Composite wafer protective film and preparation method thereof

Abstract

The invention discloses a composite wafer protective film and a preparation method thereof. The composite wafer protective film comprises a release layer, a polyvinyl chloride layer, a thermoplastic polyurethane elastomer layer and a pressure-sensitive adhesive layer which are sequentially stacked from bottom to top, and the thickness of the thermoplastic polyurethane elastomer layer is 5-50 [mu] m. According to the composite wafer protection film provided by the technical scheme, the thermoplastic polyurethane elastomer layer is introduced into the polyvinyl chloride layer and the pressure-sensitive adhesive layer and can be used as a barrier layer to prevent a plasticizer in polyvinyl chloride from being migrated to the pressure-sensitive adhesive layer, so that the flexibility and ductility of the wafer protection film are ensured, and the service life of the wafer protection film is prolonged. The adhesive force of the pressure-sensitive adhesive layer to the base layer can be effectively improved. The preparation method of the composite wafer protection film is low in process dependence, high in flexibility and beneficial to improving the production efficiency of the composite wafer protection film.

Description

technical field [0001] The invention relates to the technical field of wafer protection, in particular to a composite wafer protection film and a preparation method thereof. Background technique [0002] Semiconductor is one of the indispensable raw materials for the production of all electronic products. The performance of electronic products is completely dependent on the quality of semiconductor products, and the manufacture of wafers is the most important part of the semiconductor industry. In the process of manufacturing a semiconductor chip from a wafer, multiple processes such as grinding, cleaning, and cutting are required. In order to prevent the wafer from being damaged during the processing process, the wafer needs to be protected under the above-mentioned processes. [0003] Wafer process protective film is a protective film specially used in the semiconductor industry, which plays the role of wafer high solder ball protection, ultra-thin wafer grinding protectio...

AI Technical Summary

Problems solved by technology

However, the use of PVC base film will inevitably lead to the problem of plasticizer migration. In the long run, it will affect the adhesion of the adhesive layer of the protective film to the substrate, resulting in peeling residue, and the plasticizer will migrate through the adhesive layer to the protected area. of the wafer surface causing wafer contamination

In addition, the adhesive needs heat curing after coating, and PVC itself has poor thermal stability and is easy to shrink when heated, so the adhesive is generally transferred to PVC by transfer coating, but the production process of transfer coating is complicated and cumbersome, which leads to Wafer protection film production efficiency is very low

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