin.

[0034] In this embodiment, the auxiliary complexing agent is one or two of potassium oxalate, polyacr...

Embodiment 2

[0049] see figure 1 , a formula of a cyanide-free gold electroplating solution for wafers, wherein the cyanide-free gold electroplating solution includes the following components in parts by weight:

[0050] 80 parts of N,N-dimethylethanolamine, 15 parts of main complexing agent, 6 parts of auxiliary complexing agent, 2 parts of potassium gold chloride, 23 parts of ultrapure water, 30 parts of potassium carbonate, 15 parts of additional additives, potassium tartrate 5 parts, 1 part phenylalanine.

[0051] In this embodiment, the resistivity of the ultrapure water is 18.25 MΩ / cm, and the pH value of the cyanide-free gold electroplating solution is between 8 and 11 to ensure the quality of the ultrapure water.

[0052] In this embodiment, the primary complexing agent includes any one or two combinations of hydantoin derivatives, sodium pyrophosphite and 5,5-dimethylhydantoin.

[0053] In this embodiment, the auxiliary complexing agent is one or two of potassium oxalate, polyac...

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Abstract

The invention provides a wafer cyanide-free electrogilding liquid medicine formula and a preparation method thereof, and relates to the technical field of electrogilding, the wafer cyanide-free electrogilding liquid medicine formula comprises a first layer film, a second layer film and a third layer film, the first layer film comprises the following components by weight: 70-90 parts of polyethylene glycol terephthalate, 10-18 parts of glass fiber, 1-3 parts of a silane coupling agent, 1-3 parts of a silane coupling agent, and 1-3 parts of a silane coupling agent; 1-3 parts of a flexibilizer and 5-7 parts of an antioxidant; the second-layer film comprises the following components in parts by weight: 50-60 parts of polyethylene glycol terephthalate, 20-25 parts of a flame retardant, 5-8 parts of a stabilizer and 3-6 parts of an anti-blocking agent; and the third-layer film comprises the following components in percentage by weight: 80-85 parts of polyethylene glycol terephthalate. According to the wafer cyanide-free electrogilding liquid medicine formula, the first-layer film, the second-layer film and the third-layer film are compounded, so that the wafer cyanide-free electrogilding liquid medicine formula is prepared, in the first-layer film, the glass fibers are added for improving the strength, the second-layer film has the characteristic of high fire resistance, the third-layer film can effectively inhibit static electricity, and the progress is remarkable.

Description

technical field [0001] The invention relates to the technical field of gold electroplating, in particular to a formulation of a cyanide-free gold electroplating solution for wafers and a preparation method thereof. Background technique [0002] Gold is widely used in electronics, instruments, meters, aviation, aerospace and other industrial fields due to its good electrical conductivity, good weldability, low contact resistance, high temperature resistance and wear resistance. Chemical stability, good corrosion resistance and discoloration resistance, electroplating gold plating is required for semiconductor wafer electroplating. [0003] However, in the actual use of the existing cyanide-free gold electroplating solution for wafers, especially in the preparation process, it is simply stirred and mixed by a mixer, and some organic and inorganic additives have the problem of incomplete dissolution, which affects the The use effect of the cyanide-free gold plating solution fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D7/12
CPCC25D3/48C25D7/12
Inventor 陈跃
Owner 深圳市天跃新材料科技有限公司