Grinding fluid for processing silicon carbide wafer and preparation method of grinding fluid

A technology of wafer processing and silicon carbide, which is applied in chemical instruments and methods, other chemical processes, semiconductor/solid-state device manufacturing, etc., can solve the problems of easily scratched silicon carbide wafers, wafer scrapping, etc., and achieve particle size concentration and uniform dispersion Effect
CN114806502AActive Publication Date: 2022-07-29河南创研新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
河南创研新材料科技有限公司
Publication Date
2022-07-29

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Abstract

The invention relates to a grinding fluid for silicon carbide wafer processing and a preparation method thereof, the grinding fluid comprises the following components by mass: 0.5-10 parts of diamond micro powder, 0.5-10 parts of a dispersant, 1-20 parts of a suspending agent and 50-98 parts of water; during preparation, the diamond micro-powder is taken into the dispersing agent and the suspending agent, water is added to form a two-phase mixture, the diamond micro-powder with coarse particles is separated and removed by utilizing the density difference of two-phase media through centrifugal separation, and the diamond micro-powder with more concentrated particle sizes is dispersed into the dispersing agent and the suspending agent, so that the grinding fluid for processing the silicon carbide wafer can be obtained. In the grinding fluid, the particle size of the diamond micro powder is more concentrated, and the number of coarse particles is far smaller than that of the diamond grinding fluid prepared by a traditional method, so that a silicon carbide wafer is effectively prevented from being scratched by large-particle diamonds.
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Description

technical field

[0001] The invention belongs to the technical field of silicon carbide processing, and particularly relates to a polishing liquid for silicon carbide wafer processing and a preparation method thereof. Background technique

[0002] Silicon carbide wafers are the third-generation semiconductor materials, which play a pivotal role in the field of new energy, communications, and military and national defense. In the processing of silicon carbide wafers, the grinding fluid is an important auxiliary material.

[0003] In the preparation process of the grinding liquid, mechanical stirring is usually used to disperse the abrasive in the grinding liquid uniformly. The uniform stirring easily causes the liquid to rotate with the stirring paddle, forming a laminar flow, which cannot form an effective shear force to disperse the abrasive, which is easy to make the grinding liquid in the grinding liquid. The diamond abrasives are agglomerated due to uneven dispersion, an...

Claims

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