Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

MPCVD carrier and method for depositing diamond coating on surface of cutter

A diamond coating and surface deposition technology, applied in metal material coating process, coating, gaseous chemical plating and other directions, can solve the problem of ineffective deposition adhesion, etc., to improve tool life and cutting efficiency, strong adhesion , the effect of uniform thickness

Pending Publication Date: 2022-07-29
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this application is to provide an MPCVD carrier and a method for depositing a diamond coating on the surface of a tool, which aims to improve the inability to effectively deposit a high-quality diamond coating with strong adhesion, uniform thickness, and continuous compactness at the cutting edge of the existing tool. layers of technical issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MPCVD carrier and method for depositing diamond coating on surface of cutter
  • MPCVD carrier and method for depositing diamond coating on surface of cutter
  • MPCVD carrier and method for depositing diamond coating on surface of cutter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] This embodiment provides an MPCVD carrier and a method for depositing a diamond coating on the surface of a tool, wherein the dimensions of the tool are: length 12.7mm, width 12.7mm, and height 5mm.

[0054] The MPCVD carrier includes a submount with a placement area and a metal enclosure. The size of the placement area is 12.7*12.7mm, and the metal fences are placed end to end around the placement area. The metal enclosure is made of molybdenum. The metal enclosure is square, with a height of 5.6mm and a thickness of 2.0mm. The gap between the metal enclosure and the tool is 0.5mm; the four right angles of the inner wall of the metal enclosure have a chamfered structure with a radius of 1.2mm.

[0055] A method of depositing a diamond coating on a tool surface includes the following steps:

[0056] (1) The silicon nitride tool was sonicated in acetone solution for 10 minutes, and then dried at 50 °C for 20 minutes; then the tool was dry-polished in diamond powder wit...

Embodiment 2

[0061] The difference between Example 2 and Example 1 is that the height of the metal enclosure is 5 mm.

Embodiment 3

[0063] The difference between Example 3 and Example 1 is that the volume ratio of methane and hydrogen in step (3) is 8:50.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Heightaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of microwave plasma chemical vapor deposition, in particular to an MPCVD carrier and a method for depositing a diamond coating on the surface of a cutter. The MPCVD carrier comprises a base station and metal enclosures connected end to end, the surface of the base station is provided with a placing area, and the metal enclosures are arranged on the surface of the base station and surround the periphery of the placing area. When the MPCVD carrier provided by the invention is used for depositing the diamond coating on the surface of the cutter, the continuous and compact high-quality diamond coating with high adhesive force and uniform thickness can grow at the cutting edge of the cutter, so that the strength and wear resistance of the cutting edge of the cutter can be enhanced, the wear failure of the cutting edge is delayed, the service life of the cutter is prolonged, and the cutting efficiency of the cutter is improved; and the state of a cutting area of the cutter can be improved, the robustness of the cutter and the controllability of the quality of the machined surface of a workpiece are improved, the quality and precision of the machined surface of the cutter are guaranteed, and the comprehensive performance of the cutter is improved.

Description

technical field [0001] The present application relates to the technical field of microwave plasma chemical vapor deposition, and in particular, to an MPCVD carrier and a method for depositing a diamond coating on the surface of a tool. Background technique [0002] High hardness (referring to the hardness value over 50HRC) materials are typical difficult-to-machine materials. When using tools to cut high-hardness materials, it is difficult to increase the cutting speed due to the high deformation resistance of high-hardness materials and the increase of tool wear. Therefore, the processing tools are required to have excellent wear resistance. The quality of the cutting tool directly affects the machining accuracy, quality and efficiency of the workpiece material; the cutting integrity and wear failure form of the tool during the cutting process also directly affect the surface quality and dimensional accuracy of the tool. Tool coating technology has now become a key technol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C16/458C23C16/511C23C16/02
CPCC23C16/4581C23C16/511C23C16/0227
Inventor 王晓飞邬苏东任富增赵予生
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products