Grinding fluid for processing silicon carbide wafer and preparation method of grinding fluid

A technology of wafer processing and silicon carbide, which is applied in chemical instruments and methods, other chemical processes, semiconductor/solid-state device manufacturing, etc., can solve the problems of easily scratched silicon carbide wafers, wafer scrapping, etc., and achieve particle size concentration and uniform dispersion Effect

Active Publication Date: 2022-07-29
河南创研新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a polishing liquid for processing silicon carbide wafers and a preparation method thereof, so as to solve the problem that the diamond micropowder in the existing polishing liquid is easy to scratch the silicon carbide wafer and cause the wafer to be scrapped due to the presence of many large-grained diamonds.

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  • Grinding fluid for processing silicon carbide wafer and preparation method of grinding fluid
  • Grinding fluid for processing silicon carbide wafer and preparation method of grinding fluid

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preparation example Construction

[0027] In the above-mentioned preparation method of the grinding liquid for silicon carbide wafer processing, the diamond micropowder is treated as follows: the diamond micropowder is taken in a dispersant and a suspending agent, water is added to form a two-phase mixture, and the two-phase medium density difference is used for centrifugal separation by centrifugation. The coarse-grained diamond micro-powder is removed separately to obtain the diamond micro-powder with a more concentrated particle size.

[0028] A preparation method of a grinding liquid for silicon carbide wafer processing, specifically comprising the following steps:

[0029] S1, take dispersant and suspending agent and mix, stir to obtain solution A;

[0030] S2, get diamond micropowder and add in solution A, make diamond micropowder disperse in solution A with ultrasonic-assisted pulse stirring, then add deionized water to obtain two-phase mixture A;

[0031] S3. Centrifuge the mixture A, so that the coars...

Embodiment 1

[0034] The diamond lapping liquid is composed of the following components in parts by mass: 0.5 part of diamond micropowder, 0.5 part of fatty acid polyethylene glycol ester, 1 part of oily suspending agent composed of peanut oil and sunflower oil, and 50 parts of deionized water.

[0035] Its preparation method is as follows:

[0036] S1, get the oil suspending agent that fatty acid polyethylene glycol ester is formed with peanut oil and sunflower oil, mix, stir to obtain solution A.

[0037] S2. Take diamond micropowder and add it to solution A, and disperse diamond micropowder in solution A with ultrasonic-assisted pulse stirring, and then add deionized water to obtain two-phase mixture A.

[0038] S3. When the stratification is clearly observed, start the centrifuge to perform multi-layer centrifugation on mixture A, and centrifuge the mixture at a speed of 4000 r / min for 5 minutes, so that the coarse-grained diamond micropowder enters the water phase for separation, and t...

Embodiment 2

[0042] The diamond grinding liquid is composed of the following components by mass: 5 parts of diamond micropowder, 5 parts of glycerol monostearate, 10 parts of sunflower oil oily suspending agent, and 75 parts of deionized water.

[0043] Its preparation method is as follows:

[0044] S1, get glycerol monostearate and mix with sunflower oil, stir to obtain solution A.

[0045] S2. Take diamond micropowder and add it to solution A, and disperse diamond micropowder in solution A with ultrasonic-assisted pulse stirring, and then add deionized water to obtain two-phase mixture A.

[0046] S3. When the stratification is clearly observed, start the centrifuge to perform multi-layer centrifugation on mixture A, and centrifuge the mixture at a speed of 5000r / min for 4 minutes, so that the coarse-grained diamond powder enters the water phase for separation. Coarse-grained diamond particles, the remaining diamond particles with a more concentrated particle size are in the oil phase, ...

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Abstract

The invention relates to a grinding fluid for silicon carbide wafer processing and a preparation method thereof, the grinding fluid comprises the following components by mass: 0.5-10 parts of diamond micro powder, 0.5-10 parts of a dispersant, 1-20 parts of a suspending agent and 50-98 parts of water; during preparation, the diamond micro-powder is taken into the dispersing agent and the suspending agent, water is added to form a two-phase mixture, the diamond micro-powder with coarse particles is separated and removed by utilizing the density difference of two-phase media through centrifugal separation, and the diamond micro-powder with more concentrated particle sizes is dispersed into the dispersing agent and the suspending agent, so that the grinding fluid for processing the silicon carbide wafer can be obtained. In the grinding fluid, the particle size of the diamond micro powder is more concentrated, and the number of coarse particles is far smaller than that of the diamond grinding fluid prepared by a traditional method, so that a silicon carbide wafer is effectively prevented from being scratched by large-particle diamonds.

Description

technical field [0001] The invention belongs to the technical field of silicon carbide processing, and particularly relates to a polishing liquid for silicon carbide wafer processing and a preparation method thereof. Background technique [0002] Silicon carbide wafers are the third-generation semiconductor materials, which play a pivotal role in the field of new energy, communications, and military and national defense. In the processing of silicon carbide wafers, the grinding fluid is an important auxiliary material. [0003] In the preparation process of the grinding liquid, mechanical stirring is usually used to disperse the abrasive in the grinding liquid uniformly. The uniform stirring easily causes the liquid to rotate with the stirring paddle, forming a laminar flow, which cannot form an effective shear force to disperse the abrasive, which is easy to make the grinding liquid in the grinding liquid. The diamond abrasives are agglomerated due to uneven dispersion, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14H01L21/304
CPCC09K3/1463H01L21/304
Inventor 王国钟王奕霖田苗苗
Owner 河南创研新材料科技有限公司
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