The invention discloses a silver plating process for a
lead frame of an
integrated circuit, and relates to the technical field of
electroplating processes. The invention discloses a silver plating process for an
integrated circuit lead frame. The silver plating process sequentially comprises the steps of surface oil removal and
degreasing, acid
pickling, activation,
copper plating, silver pre-plating, silver
electroplating, annealing
passivation and the like. In the step of silver
electroplating, used silver electroplating liquid comprises a water-soluble silver salt compound with the
mass concentration being 15-25 g / L,
sodium thiosulfate with the
mass concentration being 200-230 g / L,
potassium metabisulfite with the
mass concentration being 40-45 g / L,
potassium oxalate with the mass concentration being 20-35 g / L, a stabilizer with the mass concentration being 0.35-1.2 g / L, a
reducing agent with the mass concentration being 4-12 g / L, a brightening agent with the mass concentration being 0.5-0.8 g / L and a
pH buffering agent with the mass concentration being 10-20 g / L according to silver ions. Specifically, the stabilizer is one or a mixture of two of a
thiourea derivative or methylaminothiazole, and silver ions can be uniformly deposited on the surface of the
lead frame at a stable speed in a silver electroplating
liquid system taking
sodium thiosulfate as a main complexing agent, so that the surface of a silver plating layer is smooth and flat and has good brightness; and meanwhile, good adhesiveness and thickness uniformity are achieved.