Heterojunction PIN diode based on P-type gallium nitride and manufacturing method thereof
A PIN diode and heterojunction technology, applied in the field of microelectronics, can solve the problems of high on-resistance of PIN diodes, difficult preparation of P-type Ga, and high power consumption of devices, so as to improve device performance, promote heat dissipation, and reduce power consumption. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0035] See figure 1 , figure 1 This is a schematic structural diagram of a heterojunction PIN diode based on P-type gallium nitride according to an embodiment of the present invention.
[0036] The heterojunction PIN diode based on P-type gallium nitride includes N-type Ga 2 O 3 Substrate 1, N-type Ga 2 O 3 Epitaxial layer 2 , P-type GaN layer 3 , several P-type GaN regions 4 , N-region ohmic contact region 5 and P-region ohmic contact region 6 .
[0037] Among them, N-region ohmic contact region 5, N-type Ga 2 O 3 Substrate 1, N-type Ga 2 O 3 The epitaxial layer 2 and the P-type GaN layer 3 are stacked in this order. Several P-type GaN regions 4 are distributed on the P-type GaN layer 3 , and the doping concentration of the several P-type GaN regions 4 is greater than that of the P-type GaN layer 3 . The P-region ohmic contact region 6 covers the P-type GaN layer 3 and the surfaces of several P-type GaN regions 4 .
[0038] Specifically, the plurality of P-type GaN...
Embodiment 2
[0050] On the basis of Example 1, please refer to image 3 and Figures 4a-4e , image 3 A schematic flowchart of a method for preparing a heterojunction PIN diode based on P-type gallium nitride provided by an embodiment of the present invention, Figures 4a-4e This is a schematic process diagram of a method for fabricating a P-type gallium nitride-based heterojunction PIN diode according to an embodiment of the present invention.
[0051] The preparation method of the heterojunction PIN diode based on P-type gallium nitride includes the steps:
[0052] S1, in N-type Ga 2 O 3 N-type Ga is grown on one side of substrate 1 2 O 3 Epitaxial layer 2, see Figure 4a .
[0053] First, for N-type Ga 2 O 3 Substrate 1 undergoes standard cleaning. Then, the cleaned N-type Ga 2 O 3 The substrate 1 is placed in a metal-organic chemical vapor deposition (Metal-organic Chemical Vapor Deposition, MOCVD) equipment, and the flow rate of trimethylgallium TMGa is 5.0×10 -6 ~9.0×10...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


